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Conquer Electronics Thin Film Chip Fuse Introduction

Conquer Electronics Thin Film Chip Fuse Introduction. 現行市場 SMD fuse 製程種類. Thin Film Process Ceramic substrate  Conquer , Sart, Vishay PCB substrate  Littelfuse Thick Film Process Ceramic substrate  Bussmann Injection molding  KOA LTCC Fuse  AEM (SolidMatrix) , Conquer.

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Conquer Electronics Thin Film Chip Fuse Introduction

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  1. Conquer ElectronicsThin Film Chip Fuse Introduction

  2. 現行市場SMD fuse製程種類 • Thin Film Process • Ceramic substrate  Conquer, Sart, Vishay • PCB substrate  Littelfuse • Thick Film Process • Ceramic substrate  Bussmann • Injection molding  KOA • LTCC Fuse AEM(SolidMatrix), Conquer

  3. Thin Film：Ceramic Type Process Conquer 12, 06, 04 series Vishay MFU series KOA, Sart, AVX

  4. Thin Film：PCB Type Process Littelfuse 466, 467, 468 series Drawing Not to Scale marking PCB substrate Cu element Protect layer *Element on PCB substrate surface

  5. Thick Film：Printing Process Bussmann 3216FF, 1608FF *Element on Ceramic substrate surface

  6. Conquer ElectronicsSurface Mount Thin Film Chip Fuse

  7. 薄膜晶片保險絲 • 黃光微影製程配合電鍍技術，線路製作精緻。 • 產品特性可精準控制。 • 特殊開發之防爆隔絕層與聚熱層也可確保熔斷特性。

  8. Chip Fuse Specifications

  9. L W 0402 0603 1206 T Chip Fuse Dimensions Unit : mm

  10. Electrical Characteristics CF series(Very Fast-Acting Fuse Series) CT series(Time Lag Fuse Series )

  11. Temperature De-rating Curve • Ambient temperature on current-carrying capacity. • For circuit ,current rating shall be derated in accordance with the figure.

  12. 1206 Applications and Ratings

  13. 0603 Applications and Ratings

  14. Start 薄膜晶片保險絲生產作業流程圖Thin Film Chip Fuse Production Process Flow Chart 正面印刷矽膠平坦層 Silicon Printing 背面印刷低溫銀膠 Backside Silver Resin Printing 電鍍銅,錫與蝕刻 Electroplate Copper, Tin & Etching 壓膜光阻與曝光與顯影 Press Photoresist & Optical Lithography 濺鍍鈦鎢與銅 Sputtering TiW/Cu 此二層為功得開發之防爆材料 印保護層,印字,折條與折粒 Marking Printing, Snap wicker & granule 滾鍍銅,鎳,錫 Roll electroplate Copper, Nickel & Tin 測試與包裝 IPQC & Packing

  15. Chip Fuse Materials Outside electrode Inner electrode Tin layer Nickel layer Copper layer 12CF Insulating layer Ceramic substrate & Silicon layer Marking layer

  16. Chip Fuse Multi-Layer Structure Marking layer Epoxy layer Element layer Silicon layer Ceramic Substrate Electrode *Drawing Not to Scale

  17. Taping Diameter Unit : mm

  18. Reel Dimensions Unit : mm

  19. CF & CT Label Product name & number Product name & number

  20. Reflow Profile Reference : IPC-JEDEC J-STD 002B

  21. Test Circuit Board Test Circuit Board Reference Dimensions Unit : mm 1206 0603

  22. Peeling Force (EIA-481-1A) • Peel-off forces are 0.1 N to 1.0 N (10 grams to 100 grams • calibrated scale reading) for 8 mm tape at a peel-off • speed of 300 mm ± 10 mm/minute. • The peel-off angle should be between 165° and 180°. Angle: 0~15∘ Standard: 10 ~100 grams

  23. Product Characteristics & Reliability Tests

  24. Storage Conditions & Shelf Life • The Maximum ambient temperature shall not exceed 40°C. • The Maximum relative humidity recommended for storage is 70%. • 1 years from manufacturing date

  25. Approval by • UL JDYX8. E82636Fuses, Supplemental Certified for Canada - Component

  26. Interrupting Rating Photograph (X-ray) 200% rating current 1000% rating current DC 50A 63V AC 50A 32V

  27. Consumer Electronics Network Communications Personal & Portable Computing Office Machines Industry System Application

  28. Manufacturing Country & City • CONQUER ELECTRONICS CO., LTD. ( Taiwan – WuGu ) • Tel: 886-2-89902189 • Fax : 886-2-89902577 • RD Center

  29. Thanks for your attention!!

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