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9 MEMS Commercial Packages, Materials, and Equipment

MEMS MOEMS Nano. Workshop. 9 MEMS Commercial Packages, Materials, and Equipment. Ken Gilleo PhD ET-Trends LLC. 84%. Commercial Suppliers. Commercial suppliers are emerging Large packaging foundries; e.g., AMKOR Smaller specialized; e.g.; RJR Polymers Start-ups; e.g., Hymite, Silex

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9 MEMS Commercial Packages, Materials, and Equipment

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  1. MEMS MOEMS Nano Workshop 9 MEMS Commercial Packages, Materials, and Equipment • Ken Gilleo PhD • ET-Trends LLC 84%

  2. Commercial Suppliers • Commercial suppliers are emerging • Large packaging foundries; e.g., AMKOR • Smaller specialized; e.g.; RJR Polymers • Start-ups; e.g., Hymite, Silex • Packages • Standard • Modified standard • Full custom

  3. RJR MEMS Packaging • Cavity ; “Free Space” or “Head Room” • sometimes isolated from the environment or not • Minimized stress, especially for sensors • Controlled internal environment • dry and non-contaminating • no reactive organics • Or access as required: • Gas/air -Liquids -Solids • Energy beams; e.g. light for MOEMS • Biological agents

  4. Quantum Leap Packaging • Molded plastic cavity type; LCP • Process is plastic injection molding • Metal lead frames (MLF) are insert-molded • Lid seal is ultrasonic or adhesive • Passes He leak test • Handles up to 500oC; highest of any plastics

  5. QLP MEMS Package LCP Lid Package looks like over-molded after sealing Ultrasonic Seal Air Cavity for device MLF Insert molded with LCP Base with exposed pad

  6. HyCap® for MEMS • Hermeticity exceeds MIL 883F • Controlled atmosphere, vacuum • Particle free • TCE matched to silicon • Thin 0.1 - 0.4mm • SMT and/or wirebondable • Wafer level process • Low cost

  7. HyCap® for MEMS Hermetic AuSn sealing ring MEMS HyCap® El. contact PCB SMD-contact µ-Via

  8. HyCap® Silicon Based Packages side Chip SMT side Electrical connection Headroom for MEMS µ-Vias Solder bumps for chip contact AuSn sealing ring SMT-solder bumps

  9. HyCap® S – deep cavity package • Cavity (>250 µm) and small footprint (down to 1x1 mm2) • No thermo-mechanical stress • Reduced MEMS overhead (smaller die size) • Wafer level assembly and testing • Controlled atmosphere (gases, vacuum, getter)

  10. Silex MEMS Package • Silicon body & lid • Uses unique TSV • Conductors are doped Si plugs • Hermetic • May not be suitable for RF (vias higher Ωthan Cu) DRIE via with plug;

  11. Silex cont. Micro-mirror with integrated package

  12. Kyocera Kyocera offers ceramic cavity packaging for MEMS: Kyocera is cooperating with Coventor (CoventorWare). This enables MEMS device designers to simulate the behavior of their device within the package during the development phase.

  13. Amkor Amkor packages MEMS in a variety of packages for air bag and rollover detection sensors for automotive applications. Amkor has developed several technologies including wafer level protected MEMS, capped MEMS and several types of molded packages. Amkor also overmolds MEMS devices capped by fabs

  14. Samsung

  15. Samsung cont.

  16. Session Summary • Billions spent on MEMS devices (especially in USA) • Not enough invested in MEMS package R&D • Custom requirements limit commercial products • MEMS OEMs forced to invent their package • These packages are not always optimum • MEMS packaging industry is evolving • Semi-standard packages are a starting point

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