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CERN PCB workshop activities

CERN PCB workshop activities. Rui de Oliveira on behalf of PCB workshop team. outline. Activity Technologies Resistors MPGD history RD51 collaboration participation Developments Trainings Gallery. A ctivities. 20 persons Building :1000 sqr meters Making PCBs since 1960 -PCB

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CERN PCB workshop activities

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  1. CERN PCB workshop activities Rui de Oliveira on behalf of PCB workshop team

  2. outline • Activity • Technologies • Resistors • MPGD history • RD51 collaboration participation • Developments • Trainings • Gallery

  3. Activities 20 persons Building :1000 sqrmeters MakingPCBssince 1960 -PCB -Rigid -Flex -Flex-rigid -Microvias -fine line (10um) -large size (up to 2m) -Thick film Hybrids -Thin film Hybrids -Chemicalmilling -Cu, Fe, Al, Au, Ag, W, Mb, Ti, Cr, Ni -MPGD -GEM/thinGEM/THGEM/RETHGEM -MSHP/Cobra -MICROMEGA/ Bulk/ Micro-BULK -RES BULK -Resistive MSGC -R&D on new structures -Low mass circuits -Multilayerflexeswithaluminumstrips -embeddedheatsinks (carbon, graphite,metals, diamon) -Embedded components -passive -Active 1.7 Mchf/year turnover + 10% in 2013 6 Mchf equipment

  4. Technologies • In house • All processesrelated to Photolithographytechnics • Chemical and electrochemicalplating • CNC dilling and milling for small pattern • Chemicaletching of metals and dielectrics • Vacuum + high pressure gluing • Screen printing (metal , dielectrics and resistors) • Clean rooms ( class 100 , 1000 and 10000) • Close collaboration withindustry for: • Vacuum deposition ( Metalresistorsdielectrics) • Laser drilling and milling • Plasma etching (RIE) • Large PCBs mass production • Large screen printing mass production • In study • New generationInkjet printers (metalresistorsdielectrics)

  5. Resistors -A Resistor is define by: -Value Ohms -Precision % -TCR ppm/Deg C -max power W or W/m2 -breakdown voltage V -Resistivity in Ohm*m -Sheet resistance or surface resistivity in Ohm/sqr -TCR: Temperature coefficient of the resistor -Cermet: is a composite material composed of ceramic (cer) and metallic (met) materials. Rui De Oliveira

  6. Resistors for static dissipative application available at CERN • Screenprintedpolymers • Filledcavitypolymers • ScreenprintedRuOresistors • DLC vacuum depositedresistors • ResistiveKapton • All of themcanbepaterned

  7. Resistors why carbon? • @ 300 K in (Ω·m) • Silver 16·10-9 (Ω·m) • Ruthenium 71 10-9 (Ω·m) • Germanium 460·10-9 (Ω·m) • Ni/Cr 1000·10-9 (Ω·m) • Carbone 35 000·10-9(Ω·m) Rui De Oliveira

  8. MPGD history ‘96: GEM 50 x 50mm with a gain of 10. ‘97: GEM 100 x 100mm with gain of 1000. ‘98: GEM 400 x 400mm; 1D and 2D readouts; micro-groove and micro-well detectors. ‘00: 3D GEM readout; 1D readout for Micromegasin COMPASS. ‘01: PIXEL GEM readout; 2D Micromegasreadout. ‘03: PIXEL Micromegasreadout. ‘04: Bulk Micromegas detector 100mm x 100mm. Micro BULK detectors ‘06: Half cylindrical GEM detector. ’08: first large GEM 1.2m x 0.4m. First spherical GEM ‘09: first large BULK Micromegas 1.5m x 0.5m ‘11: First resistive Bulk Micromegas 100mm x 100mm ‘12: First 30cm x 30cm NS2 GEM detector ‘12: First 1m2 Resistive Micromegas ‘12: First 2m2 Resistive Micromegas ‘12: First NS2 GEM detector 1.2m x 0.5m ‘12: Full cylindrical GEM detector ‘14: GEM 2m x 0.5m ?? Micromegas 3.4m x 2.2m ??

  9. Participation in RD51 • WG1 :R&D on new structures, wehave introduce: • Bulk Micromega ( with Saclay collaboration) • Resistive protections (with Atlas Collaboration) • Large GEM (with CERN GDD/CMS/INFN Frascati/TUM Munich …) • GEM embedded stretching system NS2 • WG6 :Industrialisation, our contribution: • Companies visits (more than 10) • TT transfer with selected companies • Institutes trainings

  10. Passed developments • Large size GEM • Blind GEM / Micro well • Chemical micro-vias • Bulk Micromegas • Resistive protections in Micromegas detectors • Capacitive couplings to reduce electronic channel count • Piggy Back Micromegas • Micro BULK Micromegas • PG and TPG thermal management devices • Full Aluminium circuits • Embedded active devices in flex

  11. Trainings and TT • GEM production training and TT: • Techtra 2 weeks at CERN + full technology transfer • Xiaomei Li (CIAE Beijing) 1 week at CERN • Tech-etch full technology transfer • Mecaronics full technology transfer • Close to 10 licenced companies • Micromegas production training and TT: • CEA Saclay (BULK and resistive protection) many iterations @CERN • CEA Saclay : BULK facility review @ Saclay • CIREA and ELTOS (BULK and resistive) 2 Days @ CERN + 2 days @ ELTOS + full TT • INFN Frascati (Large Micromegas detector) 2 months @CERN • THGEM production • VECC KolKata (polyurethane protection) 1 day @CERN • Weissmann institute Israel (test and Cleaning) 2 days @CERN

  12. GEM Single mask examples • GEM 1.1m x 500mm • CMS GEM detector GE1/1 • KLOE – Cylindrical 3 GEM Detector • GEM 800mm x 500mm • Read-out 2D : 800mmx 500mm Rui De Oliveira

  13. CMS GE1/1 NS2 detector Rui De Oliveira

  14. Bulk Micromegas examples BULK Technology DUPONT PC 1025 coverlay BOPP Meshes SERITEC stretching Largest size produced: 2m x 1m ILC DHCAL T2K Rui De Oliveira

  15. ATLAS NSW detector opened detector closed

  16. Thank you

  17. Thin film Rui De Oliveira

  18. Thin film WEB SITE: http://www.ohmega.com Rui De Oliveira

  19. Thick film Some supplier can build 100 Mohms/sqr pastes Rui De Oliveira

  20. Polymer resistive pastes 1 Mohms/Sqr seems to be the limit for these polymers Rui De Oliveira

  21. Polymer Resistive foils Rui De Oliveira

  22. Other products Rui De Oliveira

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