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News from IEC TC93 Affecting DASC

IEC TC93 Liaison Report to DASC Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004. News from IEC TC93 Affecting DASC. TC93 meetings, October 3 to 8, IEEE Headquarters WG1 Discussed interoperability of international standards

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News from IEC TC93 Affecting DASC

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  1. IEC TC93 Liaison Report to DASCAlex Zamfirescu IEC USNC TA TC93Convener IEC TC93 WG2November 2004

  2. News from IEC TC93 Affecting DASC • TC93 meetings, October 3 to 8, IEEE Headquarters • WG1 Discussed interoperability of international standards • The following two documents were submitted for Dual Logo (DL)IEEE Std 1076.6-2004, Standard for VHDL Register Transfer Level (RTL) Synthesis IEEE Std 1364.1-2002, IEEE Standard for Verilog Register Transfer Level Synthesis • Maintenance procedures for DL were discussed during plenary, Alex Zamfirescu was chartered to write the missing details of the procedures (see DL Procedures) • SMB/2897/QP - Submission of one IEEE product under the IEC-IEEE Agreement for publication as a double logo IEC/IEEE standard - 1603TM IEEE Standard for an Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells and Blocks was approved (by IEC SMB) • A solution to help improve IEEE DASC technical leadership was proposed and discussed at the TC management meeting (see R. Waxman open letter)

  3. SCHEDULE • TC will meet in • Fall 2005 in Nara, Japan • Fall 2006 in London, UK • Fall 2007 in Bucharest, RO • During 2005 IEC TC93 WG2 will meet during several conferences including DATE, DAC and possibly Numerics Workshop

  4. Joint IEEE/DASC-IEC/TC93 Efforts • Understand the ramifications of DL maintenance • Establish fine granularity procedures to address DL Std issues (TC93 – Alex Z – DASC - TBD) • Exercise procedures on VHDL and Verilog maintenance • Develop standards roadmap • Help promote and participate in DATC/CANDE/DASC organized workshops

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