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GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software Status Sept 20, 2004 Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu

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GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software Status Sept 20, 2004 Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu (650) 926-4257

  2. Contents • Overview • Hardware • Tower Electronics Module (TEM) • TEM ASIC’s • Tower Power Supply (TPS) • Power Distribution Unit (PDU) • Global Trigger-ACD-Signal Distribution Unit (GASU) • Spacecraft Interface Unit (SIU)/Event Processor Unit (EPU) • Heater Control Boxes/Harness • Flight Software • Test-Stands • Testbed

  3. LAT Electronics FSW is an integral part of the data acquisition (DAQ) subsystem and is managed, budgeted, and scheduled as part of the DAQ subsystem TKR Front-End Electronics (MCM) ACD Front-End Electronics (FREE) TKR CAL Front-End Electronics (AFEE) 16 Tower Electronics Modules & Tower Power Supplies CAL Global-Trigger/ACD-EM/Signal-Distribution Unit* 3 Event-Processor Units (EPU) (2 + 1 spare) • Event processing CPU • LAT Communication Board • SIB Spacecraft Interface Units (SIU)* • Storage Interface Board (SIB): Spacecraft interface, control & telemetry • LAT control CPU • LAT Communication Board (LCB): LAT command and data interface Power-Distribution Unit (PDU)* • Spacecraft interface, power • LAT power distribution • LAT health monitoring * Primary & Secondary Units shown in one chassis

  4. TEM/TPS Mounted to CAL LAT GRID with 16 CAL/TEM/TPS Modules TKR not shown CAL TEM & TPS TEM TPS

  5. Tower Electronics Module EM Tower Electronics Module (TEM) before coating/staking • Main DAQ module, one on each tower • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics • Zero-suppresses CAL event data • Buffers events in cable ASIC FIFO’s • Assembles CAL and TKR event fragments to tower event • Transmits data to GASU • Contains monitoring and low-rate science circuits • LVDS interface to front-end electronics and GASU GTCC1 & GCCC1 ASICs TEM Assembly • Status • Close to 60 TEM & TPS assemblies in the field used as EGSE for CAL, TKR, DAQ, FSW, I&T • All flight drawings released • Flight PCB’s fabricated • All enclosures fabricated • One flight PCB loaded at SLAC with flight-lot components for testing over parameter space; passed tests • Flight assembly contract in place • All components kitted and sent to assembler last week • Expect three assembled (Qual, Tower A, Tower B) enclosures at SLAC in November • Balance of flight production 2/05

  6. TEM ASIC’s • Two ASICs on the TEM • GLAST Tracker Cable Controller (GTCC) ASIC • GLAST Colorimeter Cable Controller (GCCC) ASIC • Function • TEM interface to tracker MCM’s or Calorimeter AFEE’s • Configuration and readback data • Trigger and event data handling • Data reformatting • Event buffers • First prototype design of both ASICs was production version • GTCC1’s • 398 tested • 384 good (96% yield) • 384 burned in, no failures (need 176 for TEM’s) • 192 flight GCCC1’s burned in, tested, no failures (need 88 for TEM’s) • GCCC1’s • 203 tested • 192 good (95% yield) • 192 burned in, no failures (need 88 for TEM’s) LVDS IO CORE FIFO GTCC1

  7. Tower Power Supply EM Tower Power Supply (TPS) before coating/staking • Tower Power Supply module, one on each tower • Input 28V • Generates low-noise voltages for • TKR (2.65V analog, 2.65V Digital) • CAL (3.3V analog, 3.3V digital) • TEM (3.3V and 2.5V digital) • TKR Bias (20V-140V programmable) • CAL (20V to 90V programmable) • Temperature sensors TPS Assembly • Status • Same as TEM since TEM/TPS are produced as modules

  8. Power Distribution Module (PDU) • Primary and redundant boards in one enclosure • Function • Receives 28V from spacecraft • Power conditioning • Contains switches to turn-on/off 16 TEM’s and 3 EPU’s • Monitoring of LAT temperatures • 5 PDU assemblies in the field used as EGSE for DAQ, FSW, I&T • All flight drawings submitted for review/release • Flight PCB’s requisition and PDU assembly Statement-of-Work in progress • All components ordered • Start of assembly planned for November • Delivery of Flight PDU 3/05 EM PDU (before harness routing) PDU Assembly

  9. GASU • Primary and redundant GASU DAQ and GASU Power Supply boards in one enclosure • Function • Global Trigger • Event-Builder • Signal Distribution/Fan-out/In • ACD Electronic Interface • 15 GASU assemblies in the field used as EGSE for ACD, DAQ, FSW, I&T • Flight PCB’s requisition and GASU assembly Statement-of-Work in progress • All components ordered • Start of assembly planned for December • Delivery of Flight GASU 3/05 EM GASU (before harness routing) Power Supply DAQ board GASU Assembly

  10. SIU/EPU EM SIB • 3 EPU’s (2 Primary/1 Redundant) & 2 SIU’s (Primary/Redundant) • Difference is • SIB in SIU has MIL1553 communication components to spacecraft loaded • Start-up boot code loaded in CPU is different from SIU and EPU • 5 cPCI SIU/PDU assemblies in the field for DAQ, FSW, I&T • Enclosure • PCI Backplane • Crate Power Supply Board • Storage Interface Board (SIB) • LAT Communication Board (LCB) • BAE Processor Board • Mechanical flight drawings released • Electrical flight drawings almost ready for review/release • All components ordered • Start of assembly planned for December • Delivery of Flight SIU/EPU 3/05 SIU/EPU Crate Assembly

