1 / 8

IEEE SF Bay Area MEMS & Sensors Chapter

Explore job opportunities in MEMS test engineering at tonight's IEEE SF Bay Area MEMS & Sensors Chapter meeting. Learn about the future of MEMS design and manufacturing from industry expert Stephen R. Breit, PhD of Coventor, Inc. Discover open positions at top companies like Bosch, Fujifilm Dimatix, and Huawei. Plus, gain insights into the essential experience and skills required for roles such as MEMS Development Engineer and ASIC Test Engineer. Submit resumes to janusz@eXoSystems.us for consideration.

dgunter
Download Presentation

IEEE SF Bay Area MEMS & Sensors Chapter

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. IEEE SF Bay Area MEMS & Sensors Chapter August 10th, 2016 meeting

  2. Tonight’s Speaker • The Future of the Commodity MEMS Design and Manufacturing • Stephen R. Breit, PhD • Vice President, EngineeringCoventor, Inc.

  3. Tonight’s Sponsor www.coventor.com

  4. Job Postings • Bosch • Controls Research Engineer • Cepheid – Sunnyvale • Senior Manager, R&D Engineering • COMN3 Systems – Sunnyvale • Mechanical/Material Science Cartridge Design Engineer • Fujifilm Dimatix • MEMS Development Engineer • Process Engineer IV • Technology Integration Manager

  5. Jobs - II • General Motors • Technology and Innovation Analyst • Huawei • Director of Optical Cross-connect R&D • Principal Silicon Photonics Process Integration Engineer • Sr. Engineer, Sensors • Lam Research • Process Engineer – Etch • PARC • Electronic Materials & Hardware Systems • Printed and 3D electronics

  6. Jobs - III • Roche • SR Process Development Engineer • Silicon Microstructures • VP of Sales • SiTime • Semiconductor Reliability FA Engineer • SPEC Sensors • Sr. Process Engineer • Verily Life Sciences • Hardware Systems Engineer, Software Infrastructure

  7. eXo Systems - MEMS Test Engineer Responsibilities will include design and implementation of characterization and test solutions for the ultrasound piezoMEMS medical imager, starting from engineering wafer probe, Lased Doppler Vibrometer and packaged performance characterization, leading to production test system development at MEMS foundries and assembly vendors, as well as developing yield improvement. Experience & Skill Requirements:   Minimum of 5 years MEMS test experience, preferably with ultrasound and motion sensors.   Excellent diagnostic and troubleshooting skills for issues that arise when implementing new test methods for new devices.   Experience with releasing and supporting ATE probe and final test solutions with external test houses preferred.   Excellent communication skills for updating core team members on ATE development status.   BSEE, MSEE preferred.   Qualified candidates, submit resumes to Dr. JanuszBryzek, CEO, janusz@eXoSystems.us.

  8. eXo Systems - ASIC Test Engineer Design, deliver, and support test solutions for complex mixed signal ASIC. Experience with testing ultrasound imager ICs would be a plus. You will develop schematics and direct layout activities for ATE for new ICs. You will also be leading the silicon characterization on the ATE over voltage and temperature. Supporting test activities after release to production will include test yield improvements and test time reductions. Experience with MEMS would be a plus. Experience & Skill Requirements:   Minimum of 10 years test development experience, with 5 years of mixed-signal semiconductor device test experience.   Able to lead the complete precision analog test techniques and measurements ATE development (both HW and SW) for ASIC.   Support post release to production issues including yield enhancements and test time reductions   Specific knowledge of testing interfaces with SPI preferred.   Excellent communication skills for updating core team members on ATE development status.   Excellent diagnostic and troubleshooting skills for issues that arise when implementing new test methods for new silicon   BSEE, MSEE preferred  Qualified candidates, submit resumes to Dr. JanuszBryzek, CEO, janusz@eXoSystems.us.

More Related