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NOKIA HARDWARE OVERVIEW

This overview provides information on the hardware properties, architecture, and interfaces of Nokia mobile phones. It includes details on flip-chips, size, power supply, RF and BB ASICs, RF/BB interface, and more.

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NOKIA HARDWARE OVERVIEW

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  1. NOKIA HARDWARE OVERVIEW Thomas Müller Nokia Mobile Phones Thomas.T.Muller@nokia.com Olaf Joeressen Nokia Mobile Phones Olaf.Joeressen@nmp.nokia.com Holger Hussmann Nokia Mobile Phones Holger.Hussmann@nmp.nokia.com Thomas Müller, Nokia

  2. Outline • Properties Overview • Hardware • Architecture • Interfaces Thomas Müller, Nokia

  3. NOKIA Module: Facts • Flip-Chips: RF ASIC, BB ASIC, Flash • Size: < 500 mm2 (incl. Crystals) • Height: 2 mm • completely shielded • power supply: 3.0 .. 5.2 V • Interfacing: 1.8 .. 3.3 V Thomas Müller, Nokia

  4. NOKIA Architecture • Traditional high-IF RF • fast time-to-market • good sensitivity • SW oriented BB architecture • only MIPS consuming tasks done in HW • even low-level features can be added in SW • No HW buffers dedicated to connections • higher flexibility w.r.t. interfaces and buffer usage Thomas Müller, Nokia

  5. HW Blocks Bluetooth Module Control Applic. IF RF ASIC BB ASIC 4 - Rx/Tx - regulators - clocking - Rx/Tx Control - ARM7TDI - CVSD codec - Applic. IF Data 2 13MHz Vappl 1.8V, 2.78 or 3.3V 3.0 .. 5.2 V 1.8 V Flash 32 kHz 13 MHz Thomas Müller, Nokia

  6. NOKIA RF Part Discriminator tank RF part SAW filter 2.4 GHz RF ASIC Control Rx: - high IF limiting Rx - analog FM discriminator Tx: - open loop Tx - external VCO tank & varicap - dig. pulse shaping Internal regulators Low pin-count RF/BB interface 4 Data 2 13MHz Switch 1.8 V 3.0 .. 5.2 V 13 MHz VCO Thomas Müller, Nokia

  7. NOKIA RF/BB Interface • Optimized for low pin count to aid integration of the BB functionality into existing system ASICs • bi-directional data interface • control bus can be shared with other ASICs • timing control supported in the RF ASIC (e.g. synth. settling) Thomas Müller, Nokia

  8. NOKIA Baseband ASIC Facts • FlipChip package • ARM7 @ 13 MHz • 32 kHz Sleep clock oscillator • Low-level (MIPS consuming) protocols in HW • Central buffer RAM (no dedicated buffers) Thomas Müller, Nokia

  9. Baseband ASIC - Block Diagram Buffer/MCU RAM HW Link Controller MCU Sybsystem Receiver Data Interface Unit Clock trunks SysResetX ResetX Power Control Unit Clock, Reset Watchdog 13 MHz Thomas Müller, Nokia

  10. More Common Bluetooth Interfaces needed ? • Drivers for common interfaces • facilitate interoperability between components (HW/SW) from different vendors (Example: HCI) • Needed ? • RF/BB: most important HW interface • different vendors on both sides of Interface • integrated BB solutions require stable interface • HW/SW • largely hidden in BB ASIC • may depend on application Thomas Müller, Nokia

  11. Standard RF/BB Interface drivers • vendor-independent • RF-architecture independent • low-pin count • enable BB integration into other ASICs • reduce device pin count • future proofness • Technology independent • Higher data rates Thomas Müller, Nokia

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