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H4 2003 PROGRAM OVERVIEW

H4 2003 PROGRAM OVERVIEW. SYSTEMS TEST IN 2003 H4 SCHEDULE VFE-FE ELECTRONICS IN 2003 H4 SM0 PURPOSE SLIDES FOR DISCUSSION. SYSTEMS TEST in 2003. Proposed to be tested in H4 ( P. Sharp at last ECAL week): - One EB module with FPPA read-out electronics

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H4 2003 PROGRAM OVERVIEW

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  1. H4 2003 PROGRAM OVERVIEW SYSTEMS TEST IN 2003 H4 SCHEDULE VFE-FE ELECTRONICS IN 2003 H4 SM0 PURPOSE SLIDES FOR DISCUSSION WACH4 27-28/11/2002

  2. SYSTEMS TEST in 2003 Proposed to be tested in H4 ( P. Sharp at last ECAL week): - One EB module with FPPA read-out electronics - One EB module with MGPA read-out electronics - EE E0’ (100 channels) with ? electronics (P. Sharp proposed FPPA) Target announced at the last CMS Steering Committee (SC34): - Full SM final system by fall 2003 ! WACH4 27-28/11/2002

  3. H4 SCHEDULE in 2003 • SPS schedule approved by RB on 14th of November: • Proton period: • From May 19th to September 7th • Start with ~1.5 week of 25 ns LHC bunch structure • Normal proton runs: from June 2nd to September 7th • During this period: • 10 ‘normal Wednesday MDs’ (8:00 to 16:00) • 4 ‘long Wednesday MDs’ (one day, from 8:00 Wed to 8:00 Thurs) • Heavy ions period (Indium run): • From September 17th to October 25th • During this period: • 2 normal Wednesday MDs • one long Wednesday MD WACH4 27-28/11/2002

  4. WACH4 27-28/11/2002

  5. H4 SCHEDULE in 2003 • ECAL Memorandum to test beam responsible persons (17/10/02): • Following our discussions during the last ECAL week, a memo has been sent by Paul to our CMS beam coordinator (E.Tsesmelis.), asking for: • Full access to H4 beam area in May and June • Installation of SM by mid-July in H4 • request:8 weeks of beam (mid-July to Sept. 7th; about 48 days of beam, including setting up). It’s roughly the same numbers of days we were given for M0’ in 2002, but setting up much more complex. • Moreover asking also for ~2 extra weeks of electron beam during the Indium run (end September- October) • So in total about 60 days of beam requested for ECAL • Presently no news from SPS coordinator, only the confirmation he received our request, in particular accesses in May-June • Overbooking of beam lines by 30 - 40% announced (proton period). Heavy Ions period not yet discussed. WACH4 27-28/11/2002

  6. READOUT ELECTRONICS • VFE electronics: what I know or suppose • Intersil front-end chip: • FPPA 2nd iteration for EB: • ~ 10 4’’ wafers (~2000 chips) from Intersil by 20th of December 02 at LBL (last informations from P. Denes, but delay still possible !) • if so, 2-3 weeks for new packaging, at least 6 weeks for testing in 2 labs (Lyon, Torino: about 2*50 chips characterized/day) • Supposing a yield of 50%, about 800 good chips, tested andavailable by March • if so, two complete modules can be equipped with FPPA2001 • prototype FPPA VFE boards can be launched as soon as connectics can be designed (fppa2001 board design done, connections drawings waiting for detailed integration scheme) • test VFE boards with FE demonstrator and B11 matrix (from ~ end January, after 1st FPPA chips have been tested) • new kaptons liaisons + motherboard to be studied and built (don’t neglect !) • launch production for SM0 soon after (February) WACH4 27-28/11/2002

  7. READOUT ELECTRONICS • Intersil front-end chip: • FPPA for EE: if FPPA2001 O.K., still a long way to go for EE version (6-8 months, people to do the job?) • needs new metallization (change routing of PA to get right R/C values) • new project for Intersil, new simulations of PA needed ( at the scheme level and at the post layout level …) • no hope to get EE specific FPPA before ~ autumn 03 (?) • E0’ tests in 2003 very likely with EB version if Intersil WACH4 27-28/11/2002

  8. READOUT ELECTRONICS • 0.25 μm Front-end chip: two chips • MGPA 1st version • Design Review beginning of December (CMS week) • Launch fabrication (multi-project wafer) on ~7th of February 03 • Get ~ 400 samples (?, to be confirmed) 10 weeks later : chips available in May • Testing ? Who ? • Easier to adapt to EE specs (shaping and conversion gain by external components) • SADCs 1st version: same schedule as MGPA (same MPW) • Design Review beginning of December (CMS week) • Launch fabrication on 7th of February 03 ? • chip available in May • Testing ? Who in CMS ? • Associated VFE board: • As far as I know, design not yet done (difference with FPPA situation), certainly some iteration(s) needed. Should be discussed during CMS week. Who ? (Torino is candidate) WACH4 27-28/11/2002

  9. READOUT ELECTRONICS • FE boards (Magnus): • First board (demonstrator with FPGA Fenix) ready, under test in B11 • Tests with VFE FPPA 2001 forseen in January-Feb. • Some FE boards (for 400 channels at least) with Xilinx should be ready in Q1 2003 • 1st Fenix Asic (same 0.25 μm MPW as MGPA) available in May and some FE boards with Asic for 400 channels later (if not possible: Xilinx version). WACH4 27-28/11/2002

