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Section I: Motivation and introduction

Section I: Motivation and introduction. The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning. Basic thermostat and vacuum tech. sources. deposition.

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Section I: Motivation and introduction

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  1. Section I: Motivation and introduction The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning.

  2. Basic thermostat and vacuum tech sources deposition morphology Outline of the course

  3. Example: Cross section of a computer chip

  4. Magnetic storage • ---towards terabits/in2 • C. Ross, Annu. Rev. Mater. • Res. 2001. 31:203-235. • Three strategies: • exchange-decoupled grains • (conventional) • In-plane patterned media • Perpendicular patterned media

  5. 1 “Photonic bandgap: woodpile structure” (Professor S. Lin, RPI)

  6. MRS: Colvin, MRS Bulletin August, 2001, page 637

  7. Optical switches: • MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent) MEMS

  8. Solid state laser: http://www.rpi.edu/futurechips/

  9. Mini-machnines (Micromechanical systems): actuator, resonator, valve, damper, motor…. Wu (2002) Cleland (2003) Industrial Physics (2002) microns Micro-mirror arrays--Lucent (2001)

  10. substrate thickness monitor vapor source pump Physical vapor deposition: thermal evaporation, e-beam evaporation, sputter deposition, laser ablation, ion beam deposition Base pressure --vacuum seal, outgasing, contamination, pumps Deposition rate (nm/s) --source T, vapor pressure, impinging rate Film structure --morphology, crystal orientation, substrate T, uniformity

  11. Ar H2 Ar precursor CF CF 3 3 O C C O - - O O CH 2+ Pd HC Substrate Heater C O C O Pump CF CF 3 3 Chemical vapor deposition: thermal CVD, atomic layer deposition Pressure, T (source and substrate), flow rate, deposition rate, pulse duration, film properties

  12. + - OH- wafer H+ e- Cu2+(EDTA) Cu2+ SO42- SO42- glyoxylic acid wafer anode Cl- Solution based deposition: electrochemical deposition (ECD), Electroless deposition (ELD) electrochemical deposition Electroless deposition (HO2CCH2)2NCH2CH2N(CH2CO2H)2 T~70o Room T

  13. Home work. 1. (Deadline: Sept 7, 8am) Describe briefly five different devices or structures (with figures or drawing) that require extensive thin film coating work. (One page per device.)

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