sample iii SiNx surface with CdS wires ALD coated with SiO2 with APTES

1. WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN the remainder of the chips not labeled a or b or a2 are untreated, these areas were never exposed to anything in our lab a WITH RECTANGULAR ORIGAMI CONSTRUCT (1.6nM NOT PURIFIED) FROM SEEMAN LAB WITH 20NM GOLD NANOPARTICLES ATTACHED VIA DNA OLIGO TETHERS a sample iii SiNx surface with CdS wires ALD coated with SiO2 with APTES b b WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN - no surface decoration seen a2 sample iv SiNx surface with CdS wires ALD coated with SiO2 NO APTES a2

2. iii – SiNx chip surface with CdSnanowires with 3nm of ALD SiO2 and APTES checked construct on mica a WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN cantilever is 115um long this wire is from the same chip (iii), but from an untreated area, no surface decoration seen

3. iii – SiNx chip surface with CdSnanowires with 3nm of ALD SiO2 and APTES checked construct on mica WITH RECTANGULAR ORIGAMI CONSTRUCT (1.6nM NOT PURIFIED) FROM SEEMAN LAB WITH 20NM GOLD NANOPARTICLES ATTACHED VIA DNA OLIGO TETHERS b cantilever is 115um long full-z scale overview of wire above

4. iv – SiNx chip surface with CdSnanowires with 3nm of ALD SiO2 NO APTES WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN - NO surface decoration seen, apparently APTES is important for origami to CdS binding this wire is from the same chip (iv), but from an untreated area a2