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BI and CO collaboration proposal

BI and CO collaboration proposal. Greg Daniluk, Lalit Patnaik, Javier Serrano (BE-CO ) based on input from BLM and BPM teams (BE-BI). Goal of the presentation. Take the ideas presented by William Viganò to renovate SPS BLM system and by Michal Krupa to renovate LHC BPM system

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BI and CO collaboration proposal

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  1. BI and CO collaboration proposal • Greg Daniluk, Lalit Patnaik, Javier Serrano (BE-CO) • based on input from BLM and BPM teams (BE-BI)

  2. Goal of the presentation Take the ideas presented by William Viganò to renovate SPS BLM system and by Michal Krupa to renovate LHC BPM system … and propose how these could be adopted into a common Distributed I/O Tier chassis design.

  3. BLM renovation plans based on input from William Viganòand the rest of the BLM team (BE-BI)

  4. List of similarities 19’’, 3U chassis Reliable system Power supply: 230V AC, on/off functions, diagnostics Remote and local diagnostics – very good BLM ideas should be adopted by DIOT crates NanoXplore considered as the main FPGA Timeline

  5. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  6. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  7. Acquisition Crate – Grounding and Bonding William Viganò “BLMSPS – Design Overview”

  8. Grounding schemeproposal Let’s include the idea of William and BLM team to DIOT chassis specification

  9. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  10. Backplane - Characteristics PCB thickness = 2.2mm PCB materials = FR4 Copper thickness = 35µm The draft schematics of the backplane is ready, and with the layout designers support it will be used to optimize the interconnections. The design of the BLEACT including all boards will be done with the CADENCE tool. William Viganò “BLMSPS – Design Overview”

  11. BLM connectors in the backplaneproposal BLECF2 1 4 7 2 5 8 3 6 Use RTM space for application-specific backplane 8 BLM connectors placed in RTM space Free choice of BLECF2 connector The same solution can be used for concentrated LHC BLMs (multiple BLECF2 boards in a single chassis) – signal BNCs from the back . . . . . . . . . . . . . . . .

  12. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  13. Input Power Unit (BLEIPU) - 3D modelling • HV input connector • 230 VAC Inlet/Outlet • Fuse • Earth screw HV divider Power transformer Input filter William Viganò “BLMSPS – Design Overview”

  14. Power Supply Unit (BLEPSU) - Update Schematic will be based on the EDA-00691 with the following additional functions: • On/Off power supplies. • Replacement of the 3.3VDC linear voltage regulator with a DC/DC converter. • Generation of the +1.5VDC. William Viganò “BLMSPS – Design Overview”

  15. Powering scheme and PSU placementproposal DIOT PSU BLECF2 1 4 7 2 5 8 3 6 BLEIPU – provides 230VAC to DIOT PSU, includes linear regulators to produce clean +5V/-5V for analog electronics BLEIPU connector placed on expansion backplane DIOT PSU – common, switched-mode,generates power for digital electronics “Digital” DC distributed over the main backplane Application-specific “analog” DC distributed over the expansion backplane Everything serviceable from the front . . . . . . . . . . . . . . . .

  16. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  17. BLMSPS – 3D cabinet integration • Earth screws • Fan tray • BLEACT • Cables holder • Air deflector William Viganò “BLMSPS – Design Overview”

  18. BLMSPS – Cabinet characteristics • Model: 19" Camrack QX • Height unit: 6U • Height: 384 mm • Width: 580 mm • Depth: 421 mm • P.N.: CQX064211 • Color: Red, blue, orange, white, black • Distributors: Farnell, RS, Distrelec Copper bar William Viganò “BLMSPS – Design Overview”

  19. FANs and external mechanicsproposal DIOT PSU BLECF2 1 7 4 5 2 8 6 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External FAN tray foreseen in DIOT specification draft … can be installed on top of the chassis Cable holders and air deflector proposed by William can be mounted below the DIOT chassis DIOT chassis compatible with 19’’ cabinets Fan tray

  20. List of incompatibilities Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  21. Cards connectors BLEIPUconnector Harting: 09 06 115 2911 No problem if connectors for BLEIPU and BLEPSU are the same, because due to the electronic boxes size, it is impossible to swap them. BLEPSU connector Harting: 09 06 115 2911 BLEACC connector (SCEM: 09.61.36.015.4 Harting: 09 04 132 2921) BLECF2 connector (Harting: 09 03 164 2921) William Viganò “BLMSPS – Design Overview”

  22. Backplane connectors proposal BLEIPU free choice, needs to fit within expansion backplane height (~ 63mm) DIOT PSU/BLEPSU FCI PwrBlade would enable the use of standard PSU outside radiation FCI PwrBlade Harting: 09 06 115 2911

  23. Backplane connectors proposal Peripheral boards (BLECF2): AirMax VS to provide power and communication with System Board (BLEACC) Used in transportation applications 72-pin and 96-pin variants used Up to 0.95A per-pin Harting 09 03 164 2921 proposed by William Smaller variant can be used on expansion backplaneto provide signals from BLM detectors

  24. List of incompatibilities revisited Grounding scheme BLM detectors connections directly in the backplane Powering scheme Power supply placement FANs placement External mechanical requirements (cables holder, air deflector) Backplane connectors

  25. BPM renovation plans • based on input from Michal Krupaand the rest of the BPM team (BE-BI)

  26. Maintain format of the digital board? ? Might bepossiblebut looks challenging ? M.Krupa “BI-BP future needs for rad-hard tunnel crates”

  27. RF analogue board real estate LHC BPMupgrade 220 mm Needed Distributed elements. Board dimensionsdictated by physicsbut compact designscould be investigated. 256 mm M.Krupa “BI-BP future needs for rad-hard tunnel crates”

  28. LHC BPM upgrade preliminary spec M.Krupa “BI-BP future needs for rad-hard tunnel crates” • Real Estate: • 1 unit = 1 digital board + 1 passive analogue RF board • Unit size: 3U might be possible. Is 4U an option? • Typically 2 units per crate • Electrical: • 2 x < 50 W power consumption • Passive cooling • Independent power management per unit • Backwards compatibility with FIP • No “intelligent” backplane required: • All communication: optical links • BPM signals: RF SMA connectors • Support of a BPM FE unit ID handling? • Mechanical: • Fast and secure installation • Simple, easy exchange of BPM FE units

  29. BPM tunnel crates proposal DIOT PSU BPM board BPM board Sys Board expansion backplane System Board ensures FIP communication RF analogue board placed horizontally behind the backplane Signals from RF board connected to BPM digital board using expansion backplane . . . . . . . . . . . . . . . .

  30. Work packages DIOT chassis specification Main backplane design Expansion backplane designs (BLM, BPM) System Board design Peripheral Board designs (BLM, BPM) DIOT switched-mode PSU design BLEIPU with linear regulators design Fan tray design Diagnostics Procurement Reliability studies

  31. Work packages DIOT chassis specification Main backplane design Expansion backplane designs (BLM, BPM) System Board design – HL-LHC fellow Peripheral Board designs (BLM, BPM) DIOT switched-mode PSU design – HL-LHC fellow BLEIPU with linear regulators design Fan tray design Diagnostics– HL-LHC fellow Procurement Reliability studies – HL-LHC fellow

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