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Thin Film Encapsulation For Flexible Electronics 2015-2025:

A large opportunity lies in the development of devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use. In order for flexible displays and photovoltaics to be commercially successful, they must be robust enough to survive for the necessary time and conditions required of the device. This condition has been a limitation of many flexible, organic or printable electronics. This highlights the fact that beyond flexibility, printability and functionality, one of the most important requirements is encapsulation as many of the materials used in printed or organic electronic displays are chemically sensitive, and will react with many environmental components such as oxygen and moisture. To Read Complete Report with Toc: http://www.marketresearchreports.biz/analysis/223424

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Thin Film Encapsulation For Flexible Electronics 2015-2025:

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  1. ThinFilmEncapsulationForFlexibleElectronics2015-2025: Technologies,Markets,Forecasts Alargeopportunityliesinthedevelopmentofdevicesinaflexibleform factorthatcanoperatewithoutdeteriorationinperformance,allowingthem tobemorerobust,lightweightandversatileintheiruse.Inorderfor flexibledisplaysandphotovoltaicstobecommerciallysuccessful,theymust berobustenoughtosurviveforthenecessarytimeandconditionsrequired

  2. ofthedevice.Thisconditionhasbeenalimitationofmanyflexible,organicofthedevice.Thisconditionhasbeenalimitationofmanyflexible,organic orprintableelectronics.Thishighlightsthefactthatbeyondflexibility, printabilityandfunctionality,oneofthemostimportantrequirementsis encapsulationasmanyofthematerialsusedinprintedororganicelectronic displaysarechemicallysensitive,andwillreactwithmanyenvironmental componentssuchasoxygenandmoisture. ToReadCompleteReportwithToc: http://www.marketresearchreports.biz/analysis/223424 Thesematerialscanbeprotectedusingsubstratesandbarrierssuchasglass andmetal,butthisresultsinarigiddeviceanddoesnotsatisfythe applicationsdemandingflexibledevices.Plasticsubstratesandtransparent flexibleencapsulationbarrierscanbeused,buttheseofferlittleprotection tooxygenandwater,resultinginthedevicesrapidlydegrading.

  3. Inordertoachievedevicelifetimesoftensofthousandsofhours,waterInordertoachievedevicelifetimesoftensofthousandsofhours,water vaportransmissionrates(WVTR)mustbe10-6g/m2/day,andoxygen transmissionrates(OTR)mustbe<10-3cm3/m2/day.ForOrganic Photovoltaics,therequiredWVTRisnotasstringentasOLEDsrequirebut stillveryhighatalevelof10-5g/m2/day.Thesetransmissionratesare severalordersofmagnitudesmallerthanwhatispossibleusingany conventionalplasticsubstrate,andtheycanalsobeseveralordersof magnitudesmallerthanwhatcanbemeasuredusingcommonequipment designedforthispurpose. is BrowseFullReportWithToc:http://www.marketresearchreports.biz/analysis- details/thin-film-encapsulation-for-flexible-electronics-2015-2025-technologies- markets-forecasts

  4. Forthese(andother)reasons,therehasbeenintenseinterestindevelopingForthese(andother)reasons,therehasbeenintenseinterestindeveloping transparentbarriermaterialswithmuchlowerpermeabilities,amarketthat willreachover$550millionby2025. TableofContents 1.SCOPE 2.BARRIERTECHNOLOGYREACHINGMATURITY-COMMERCIALIZATION STATUS. 2.1.Trendwithinmajordisplaycompanies 2.1.1. 2.1.2. 2.1.3. Samsung LG Others 2.2.TFEvs.BarrierLamination 2.3.MLbarrieronFlexiblePlasticsvs.FlexibleGlass.

  5. 2.4. 2.5. 2.6. Singleormulti-layer? Flexiblesubstratehandling Atomiclayerdepositionpresentandfutureoutlook/market share 3.INTRODUCTIONTOENCAPSULATION 4.SURFACESMOOTHNESS-DEFECTS 4.1.Importantconsiderationsofsurfacesmoothness 4.2.MicroDefects 4.2.1. 4.2.2. 4.2.3. Pinholes-particles Smoothness/Cracks-Scratches Nanodefects ClickHereToDownloadDetailReport: http://www.marketresearchreports.biz/sample/sample/223424

  6. 5.BARRIERTECHNOLOGIES:PASTDEVELOPMENTS 5.1.Vitex 5.2.GE 6.ADVANCESINBARRIERMANUFACTURINGPROCESSES 7.BARRIERADHESIVES 7.1. 7.2. 7.3. 7.4. DELO tesa 3M Henkel

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