TEM/TPS MRR Part 2

1. Gamma-ray Large Area Space Telescope TEM/TPS MRR Part 2 GLAST Large Area Telescope: B. Estey, Production SLAC esteyb@slac.stanford.edu (650) 926-8531

2. Parts, Materials, and Processes • EEE Parts • All EEE parts have been approved for use by the Program Parts Board • Status of TEM Parts Qualification (highlighted yellow items=part approved, not in use):

3. Parts, Materials, and Processes • EEE Parts • Status of TEM Parts Qualification , cont’d (highlighted yellow items=part approved, not in use):

4. Parts, Materials, and Processes • EEE Parts, cont’d • Status of TPS Parts Qualification (highlighted yellow items=part approved, not in use):

5. Parts, Materials, and Processes • EEE Parts, cont’d • Status of TPS Parts Qualification, cont’d (highlighted yellow items=part approved, not in use):

6. Parts, Materials, and Processes • EEE Parts, cont’d • Status of TPS Parts Qualification, cont’d (highlighted yellow items=part approved, not in use):

7. Parts, Materials, and Processes • Materials • All Materials have been approved by the Program MPRB in accordance with LAT-SS-00107, LAT Mechanical Parts Plan • GLAST/LAT Material Usage Agreement #002 (MAR DID No. 313; LAT Document # LAT-TD-04756-01)- Approved 9/13/04 • Processes • All processes have been reviewed and approved by the Program MPRB in accordance with LAT-SS-00107, LAT Mechanical Parts Plan

8. Procurement Status • Assembly Subcontractor • GTC Corp. was awarded the contract to provide the assembly service and some environmental testing for all levels of the TEM/TPS (Reference LAT-PS-03078, SOW LAT TPS and LAT-PS-02615, SOW LAT TEM) • GTC Corp. is located in Albuquerque, New Mexico • EEE Parts • All EEE parts are SLAC furnished and have been procured for the TEM and TPS • Outstanding receipt of Novacap Capacitors expected 9/16/04 • Part no. 1210B563K251YHTM • Outstanding receipt of balance of tantalum capacitors expected 9/20/04 • Part nos. CWR11FH475KDB and CWR11FH105KDB • Metal Fab Parts and Fasteners • All Metal Fab parts and Fasteners are SLAC furnished and have been procured for the TEM and TPS • Outstanding receipt of TPS Box Bases, LAT-DS-00995 expected 9/16/04 • Outstanding receipt of TEM Connector Plates, LAT-DS-01026, expected 9/17/04 • Outstanding receipt of balance of Heat Sinks, TPS, LAT-DS-04101, expected 9/24/04 • Outstanding receipt of balance of Cable Harness Support, TPS, LAT-DS-03598, expected 9/24/04 • PWBs • The PWBs for TEM and TPS are SLAC furnished and have been contracted to DDI • Fabrication complete on Qual + 2, balance of PWBs to be fabricated pending successful data review of TEM and TPS Module performance

9. Procurement Status • FPGA Programming • Programming of the FPGAs has been contracted to ACTEL • Programming complete on Qual + 2, balance of FPGAs to be programmed pending successful data review of TEM and TPS Module performance • Materials • Assembly materials are furnished by GTC Corp. in accordance with drawing requirements (adhesives, conformal coating, wire, primer, etc.)

10. Manufacturing Facilites • Assembly contract has been awarded to General Technology Corporation, located in Albuquerque, New Mexico • Capabilities Overview • DS/Multilayer PC Boards assembled to Mil-Spec • Thru-hole and Surface Mount Technology (SMT) • Electro/mechanical Assembly • Cables and Harnessing • Conformal Coating • Testing (Including ESS) • Facilities Overview • 72,000 ft2 Custom Built Manufacturing Facility • TEM/TPS assembly and test to be performed in an environmentally controlled area with monitoring capabilities for temperature and relative humidity • Facility complies with the ESD control requirements specified in ANSI/ESD 20.20-1999 • Manufacturing • Engineering • Test • Stockroom • Administration • Certifications • GTC performs to the intent of the following certifications assuring quality assembly • MIL-STD -2000A • IPC-A-610C • IPC/WHMA-A-620 • MIL-STD-454 • IPC/EIA J-STD-001C • MIL-I-45208 • ISO 9002

11. Manufacturing Process Flow- GTC • Materials notes • Receiving inspection will be performed on all materials supplied by the customer using documents supplied • All discrepancies shall be documented and relayed to the customer in 24 hours from their discovery • All moisture sensitive materials used in the manufacturing of the TEM will be stored and handled in accordance with GTC-2025A -Moisture Sensitive Component Handling, Use of Dry Room Storage. • Materials issued in the production of TEM/TPS for assembly will be traced in a manner that would enable traceability from the assy S/N to the individual part /piece and production lot/date code. • Every TEM and TPS assembly will have its own traveler issued to facilitate traceability of IC serial numbers installed on that particular CCA.

12. Manufacturing Process Flow-GTC • Materials Inspect Receive KIT Not OK Contact SLAC/ Resolve issue OK Clean and bake PCB Issue Kit To prod.

13. Manufacturing Process Flow-GTC • SMT area notes • Operators will record all IC serial numbers and location at which they are installed on a particular CAA for traceability purposes. All IC’s used in the production of TEM assemblies are serialized. • Operators will inspect and measure the solder paste height on every print at 3 predetermined locations. The results will be recorded in the SMT printer log along w the printing parameters

14. Manufacturing Process Flow-GTC Inspect/ Measure • SMT Production Area Set Up P&P and SP Screen print Solder side Inspect Kit OK Not OK Clean 1st art. Inspection Inspect OK P&P all SMT components Reflow Contact SLAC Correct root cause Not Ok ok Clean Not OK Touch up

15. Manufacturing Process Flow-GTC • Second Operations Inspect Install connectors Solder connectors OK Not OK Touch up Clean Contact SLAC MRB Move to test

16. Manufacturing Process Flow-GTC • CCA Test Pass Pass Stake HW & components Touch-up Functional test Fail ICT Top/Bt Fail Touch up Contact SLAC MRB

17. Manufacturing Process Flow-GTC • Module assy/conformal coating/thermal cycling CCA level Thermal cycling No Touch up Conformal coat Contact SLAC MRB Functional test OK Apply Kapton to Back side of CCA Inspect Conformal coat. Apply thermal Adhesive And mount CCA in Chassis base Move to next op.

18. Manufacturing Process Flow-GTC • Module Level Test Vacuum de-gas Adhesive cure Install chassis Top cover Inspect ok Stake HW Functional test Module Assy level Thermal Cycling Contact SLAC MRB no Functional test Move to next op.

19. Manufacturing Process Flow-GTC • Top assembly/final test/final inspection Assemble TEM/TPS Stake HW Functional Test Top Assy level Thermal Cycling Source inspection &EIDP review Functional test Vibration test Final functional test Pack & ship to SLAC

20. Configuration Management • Required changes to documentation during the manufacturing phase at GTC will be immediately documented on an NCMR and forwarded to SLAC for disposition • All outstanding changes to documents will be incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing level (CCA, Module, Top Assembly)

21. Configuration Management • All change notices will include full disposition of hardware Disposition of Hardware

22. GTC Test Requirements Figure 1. Vibration Levels, Duration, and Spectra

23. GTC Qualification and Acceptance Test Matrix

24. Production Schedule

25. Production Schedule

26. Production Schedule

27. Issues/Concerns • Actel FPGAs pose a reliability concern • Maxim 724 is rated at 2.6-32.0V, we are biasing to operating at 1.5V. Parts were not screened for this application, PCB reviewing screening requirements.