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Founded in February 1998. (Spin-off from Samsung Semiconductor)

Founded in February 1998. (Spin-off from Samsung Semiconductor). Public Company in Korea since Dec,2002 (KOSDAQ). Business Units. SIP Division- Flash Memory Cards, MCP/SiPs ASSP Div – 20 Partners from USA/Europe/Taiwan ASIC Division: Design Center for Fujitsu ASIC. Locations.

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Founded in February 1998. (Spin-off from Samsung Semiconductor)

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  1. Founded in February 1998. (Spin-off from Samsung Semiconductor) Public Company in Korea since Dec,2002 (KOSDAQ) Business Units • SIP Division- Flash Memory Cards, MCP/SiPs • ASSP Div – 20 Partners from USA/Europe/Taiwan • ASIC Division: Design Center for Fujitsu ASIC Locations • HQ & Factory in Yong-In City, Kyunggi-Do(SiP Div) • ASSP & ASIC Div in Seoul • Branch Offices in Gumi, Kwang Ju, HK • Paid in Capital : US$ 6.48 million. • Employee : 220 People as of Sep, 2008. • Yearly Revenue US$80M in CY2006, US$92M in CY2007, US$110M in CY2008, US$150M in CY2009

  2. Total Solution Provider as Packaging in House : SIP Division • SIP Division Produce Flash Memory Cards in Volume(3Mu-5Mu/Month) For MCP/SiP : Packaging Production Lines + Well Experienced Packaging Engineers + System Application Engineers(Hardware Engineers/Firmware Engineers) • Global Partners Memory Suppliers, SOC Suppliers, Test Houses • Professionalism • Enthusiasm, Creative & Aggressive • Communicate well in English • Well Experienced Management for Semiconductor • Good Relationship & Sales Revenue with Major • Customers (Lexar, Samsung, LG, Fuji Film, Softbank etc)

  3. IC Packaging R&D, Manufacturing :Flash Memory Cards , MCPs , SIPs UFDs , Specialty Packages SIP Div Representative & Distributor for ASSP & SoCs Sales & Marketing Application Engineers Supports Turn-key Designs 4 Offices ASSP Div ASIC Div ASIC Design Center For Fujitsu Foundry/COT EASIC

  4. CEO SIP Div. ASSP Div. ASIC Div. Manufacturing/ Equipment/ Production Control Application Engineers Planning / Finance ASIC Engineers Production Package Design /System/ Test Dept. R&D Packaging Sales & Marketing Planning / Finance / Account Dept. ASIC Marketing Production I Process Engineering Dept. Seoul / Gumi Office, CS, Sales & Marketing Engineering IQC / PQC / QA / AS Part, Spec. Center Quality & Reliability • SIP : System in Package • ASSP : Application Specific Standard Product • ASIC : Application Specific Integrated Circuit • Employee : 220 People Global Sales & Marketing, Forceasting Sales & Marketing Purchase / HR/ Administration Dept. Administration

  5. Seoul Barun Electronics Incheon Yongin Barun Electronics Manufacturing/R&D :YongIn, Kyunggi- Do. Seoul Office : YanJae Dong, Seoul Local Sales office : Gumi, Kwang Ju Oversea Branch office : HongKong, Japan, USA Gumi Kwang ju

  6. (UNIT : M$) 25.0% 30.1% 12.6% 2006 2007 2008 2009

  7. Financial Summary (in Mwon)

  8. 분기별 실적 추이 * 단순합산 주1) (단위 : 백만원) 주1) 당사는 08년8월19일자로 ㈜젠코아와 합병하였고, 기업합병회계준칙에 따라 합병전 바른전자의 실적은 포함되지 않습니다. 기공시된 3분기 누적 매출액과 영업이익은 각각 376억원과 20억원입니다. 상기 자료는 합병에 따른 양사의 단순합산 실적을 표기한 것입니다.

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