  10. READOUT ELECTRONICS: Summary • My present understanding (end Nov) to get ready for H4 with new electronics is the following: • Likely enough FPPA to equip one (M4 ?) or even two Modules • ~ 400 channels with 0.25 μm electronics (one Module M3 ?): seems to me extremely tight and difficult ! Need more detailed schedule • Enough FE boards to read-out two Modules ( 36 boards with E0’) • One DCC prototype to read-out one SM with sufficient data-links • LVS and regulators ? What will be available in May-June ? Who ? • Motherboards to be designed and fabricated (two types) • Final Integration/cooling scheme will be defined and prototypes available • Seems to me a veryheavy task ! Remember M0’ preparation ! • An overall schedule is in preparation (with G. M.) WACH4 27-28/11/2002

  11. PURPOSES FOR SM0 IN 2003 • Build final system test, very close to detector SM: • ‘final’ is true in particular for: • monitoring laser system • HV system • VFE-FE electronics: overall concept and components • integration-cooling, new cooling unit for SM • Performances of final electronics before ordering mass production scheduled by fall 2003 (to get ready in 2004) • Extensive tests of VFE chips and associated boards • functionality with capsules • noise, linearity, gains, shapes (laser, particles) • X-talks, sensitivity to environment (correlations) • preparation for good energy resolution • VFE-FE final functionality ? • may be not full functionality, but already a large fraction WACH4 27-28/11/2002

  12. PURPOSES FOR SM0 IN 2003 • Preparation for SMs precalibration in 2004: • Some SMs (~ 9 ?, as much as possible …) planned to be calibrated in 2004 • Purpose is to be ready and fully efficient early in 2004 thanks to the training with SM0 in 2003 • Prepare precalibration methods, protocols, tools: • automatic calib of modules (optimization of auto-scan) • optimize position scan methods studying variation of response vs position (fine, medium, coarse) • quick verification of data quality, fast feedback • experiment and improve software strategy WACH4 27-28/11/2002

  13. PURPOSES FOR SM0 IN 2003 • Study performance of future detector, continue investigations begun with M0’: • Understand new monitoring laser system (complicated system, two or three lights: blue, (green), red + pn electronics etc…), linearity, effects due to flashing a whole module … Need stable conditions and continuity • Stability of the whole system (monitoring runs, pedestals) • Thermal effects, thermal dynamics (are M0’ data sufficient ? New certainly design to test and evaluate) • Variation of responses with eta (different module types: M4, M3): • Energy resolution, energy scans (~10 energies) • Geometry, position measurement (for MC studies) • R factors of several production Xtals, at different (large) eta (irradiations with electrons) • Investigation of various effects discovered with M0’ WACH4 27-28/11/2002

  14. PURPOSES OF E0’ IN 2003 • See Dave’s presentation What is important is to begin a detailed list of what is needed in common for both systems, what can be used by E0’ independantly of SM: - cooling units : yes but Laudas ? - operation with laser ? - LVS - DAQ … - Manpower WACH4 27-28/11/2002

  15. H4 PROGRAM FOR SM0 IN 2003 • - Assembly and tests in June (one or two modules) • Installation of SM0 first half of July: • At least two weeks of setting-up and stabilization ( tight compare to one week for M0’) • alignment of beam hodoscopes, trigger scintillators • alignment of SM0 on beam line (survey) • DAQ improvment study: trigger rates, optimization of recorded events/burst) • cooling stabilization • laser system: in principle already set-up (?) • read-out electronics: • careful ‘de-noising’, help of TIS people • data-links and DAQ debugging • apds gain curves after stabilization (L.Y.) • need stable period for laser monitoring studies • … WACH4 27-28/11/2002

  16. H4 PROGRAM FOR SM0: time estimate • If we are given what we are requesting in proton period, my estimate for beam data is August-beginning of September :~30 effective days, not a lot considering SM program alone ! • Some estimation from Jean’s measurements of improved number of events recorded vs trigger rates. • If we suppose that 10-15 k/S2 are safe for theXtals, we can record about 4000 evts/b (S5 = S2/5 if well tuned = ~3000/b) • One day: ~5000 bursts (conservative but not so much ) • For the autoscan: 2 b/Xtal (our aim is 1b/Xtal), one monitoring run/10 Xtals equivalent of 17 bursts = 5 mn gives about 40 b/row • For one module of 400 Xtals at one energy:~ 1600 b • For two energies (50 and 120 GeV): 3200 b, less than one day • Say order of magnitude: one day for one module scan • For E-scan: 10 energies, how many subsets ? Important for energy resolution (in principle should be good) WACH4 27-28/11/2002

  17. H4 PROGRAM FOR SM0: time estimate • An electron beam program with one or two modules of SM0 can be the following: • - several auto-scans (reproducibility) • - several E-scans on some module subsets (reproducibility) • - some position scans on some regions (one week ?) • - temperature changes à la M0’ for thermal dynamics (one week) • - irradiations of ~20 Xtals at large eta (more than one week) • - … • Seems to me the whole proton period is well occupied WACH4 27-28/11/2002

  18. CONCLUSION Difficult to define now a complete strategy for H4 in 2003 Flexibility needed, depending on the disponibility (and performance) of electronics - More likely: M4 (?, more ?) of SM0 with FPPA, beam in July - what strategy if more electronics arrive later ? - upgrade SM0 ? - equip module(s) of SM1? How to manage SM and E0’ in parallel ? We have to go in more details Strategy should include later period in October Need urgently a kind of beam test task force or test system coordination or whetever to consider all the aspects in great details and manage the test beam roject in 2003. WACH4 27-28/11/2002

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