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“Synthesis and study of a crystalline epoxy resin for high heat resistance”

“Synthesis and study of a crystalline epoxy resin for high heat resistance” Pradip K. Dubey*, Hitesh. K. Soni, Mahesh Soni, Samir Kanitkar Thitikan, Patcharaporn Aditya Birla Chemicals (Thailand) Ltd- Epoxy Division. Introduction. Emerging needs Miniaturization of electronic components

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“Synthesis and study of a crystalline epoxy resin for high heat resistance”

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  1. “Synthesis and study of a crystalline epoxy resin for high heat resistance” Pradip K. Dubey*, Hitesh. K. Soni, Mahesh Soni, Samir Kanitkar Thitikan, Patcharaporn Aditya Birla Chemicals (Thailand) Ltd- Epoxy Division TRFA Annual Meeting- Montreal, Canada

  2. Introduction Emerging needs • Miniaturization of electronic components • High speed data transfer • Lower dielectric constant and high heat resistance • Possible to apply in lower thickness TRFA Annual Meeting- Montreal, Canada

  3. Introduction • High Purity resin • Low melt viscosity • High heat resistance TRFA Annual Meeting- Montreal, Canada

  4. Chemical structure and characteristics • Hydrophobic/ saturated backbone – lower dielectric constant • Higher aromatic content - higher heat resistance • Purity/ symmetry- crystalline / lower melt viscosity • High functionality/ high crosslink density – high heat resistance TRFA Annual Meeting- Montreal, Canada

  5. High performance resins Difunctional DCPD type epoxy resin Multifunctional DCPD type epoxy resin TRFA Annual Meeting- Montreal, Canada

  6. High performance resins Difunctional 1,5-Dihydroxy Naphthalene type epoxy resin Tetra functional Naphthalene type epoxy resin Difunctional Dihydroxy Biphenyl type epoxy resin TRFA Annual Meeting- Montreal, Canada

  7. Epoxy resins used for present study Diglycidyl ether of Bisphenol-A (DGEBA)- YD 128 Epoxy Phenol Novolac (EPN)- YDPN 638 Epoxy Tetramethyl Bisphenol-S (ETMBPS) TRFA Annual Meeting- Montreal, Canada

  8. Preparation of ETMBPS TRFA Annual Meeting- Montreal, Canada

  9. Properties of various epoxy resin used for present study TRFA Annual Meeting- Montreal, Canada

  10. GPC of ETMBPS DSC of ETMBPS TRFA Annual Meeting- Montreal, Canada

  11. Physical form of various epoxy resin used for present study Epoxy Phenol Novolac (EPN) Diglycidyl ether of Bisphenol-A (DGEBA) Epoxy Tetramethyl Bisphenol-S (ETMBPS) TRFA Annual Meeting- Montreal, Canada

  12. Melt viscosity Vs. Temperature of various epoxy resins TRFA Annual Meeting- Montreal, Canada

  13. Curing agents used for present study Phenol Novolac (PN) HRJ 1583 Tris(4-hydroxyphenyl) methane (THPM) 3,3’-Diaminodiphenyl Sulphone (3,3’-DDS) Omicure 3,3’-DDS TRFA Annual Meeting- Montreal, Canada

  14. Properties of curing agent used for present study TRFA Annual Meeting- Montreal, Canada

  15. Mixing ratio used for laminate preparation Binder- Fiber ratio : 30: 70 TRFA Annual Meeting- Montreal, Canada

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  17. % Weight loss Vs. Temperature by TGA TRFA Annual Meeting- Montreal, Canada

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  21. YD 128/ DDS/ Anchor 1040 YDPN 638/ DDS/ Anchor 1040 ETMBPS/ DDS/ Anchor 1040 Stress distribution during fracture by Impact TRFA Annual Meeting- Montreal, Canada

  22. YD 128/ HRJ 1583/ TPP YDPN 638/ HRJ 1583/ TPP ETMBPS/ HRJ 1583/ TPP TRFA Annual Meeting- Montreal, Canada

  23. YD 128/ THPM/ TPP YDPN 638/ THPM / TPP ETMBPS/ THPM / TPP TRFA Annual Meeting- Montreal, Canada

  24. Electrical properties of various systems TRFA Annual Meeting- Montreal, Canada

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  26. Conclusion: • High purity ETMBPS exhibits lower melt viscosity in uncured form. • ETMBPS shows higher Tg compared to conventional epoxy resin system. • ETMBPS cured systems shows better dielectric constant and dielectric loss compared to other systems. • Mechanical properties of ETMBPS systems are comparable or lower compared to other systems. • Properties at elevated temperature need to be studied further to establish true potential of this resin TRFA Annual Meeting- Montreal, Canada

  27. Laminates involving high temperature and electrical properties Electronic molding compounds Powder coating of electrical and electronic components One component adhesives Potential application areas TRFA Annual Meeting- Montreal, Canada

  28. Thank You TRFA Annual Meeting- Montreal, Canada

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