AP 5301 / 8301 Instrumental Methods of Analysis

1. AP 5301 / 8301 Instrumental Methods of Analysis Course Coordinator: Prof. Paul K. Chu Electronic mail: paul.chu@cityu.edu.hk Tel: 34427724 Fax: 27889549

2. Reference Books • Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992) • X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987) • Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990) • Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987) • Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990) • Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994) • Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991) • Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

3. COURSE OBJECTIVES Course Objectives • Basic understanding of materials characterization techniques • Emphasis on applications

4. Classification of Techniques • Microscopy and related techniques • Surface characterization techniques • Elemental / chemical depth profiling techniques • Non-destructive testing

5. Microscopy and Related Techniques • Light Microscopy • Scanning Electron Microscopy (SEM) / Energy Dispersive X-Ray Spectroscopy (EDS) / Wavelength Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) / X-Ray Fluorescence (XRF) • Transmission electron microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

6. Surface Characterization Techniques • Auger Electron Spectroscopy (AES) • X-ray Photoelectron Spectroscopy (XPS) or Electron Spectroscopy for Chemical Analysis (ESCA) • Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

7. Depth Profiling Techniques • Auger depth profiling • XPS depth profiling • Secondary Ion Mass Spectrometry (SIMS)

8. Non-Destructive Testing Techniques • Radiographic and Neutron Radiographic Tests • Electromagnetic & Magnetic Particle Tests • Sonic, Electrical, Mechanical, and Visual Tests • Photoelasticity Test • Liquid Penetrant Tests • Leak Tests • Acoustic Emission Tests

9. Principles of Analytical Techniques

11. Product Yield Enhancement • Understand via modeling and simulation which parameters can improve product yield • Systematically identify these parameters within the process • Control and reduce / eliminate these parameters by identifying their root cause • Process monitor these parameters to measure the success of contamination control efforts

12. Surface Contaminant Identification • Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM • Residues – SEM/EDS, AES, XPS, SIMS • Stains, discoloration, hazes – SPM, SEM, XPS, AES, SEM/EDS • General surface contamination – XPS, AES, SEM/EDS, SIMS

13. Haze on Silicon Surface (SPM)

14. TiN Grains (SPM)

15. Imaging of Hard Disk (SPM)

16. Residues on Integrated Circuits (SEM)

17. Integrated Circuit (SEM)

18. Hard Disk Defects (AES)

19. Si Wafer Surface Contamination (XPS)

20. Depth Profiling

21. Gate Oxide Breakdown (SIMS)