Feature-level Compensation & Control

1. FLCC Feature-level Compensation & Control Overview April 5, 2006 A UC Discovery Project

2. The Industry Team 17 Supporters 2 Contributors 2 Former FLCC - Overview

3. Meeting Objectives and Agenda Objectives • Get re-acquainted • Real Technologist & Real Student interactions => collaboration • Results to date on Year 3 • Faculty overview presentations and student poster discussions • Feedback on Year 3 and guidance on Year 4 and beyond Agenda • Faculty Overview Presentations (1:10-2:10; 2:25-3:05) • Questions and Answers (3:05-3:15) • Student Poster Discussion (3:30-4:45) • Steering Committee Meeting (4:45-5:45) • Feedback (5:45-6:15) FLCC - Overview

4. Statistical Models System Sensors Metrology Processes Test Structures Physical Models Feature Level Compensation and Control: Four year research vision for compensating and controlling variability at the feature level Starting Year 3 Scoping Year 4 Novel Apparatus Industry/University collaboration through the U.C. Discovery Program Novel Vehicles Lithography CMP Plasma Tech Device/Diff/Int Sensors & Ctrl Collaborative Experiments FLCC FLCC - Overview

5. Thanks to Our Participating Companies and the U.C. Discovery Program • Very fortunate to have continuity in industry support from 17 companies with UC Discovery matching for 17 students at a time of cut-backs in university research. • Support for Our University Research is only sustainable long term if it adds value to the Bottom Line of each of our Participating Companies. • Mutual value starts with dialog between Working Technologists and Our Future Technologists. • Looking for Guidance on High-Risk Opportunities where University Talent can do Pioneering Research. FLCC - Overview

6. FLCC Assets for High-Risk Research • Academic Knowledge and Skills on Broad Fronts • Physical Mechanisms, Process, Device, CAD, Circuits • Flexible Apparatus, Platforms and Software • Scientific Apparatus and Instrumented Process Apparatus • Source Code for Rapid Prototyping • Working Structure of FLCC • Novel Test Vehicle: ‘Zero Foot-Print Metrology’ • Multi-Student Test Masks • Collaboration with FLCC Companies • Phase-Shifting Test Masks • Vanilla CMOS Wafer Fabrication FLCC - Overview

7. pressure Potentiostat Slurry delivery sample1 sample2 Ref. electrode Sample and sample carrier Polishing pad Slurry film Rotating platen Scientific Apparatus: Leverage Univ. Legacywith minor investment (4%) Atomic Layer Deposition Source (Verify Molecular Dynamics Simulation of Clusters in FC) Polisher Annealing Furnace (diffusion Studies) CMP Wet-Bench LEO SEM and Hitachi CD-SEM (PC and PCI bus upgrades) FLCC - Overview

8. i Si Trench Al Oxide AMAT Centura Process Apparatus: Industry ContributionAMAT Centura (Y1, Y3), laser for 248 nm AMSL (Y2) Etch Modeling Plasma (JC, DG) Test Structures Lith (AN) Zero Foot-Print End Point Sensors (NC) Future Metals Device (TK) Corrosion CMP(FD) Emission Species Probe • Compatible Gates for high-K • MEMS • Passivation alternatives FLCC - Overview

9. Detection Window Metrology wafer i Novel Vehicle: Zero Foot-Print Metrology Plasma Etching Interdisciplinary • Development • Heterogeneous Assembly • Metrology and Control Interface • Modeling • Monitoring Applications • Plasma Etch: End- Point Detection • CMP: End-Point Detection • Lithography: Image Monitor CMP Aerial Image Sensor FLCC - Overview

10. Multi-Student Process-EDA Test Mask 4 Phase Alt-PSM: High-NA, Pol Fall 04; Fab: Photronics Tested: AMD, Nikon, => UCB Att-PSM: Short Loop NMOS Mar 05; Fab: DuPont Fab: Cypress 193 nm phases + binary 248 4 Phase Pin-Hole Alt-PSM: High-NA, Pol; Spring 05; Fab: Benchmark & DuPont Test Plan: Nikon, AMD 2006 Mar Att-PSM for Enhanced NMOS, Apr 4 Phase Att-PSM for PI FLCC - Overview

11. 2006 Vanilla CMOS Wafer Fab at Cypress FLCC - Overview

12. FLCC Seminars and Tutorials (2:10-3PM M) 32 talks (19 video) April 17 May 1 FLCC - Overview

13. The Student Team Jason Cain PhD, Tanuja Gopal PhD, Edward Hwang PhD, Mark Nierode M.S., Garth Robins, PhD, Hugh Silvestri PhD, Ling Wang, PhD and 2 UG Joe Chien and Hideaki Oshima FLCC - Overview

14. The Faculty Team Jane Chang ChE UCLA Plasma mechanisms and feature modeling Cheung, Nathan EECS UCB Plasma modeling, diagnostics, surface interactions Dornfeld, David ME UCB Chemical-Mechanical Planarization Doyle, Fiona MatSci UCB Chemical-Mechanical Planarization Graves, David ChE UCB Plasma modeling, diagnostics, surface interactions Haller, Eugene MatSci UCB Dopant and Self-Diffusion in Si and SiGe Alloys King, Tsu-Jae EECS UCB Novel Electron Devices Lieberman, Michael EECS UCB RF sources and E&M plasma modeling Neureuther, Andrew EECS UCB Pattern Transfer Modeling/Simulation Poolla, Kameshwar ME UCB AEC/APC and Metrology Spanos, Costas EECS UCB IC Process Metrology, Diagnosis and Control Talbot, Jan CE UCSD Chemical-Mechanical Planarization FLCC - Overview

15. The Staff Team Principal Investigator Andrew Neureuther 510 Cory Hall, ERL phone: (510) 642-4590 fax: (510) 642-2739 neureuth@eecs.berkeley.edu Contract Management Ellen Lenzi 558 Cory Hall, ERL phone: (510) 643-9665 fax: (510) 642-2739 lenzi@eecs.berkeley.edu System Support Changrui Yin 550 Cory Hall, phone: (510) 643-7542 fax: (510) 642-2739 changrui@eecs.berkeley.edu Administrative Support Charlotte Jones 558 Cory Hall, ERL phone: (510) 642-1818 fax: (510) 642-2739 cmjones@eecs.berkeley.edu Teleconference 1-888-446-3559 code: 510-643-2834 http://flcc.berkeley.edu Access restricted by password FLCC - Overview