  11. Heater Control Box and Harness • Heater Control Box • Function • Turn on/off power to VHCP heaters via SIU supplied control signals • Engineering Module used on ISIS and Testbed • Flight drawings in sign-off • Harness • Function • Interconnects electronics modules in LAT • Interface to spacecraft • Drawings in sign-off • Contract to be placed in 10/04

  12. Flight Software (FSW) • FSW is an integral part of the data acquisition (DAQ) subsystem • > 3 million configuration bits to configure system and to take event data properly • Majority of software is to configure & setup hardware (boot, TKR, CAL, ACD, DAQ trigger, event-builder, sub-system setup, etc) • Rest is filtering, data monitoring, health & safety, telemetry • FSW development follows an iterative model • Functionality is developed and tested against available Hardware • Incremental builds with more functionality • Major builds • EM1: supports single tower, single CPU (e.g. TEM-based test-stations) • EM2: supports multi-tower or GASU/ACD, single CPU (GASU-based test-stations, partial test-bed) • FU (Flight Unit): supports multi-tower, multi-CPU (full test-bed, LAT)

  13. FSW Releases • In addition to regular builds, FSW must provide two formal releases • ISIS (Instrument Spacecraft Interface Simulator) Build & Release • An integrated FSW and hardware package provided to Spectrum Astro (the Spacecraft manufacturer) to allow Spectrum to conduct integration work • The ISIS FSW supports:1553 command delivery, ancillary/attitude/time tone command processing, boot process and boot commands for SIU, science data interface, all telemetry types, and other functionality • Full LAT Build & Release • Complete set of 16 towers, GASU, full set of CPU’s • Used as test-bed for hardware and software development & test • To be delivered to I&T for full-LAT testing (Formal Release)

  14. FSW Layer Model (Post Boot) Applications Layer Charge Injection Calibration (LCI) Spacecraft Messages(LSM) Instrument Physics (LPA) Diagnostics Framework(LDF) Thermal Control(LTC) Instrument Manager(LIM) Watchdog(LSW) Housekeeping(LHK) File/Object(LFS) Abstract Communication Layer Basic Services Inter-task Communications System (ITC) Service Layer Command and Telemetry/1553 Service (CTS) LCB Service(LCS) Driver Layer 1553 Driver (CTDB) LCB Driver (LCBD)

  15. FSW Status • Flight Unit level coding is underway • FU peer review was held September 16, 04 http://www.slac.stanford.edu/exp/glast/flight/web/FSW_home.shtml • Development, Unit Test, Low-Level Integration During CYQ4 • Builds produced as needed to support I&T • SW Test Scripts underway, completion February 2005 • Dry runs of qualification tests start in January 2005 • Then, following a TRR, Formal Qualification Testing (FQT) begins April 2005 • FQT period ends 4/30/05

  16. EGSE: TEM-based Test-stands LCB: LAT Communication Board Transition-card: Trigger Module • Processor: Motorola Power-PC • Flight Software • PMCIA LAT Communication Board for • LAT Communication • Transition Board • Trigger • TEM DAQ Assembly • TEM Power-Supply Assembly • 28-V Supply Power-PC Processor Flight Software TEM DAQ Assembly Tower Power Supply Assembly (1.5V/2.5V/3.3V/ 0-100V/0-150V) 28-V Power Supply

  17. Test-Stand Summary • Includes TEM-based and GASU-based test-stands • Outstanding • 2 TEM/TPS for CAL • PDU’s for I&T

  18. Instrument Spacecraft Interface Simulator Heater Controls/Loads PDU GASU PDU Load Box Crate Tester Power Supply SIU Crate • (Shown before installation in rack) • ISIS to be delivered to Spectrum Astro as LAT simulator • Delivery in October • Contains • SIU • GASU • PDU with loadbox • Heater control box with load box • Flight Software

  19. Testbed • The Testbed is a complete “flight-like” Trigger and Dataflow system with simulated front-end inputs. • Purpose of the Testbed • Validate the Level 3 Filter • Validate Flight Software • Validate Trigger and Dataflow System • Eventually, passed to ISOC • Can be used to test on orbit scenarios • The testbed is the only place where all parts of the T&DF system are assembled in a test environment • The last line of defense for catching system-level problems • Status: assembled, tests are in progress

  20. The LAT Testbed (-z) 1 of16 TEMs EPU External Crate PDU SIU Power Feeds GASU RF Shield 1 of 2 Heater Loads 1 of 2 Heater Controls

  21. The LAT Testbed (+z) 16 TKR FES 16 CAL FES 8 ACD FES 1 Control FES 16 Tower Loads 11 FES Control PCs

  22. Issues • ACTEL FPGA’s (on TEM/GASU/PDU/DIB/LCB) • Investigations on-going into failures on MEC fabrication line. Considering using new UMC fabrication line FPGA’s instead (decision in November) • EEPROM (on SIB/CPU) • Investigations on-going into failures in EEPROM components • Have software work-around for SIB • Decision whether to use PROM on BAE RAD750 board instead of EEPROM by November 1 • ESD Sensitivity • ASIC’s have higher sensitivity (about 200V HBM) than desired. Need good ESD-sensitive handling

  23. Summary • TEM and TPS are in flight assembly • Rest of DAQ will be in flight assembly within 12 weeks • Software is working on flight unit release • Instrument Spacecraft Interface Simulator will be deliver to SC vendor next month • LAT Testbed assembled and in test

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