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Parts and materials

Component. Reference. Provider. Footprint. Power regulator and preamplifier. 3D plus. Capacitors. 33n, 22n, 10n, 1n. SM/C_0603. Resistors. 10M , 1M, 100k, 33k, 1k, 100, 47. SM/R_0603. Op-amps. LM108. UCB. TO99. Analog switches. HA390 DIP.100B/16/W.300/L.850.

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Parts and materials

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  1. Component Reference Provider Footprint Power regulator and preamplifier 3D plus Capacitors 33n, 22n, 10n, 1n SM/C_0603 Resistors 10M , 1M, 100k, 33k, 1k, 100, 47 SM/R_0603 Op-amps LM108 UCB TO99 Analog switches HA390 DIP.100B/16/W.300/L.850 Formerly Hariss semiconductor DIP 16 Connectors DAMA15-P UCB Connectors DAMA15-S UCB Parts and materials • Definition of part list • 3D+ modules appear as a component. • All components & connectors have been procured by UCB

  2. Parts and materials • 2) Materials • Material for THEMIS SCM is divided in three parts : • materials used for sensors, • materials used for sensor structure, • materials used for preamplifier (PCB and preamplifier housing)

  3. Function Material designation Provider reference Winding Copper Technopoint winding Coating Technopoint Winding layer insulation Kapton Technopoint Gluing (varnish) Uralane 5750 UCB 5570 Disc 1 & 2 (Hollow or not) Epoxy DIUA FR4 Disc conductive surface Copper 35 microns covered with SN/PB ELINESSYS Disc for holding epoxy DIUA FR4 Glue 2216 B/A (3M) TECMATEL 2216 B/A Lamellas assembly for Magnetic core Ultraperm 65µm VAC Ultraperm 10 Parts and materials 2) Materials a) materials used for sensors

  4. Function Material designation Provider reference Lamellas assembly for Magnetic core Kapton 3M Magnetic core potting MAPSIL 213 MAP MAPSIL 213-B Mandrel 1 Epoxy FR4 Mandrel 2 Epoxy FR4 Winding potting Stycast 280 Emerson & Cuming STYCAST 280 Electrostatic shielding Tube 2 Conductive tape scotch 3M 1181 Solder Conductive glue CV2646 Nusil Harness sensor to connector Three wires shielded FILECA XUD26-003 Parts and materials 2) Materials a) materials used for sensors

  5. Function Material designation Provider Reference Structure Ketron peek FACDEM GF30 Fixation of sensors (screws) Inox GDTech A2 Fixation structure on interface Inox (or Titanium) screws GDTech A2 Parts and materials 2) Materials b) materials used for sensors structure No change !

  6. Function Material designation Provider Reference PCB Epoxy FR4 ELINESSYS FR4 Fixation of PCB (screws) Inox Preamplifier Housing Aluminium AMA Alloy 2618A Solder for components Solder Sn/Pb RESA Parts and materials 2) Materials c) materials used for preamplifier No change !

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