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MEP (Martian Environmental Pod). Interim Review. 2/16/2004 Aerospace Engineering Department University of Colorado-Boulder. Requests for Action. Greenhouse. x 10. Mounting Box. Thermal Petals. Electronics Package. Platform. Design Changes. Greenhouse/Pressure System
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MEP(Martian Environmental Pod) Interim Review 2/16/2004 Aerospace Engineering Department University of Colorado-Boulder
Greenhouse x 10 Mounting Box Thermal Petals Electronics Package Platform
Design Changes • Greenhouse/Pressure System • New deployment method for greenhouse • Circular top will be secured by an acrylic ring inside of the greenhouse • Thermal Shield • Material of axle is aluminum • Electronics/Software • Changed design of circuit to include: • Op Amp • Transistor • Diode • Capacitor
Progress • Solidworks drawings → Corel Draw • Prototypes of petals 7-10 • Machined/Assemblied • Tested • Prototype circuit on solderless breadboard • Demonstration version of circuit on wire wrap breadboard
Current Issues: Greenhouse/Pressure System • Kapton is too stiff to roll for deployment • Molding tool for new design • Difficulty attaching circular top to cylindrical base • Acrylic ring will be secured inside the top of the greenhouse to ease manufacturing
Current Issues:Thermal Shield • During initial testing, shear stress was too great at the rotation point on the petals. • Aluminum sleeve fits over the outermost petal and is welded to the axle to distribute the torque applied. • Runs half the length of the outermost petal
Current Issues:Electronics/Software • LabView class • Trying to take course to learn software programming • High risk if taken through the ITLL
Additional Parts • Molding tool • Acrylic ring for greenhouse manufacturing • Aluminum axle • Aluminum sleeves for petal 1 • Mounting bracket for motor
Critical Path Elements • Machining acrylic parts (1/12 – 2/23) • Assemble petals and base structure (2/2 – 3/19) • Machine/construct molding tool (2/16 – 3/8) • Manufacture greenhouse (2/9 – 3/19) • Test pressure system (2/16 – 3/1) • Build final soldered circuit (2/23 – 3/15) • Develop software using LabView (2/23 – 3/19)