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Assoc. Prof. Norocel Codreanu , Ph.D.

"E-Training Microsystems Technologies" project (LLP-LdV/ToI/2008/ RO/003) for development microsystems engineering skills in Romania and Bulgaria. Assoc. Prof. Norocel Codreanu , Ph.D.

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Assoc. Prof. Norocel Codreanu , Ph.D.

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  1. "E-Training Microsystems Technologies" project (LLP-LdV/ToI/2008/ RO/003)for development microsystems engineering skills in Romania and Bulgaria Assoc. Prof. Norocel Codreanu, Ph.D. “Politehnica” University of Bucharest, Center for Technological Electronics and Interconnection Techniques, Bucharest, Romania

  2. 1. Introduction 2. Objectives 3. The approach 4. The MSYSTECH European Project 5. Conclusions Table of contents

  3. Multi-media learning involves active learning, both behavioral as well as cognitive, because it is a type of computer-based training that uses two or more media, including text, graphics, animation, audio (sound/music), and video. Msystech project offers a new approach of thinking the vocational learning process: a public, performance-centered, task-oriented multi-lingual training environments. 1. Introduction

  4. The shortage of engineers in micro-, nano-systems and the systematic decrease of students in electronics at the university can be a threat to the European economy competitiveness. The primary target groups concerned are: professionals from SME in electronics and micro-systems, students in engineering education and vocational schools, educated but unemployed people looking for additional training for employment. 2. Objectives

  5. 1. Performance-Centered Design - is the key difference between performance support systems and training systems; 2. Learn by doing - much of what we know to do in a job we learn on the job; 3. Organizational Memory - refers to the knowledge that an organization has or could have about its business and to the process it uses to acquire and recall that knowledge; 4. Technology Use - the performance support system (PSS) is a natural extension of building technologies that transform the way people work and learn. 3. The Approach

  6. The mSysTech project is based on the positive results and experiences in two European pilot projects: Leonardo da Vinci project IPCI and Socrates/Minerva "On-line Learning Mathematics and Sciences" (OnLine Math&Sciences). In mSysTech the performance-centred job-linked training approach will be used also and the selected content from the courses of IPCI will be adapted and up-dated for the needs of Romanian and Bulgarian electronic sector and education. The e-learning platform used for this project is MOODLE (Modular Object-Oriented Dynamic Learning Environment). 4. The MSYSTECH European Project

  7. Starting page of the MSYSTECH project website www.msystech.eu

  8. Packaging Technologies Teacher: Norocel Codreanu Courses available in MSYSTECH

  9. “Creating a PCB footprint” animation “Simulation in frequency domain” animation

  10. Microsystems Design Teacher: Philippe Morey-Chaisemartin

  11. Thermal Management of Microsystems Teacher: Slavka Tzanova

  12. Photomasks Data Preparation Teachers: Eric Beisser, Farid Benzakour

  13. Course institution: "Politehnica" University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI)Course author: Norocel Codreanu and other colleagues from UPB-CETTI Packaging Technologies Objective The objective of the course is to introduce the learners in microsystems packaging technologies, including design, analysis, fabrication, assembling, characterization and testing. In addition, this course will also introduce the most recent developments of micro-/nano-fabrication technologies.

  14. Contents of the course • The course covers the research and innovation in the following major topics: • Fundamentals of microsystems packaging; • Packaging materials; • Modelling, simulation and CAD of microelectronic structures and systems; • Assembling technologies - classical and based on RoHS&WEEE European Directives; • Basics of nanopackaging.

  15. Learners The primary target groups concerned are: professionals from SMEs in electronics and micro-systems, students in engineering education and vocational schools, educated but unemployed people (e.g. engineers, physicists) looking for additional training for employment. Prerequisite and Corequisite Knowledge • Fundamentals of electronics and electronic packaging; • Passive and active components in electronics; • Analog and digital electronic circuits; • Basics of electronic modules design and EDA; • It is assumed also that learners have a good knowledge of physics and chemistry. Estimated duration of the course: 30 hours

  16. 1. Fundamentals of microsystems packaging 1.1Introduction 1.2 The packaging hierarchy 1.3 Milestones in packaging 1.4 Packages and technologies 1.5 Packaging Technologies Trends

  17. 2. Packaging materials 2.1 Introduction 2.1.1 Materials for Packaging Technology 2.1.2 Non-woven fabrics from electrospun nanofibers 2.1.3 New Packaging Materials 2.2 Basic electronic packaging materials 2.3 Plastic materials and processes 2.3.1 Thermosets vs. Thermoplastics 2.3.2 Transfer molding thermosets 2.3.3 Thermo-shaping of thermoplastics 2.3.4 Injection Molding 2.3.5 Wire bonding material

  18. 2.4 Dielectric materials used in the manufacture of printed circuit boards 2.4.1 Two major applications areas, RF/analog and digital 2.4.2 Two Major Materials Classes 2.4.3 Goal of each application area 2.4.4 List of woven glass materials used in digital applications 2.4.5 Nonwoven or very low glass content materials 2.5 Materials for lead-free assemblies 2.5.1 Lead-free folder pastes 2.5.2 Lead-free surface finishes 2.5.3 Components for lead-free soldering 2.5.4 Substrates for lead-free soldering 2.5.5 Reliability of Lead-Free Solder Joints 2.5.6 Solder Joint Intermetallics 2.5.7 Effect of Alloy Composition 2.5.8 Effect of Surface Finish

  19. 3. Modelling, simulation and CAD of microelectronic structures and systems 3.1 Modelling, simulation and design of interconnection structures Example: Ball Grid Array package 3.2 CAD of microsystems structures 3.2.1 Introduction 3.2.2 Beam Design 3.2.3 Mirror Design 3.2.4 Thermally-Actuated Pop-Up Mirror

  20. Cap 4 Chip assembling technologies 4.1 Chip packaging technologies -Brief 4.1.1 Wire Bonding 4.2.2 TAB 4.2.3 Flip-Chip 4.2. Board assembling technologies

  21. 5. Basics of nanopackaging 5.1 Introduction 5.2 The significance of the nanoscale 5.3 Nanomaterials 5.4 Nanomaterials Science 5.5 Applications of nanomaterials 5.6 Carbon Nanotubes 5.7 Nanotechnology images

  22. With their new technology, mSysTech project moves the traditional teaching systems to the closely related to the job learning. The most important tangible outcomes are that the training centers, industrial associations and schools will be able to provide the self-learning web-based courses for both students and people of the region who are seeking for jobs in this field or are interested in continuing or convergence education for any other reasons. The message to the teachers, to consider the impact of teaching on results, good performance and competitiveness, is another perspective of this innovation. 6. Conclusions

  23. Thank you for your attention !

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