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Preliminary Probe Test Results for 2 wafers of Ultimate sensors

Preliminary Probe Test Results for 2 wafers of Ultimate sensors. Outline: Yield and wafer maps Examples of failures Summary (Probe testing procedure). Yield and wafer maps (1). Wafer 8: good: 21 44% bad: 10 21% (?): 12 25% Total: 43 48. Wafer 12: good: 3 6% bad: 22 46%

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Preliminary Probe Test Results for 2 wafers of Ultimate sensors

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  1. Preliminary Probe Test Resultsfor 2 wafers of Ultimate sensors • Outline: • Yield and wafer maps • Examples of failures • Summary • (Probe testing procedure)

  2. Yield and wafer maps (1) • Wafer 8: • good: 21 44% • bad: 10 21% • (?): 12 25% • Total: 43 48 • Wafer 12: • good: 3 6% • bad: 22 46% • (?): 16+2 37% • Total: 41+2 48 Yield 21/48  44% 33/48  69% Yield 3/48  6% 21/48  44%

  3. Yield and wafer maps (2) Vclp high/low Faulty col/subarrays Faulty rows 10-200 Noisy transition @ 3.3V 3.0 V Missing data If we can accept the yield will be: wafer 8: 29/48  60% wafer 12: 14/48  29%

  4. Examples of failures E05_w_08 C04_w_12 OK D07_w_12 Faulty columns Sub-arrays E01_w_8 (@3.0V) E05_w_12 Faulty rows 3.3 or 3.0 V E06_w_12

  5. Summary • Sensor selection in this presentation is based mostly on discriminator threshold scans • Mechanical yield  90% • Stringent criteria for the initial selection  44% and 6% yield for wafers 8 and 12 • Relaxed criteria  60% and 29% yield for wafers 8 and 12 • Testing procedure still not fully implemented

  6. Testing procedure • Initial I/V measurements (VDA, VDD, Vclp) • Chip ID • JTAG (2 different sequences) • I/V measurements • Threshold values (Vref1 A,B,C,D) (ineffective) • Optimization of Vref2 (failed) • Threshold scan @ Vref2=105 • Threshold scan @ Vref2=110 • I/V measurements • Normal RDO mode test (counting headers) • I/V measurements • Logging results into MYSQL • To be implemented next: • Extended testing procedures 3 and 10 • Testing procedure 6 • Optimized testing 6,7,8 • Add LED flash test • Add Fe55 tests • Add “early abort”

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