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SENS-IT. SENS-IT Small Electronic Network Sensor Integrity Tool. Development of a Low-Cost Permanently Installed Microelectronic Wireless Monitoring System for Process Plant 23 February 2005. Summary Project Details. Scope
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SENS-IT SENS-ITSmall Electronic Network Sensor Integrity Tool Development of a Low-Cost Permanently Installed Microelectronic Wireless Monitoring System for Process Plant 23 February 2005
Summary Project Details • Scope • Development of a Low-Cost Permanently Installed Microelectronic Wireless Monitoring System for Process Plant • Benefit • Improved monitoring techniques leading to lower operational costs, improved QHSE, more reliable information for increased integrity management, and zero loss of containment. • Duration: 34 months • Total Cost: €3.14m • EC Funding: €1.7m • Balance of Funding: Project Partners
Progress to date • Oct 02 - Project Start • Mar 03 - Development of Functional Specification • Oct 03 - Detailed Operational and Interface Specification • Dec 03 - Paper design • Mar 04 - Project interim stage reached • Partners agree to continue project to conclusion • Apr 04 - Technology Demonstrator system designed and built • Apr 04 - Technology successfully demonstrated • Feb 05 - Prototype design on-going • Issues of intrinsic safety being addressed
Areas of work • Sensor development • Piezo-composite sensors • Single and array • Specification, design, characterisation, test and evaluation • Sensor packaging • Manufacture • Microelectronic Interface design & manufacture • Design of drive electronics and pre-amp circuitry • Interface packaging • Miniaturisation
Areas of work • RF interface • Network topology evaluation • Network interface specifications • Choice of communication technologies • Integration of RF • Data acquisition • Software and dataset specification • Power supply • Choice of battery technology • Software & Firmware • Software and dataset specification • Software utility for presentation of results
Achievements: System • Demonstrator unit built • Integrated unit incorporating: • Sensor • Integrated electronic interfaces • Battery technology • Interim software package • (Main software now available)
Achievements: Sensor • Twin crystal design to resolve 4mm wall thickness • Successful integration of probes to driver electronics and production of a signal suitable for wall thickness calculations Demonstration of probe arrays • Low power to comply with ATEX regulations • System can resolve wall thickness changes in a pit defect to within 0.2mm
Achievements: Microelectronics • Miniaturized microelectronic unit consists of: • high speed analogue circuit • digital controller • 8 channel multiplexer / de-multiplexer • all have been fully assembled and tested
Achievements: Miniaturisation • Credit card size micro-electronics interface achieved … • … and working! • Could be made smaller • This considered another development • Compromise on size and intrinsic safety issues
Achievements: Power • Various battery solutions evaluated • Special battery pack • combination of primary / secondary cells implemented • provides high pulse currents throughout the target lifetime of two years • Probably 6 AA cells equivalent • (Due to IS requirements • Power profile reduced by 25% since mid-term position • On-going activity
Achievements: Wireless • Wireless LAN 802.11b compatible (WiFi compliant) • Range: 500m (approx) range line-of-sight • Digital interface for connection to sensor unit • Star-shaped wireless network topologies with the use of central access points • FTP protocol allows communication with the sensor network via web gateway • Dimensions: 80x50x10mm (40cm3) • Temperature range: -20 to +85°C • Power consumption: 600mA at 3.3V (2W) • Solar cell (optional)
Achievements: Software • An intuitive and simple user interface • A robust and effective interface to the communication units • Export/import solutions that will enable effective interface to end-users systems • Efficient and robust interpretation of the ultrasonic signals
Achievements: Summary • Integrated design of a demonstrator unit • Signal output received • It works!
Lessons Learnt … so far! • Issues of sensor characteristics and interfacing electronics • Issues of intrinsic safety • Issues of integration of RF for high speed, low power data links • Low noise, high speed circuit design • System Integration • Importance of working closely with partners
Next Steps • Refine design for system integration and manufacture • Complete ATEX certification at component level • On-going ATEX certification for integrated system • Production and commissioning of prototype • Evaluation testing on site
Programme to Completion Anticipated time for on-site testing
Thank you for listening Any questions?