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Congrès du regroupement de l’industrie électronique RIE Le virage au sans-plomb Bienvenue - Welcome

Explore the impacts and regulations of lead-free technology on PCB fabrication, with insights on material challenges and manufacturing processes. Take action now to meet the upcoming regulations.

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Congrès du regroupement de l’industrie électronique RIE Le virage au sans-plomb Bienvenue - Welcome

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  1. Congrès du regroupement de l’industrie électroniqueRIELe virage au sans-plombBienvenue - Welcome Les impacts de la technologie sans-plomb sur la fabrication des cartes par Serge St-Martin Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  2. Impact de la réglementation du sans plomb pour les fabricants de circuits imprimés qui prendra effet en juillet 2006 The impact of lead-free soldering on the printed circuit board fabricators starting July 2006 Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  3. Industry Response to Lead-Free Transition HDP User Group Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  4. Participants to the Lead-Free Transition Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  5. Lead-Free Regulations • The European Union Directive (WEEE)* on the Restriction of Hazardous Substances (RoHS) • Lead • Cadmium • Mercury • Hexavalent Chromium • Polybrominated biphenyls (PBB) • Polybrominated biphenyl ethers (PBDE) • * Waste Electrical & Electronic Equipment • In red, related to PCB fabrication Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  6. Lead-Free Definition • The quantity of lead contained in the prescribed parts for lead-free adoption should be: • Less than 0.1W % (European) Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  7. Electronic Industry Requirements • Higher soldering temperature for lead-free (up to 245oC) • Multiple reflow (SM1 / SM2 / THC / Repair) • Higher laminate Tg (180oC minimum) • Halide-free laminate • Lower ``Dk`` for high speed components • Increase number of embedded components (resistors, capacitors, coils, flip-chips) • Competitive cost Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  8. Lead-Free Ass’y Temperature Variation Sn63/Pb37=$2.94/US/lb Sn95.5/Ag3.8/Cu0.7=$7.67/US/lb HDP User Group Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  9. Industry Segments affected by the Lead-Free transition Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  10. PCB Material Challenges(bromine-free & higher Tg) • Copper clad laminate • Resin coated foil • Soldermask • HAAL (hot air/N alloy leveler) • Legend ink • Conductive polymer • Plug Via Material • Fluxes Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  11. Laminate Materials Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  12. PCB MANUFACTURING HIGHLIGHT FLOW CHART LF IMPACT Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  13. PCB Surface Finishes • OSP • Electroless tin • Electroless silver • HAAL (Sn / Ag / Cu) • Electroless nickel-gold • Electroplated nickel-gold AR = 16.6 / 1 Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  14. Nickel-Gold Finish Seal surface or full conductors with nickel-gold Nickel / Gold / Slivers Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  15. LEAD-FREE SOLDERING IMPACT ON THE PCB FABRICATION PROCESSES¨CONCLUSIONS¨ • AS WE CAN REALIZE, MORE THAN 50% OF THE PCB FABRICATION PROCESSES ARE AFFECTED AT DIFFRENT LEVEL • ALL MAJOR MATERIALS SUCH AS: LAMINATE & PREPREGS, SOLDERMASK, LEGEND INK, CONDUCTIVE POLYMER SHOULD BE RE-EVALUATED FOR THEIR RESPECTIVE ABILITY TO SUPPORT THE 25`C TEMPERATURE INCREASE FOR LEAD-FREE SOLDERABILITY WITHOUT DEGRADATION….REJECTS. • WITH ONLY 19 MONTHS TO GO BEFORE JULY 2006, AN AGRESSIVE LEAD-FREE PLAN OF ACTION SHOULD BE PUT IN PLACE IMMEDIATELY WITH DEDICATED HUMAIN RESSOURCES AND FINANCIAL BUDGET TO MEET THE DEADLINE AND SUPPORT THE CUSTOMERS. • ALSO WE HAVE TO BECOME A ``GREEN PARTNER`` WHICH IS THE ELIMINATION OF HALLOGEN / ``BROMINE`` IN LAMINATE / PREPREGS, SOLDERMASK, CONDUCTIVE POLYMER, FLUXES AND CLEANING SOLUTIONS. SO, WHY NOT MERGE ALL THOSE NEW REQUIREMENTS IN ONE MAJOR PROGRAM WITH THE NECESSARY VISIBILITY AND AUTHORITY TO TAKE ACTION. • GET NEW APPROVAL FROM ``UL`` AND CUSTOMERS FOR ALL NEW MATERIALS AND REVISED FABRICATION PROCESSES. Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  16. REGROUPEMENT DE L’INDUSTRIE ÉLECTRONIQUERIE THANK YOU FOR YOUR ATTENTION MERCI DE VOTRE ATTENTION QUESTION(S)!!! Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

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