1 / 28

VINNOVA Excellence Center - Vinnex iPack Center - Ubiquitous Intelligence in Paper and Packaging

VINNOVA Excellence Center - Vinnex iPack Center - Ubiquitous Intelligence in Paper and Packaging. Outline. Background The vision Innovation and renewal Innovation strategy and impact Budget Industrial partner program Contact Annex: Our Competence. Background.

gavin
Download Presentation

VINNOVA Excellence Center - Vinnex iPack Center - Ubiquitous Intelligence in Paper and Packaging

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. VINNOVA Excellence Center- Vinnex iPack Center -Ubiquitous Intelligence in Paper and Packaging

  2. Outline • Background • The vision • Innovation and renewal • Innovation strategy and impact • Budget • Industrial partner program • Contact • Annex: Our Competence

  3. Background The Vinnex iPack Center is Proposed by • KTH - the leader • Research Institutes – STFI & YKI • Industrial Partners: - System and bio-medical (10) (Cypak, RFIG, SAAB, FrameAccess, Zarlink, Biosensor Applications, Ortivus, Radi, Akzo Nobel, LivingLab) - Electronics (7) (Note, XaarJet, Catena, Imsys, FirstPass, Shortlink, Kalix Electroplis) - Forest products (3) (Korsnäs, StoraEnso, Skogsindustrierna) • Future attract more industry: ……

  4. General Background: Ubiquitous Intelligence 2005 2015 • Ubiquitous Intelligence – The General Vision • embedded smart systems in almost everything, virtually talk to each other • interact with people adaptively, cleverly hidden, user (human) -centric • ad hoc spontaneous networks, much larger than today’s internet • Make our everyday life easier and simpler, e.g. an easy office, an intelligent home.. • The next driving force after internet revolution • convergence of wireless, IT, nano, bio-, … • new applications, new business opportunities

  5. iPack Center’s Focus i-Package for food & pharmacy: safety, quality etc Paper board Smart Bandage: easy, quick, smart i-Patch: wireless patient monitoring and therapy devices

  6.                                                        The same technologies could also be used for others, e.g. i-Diaper i-Fashion i-Arts: tangible media interfaces Next generation i-Logistics: self-aware, networked

  7. The Vision of iPack center

  8. iPack Vision A national hub of multidisciplinary collaboration that • Brings Swedish existing and successful industry sectors together(Forest, biomedical, and ICT/electronics industries) • Creates unique innovations via integration of these resident competence, (e.g. combine paper with IT) • Focus on ubiquitous intelligence for paper and packaging, making our everyday life easier and simpler (e.g. an easy office or an intelligent home) • Conducts world-class research and creates new business opportunities in these unique areas

  9. iPack from a System and End-User’s Perspective • Cross-disciplinary integration of IT, paper, and sensor technologies • New business opportunities via joint innovation • Interact with technology suppliers in multidisciplinary competence areas • Access to state-of-the-art technologies • State-of-the-art “know-how” • Meet different researchers, inspiration, creation and innovation Source: Stina Ehrensvärd, Cypak

  10. iPack from a forest industry perspective Sweden’s paper industry facing major challenges • Escalating competition from BRICS countries • Energy costs • Changes in distribution of goods and information Necessary actions • Further develop established business areas to remain competitive • We know how to do that! • Development new complementary business areas • by crosslinking our resources, knowledge and infrastructure with other technically advanced industrial sectors, eg. microelectronics • Not obvious how we do this - need for more success stories as leading examples Source: Magnus Wikström

  11. Why iPack is of interest for forest industry • Potential for innovation related to new functionalities for packages • Learn more about specific demands on packaging materials for these applications • Complementary project partners from different positions in the value chain • Learn how to utilize other industrial sectors for common product development – iPack is a pilot • Access to international talents Source: Magnus Wikström

  12. Innovation and Renewal of the iPack center

  13. Innovation and Renewal(from Paper and Package Perspective) • Interactive paper functionality through modified wood fiber and functional materials coating(e.g. electrical & magnetic paper, pressure and temperature aware paper, electrically controlled self-rolling paper, solar power paper, bend-aware paper etc) • Controlled micro-fluidics realized by printing and paper surface modification(e.g. lotus paper with micro-fluidics channels, electrical valve and pump printed on a paper for fluidics control) • Smart package that knows the quality of foods and interact with consumers with dynamic images, tracking more information via mobile phones(with paper-based sensors or embedded microchips) • Intelligent file folders, tags and tickets with sensors, wireless communication and encrypted security features(with integrated smart chip and paper-based sensors) • Information papers with electronic transaction capabilities, envelops with electronic addressing & security • Smart catalogues that coupled to the internet for automated purchasing • Corrugated boxes with electronic manifests and supply chain custody

  14. Control & Signal Communication Paper & Processing & Services Bio - Sensor & Packaging Micro - Fluidics Expertise Manufacture Radio & Bio - Medical & Production Monitoring RFID System Integration Networking Vinnex iPack Center Innovation and Renewal(from Electronics and System Perspective) • KTH/STFI/YKI: good history of working together • Industrial partners: centered around Stockholm • Geographic proximity of the players • Unique interdisciplinary model for the center

  15. Printed Solder Printed Adhesive Innovative Manufacture and Assembly Process • Low Cost and high Speed

  16. paper Decomposable Electronics and Environmentally Friendly • Laminated Paper PCB • Embedded Chips in Paper • Lead-Free Solders and Interconnections ”Smart dust” not ”smart garbage” ! Decomposable & Recyclable, Environmentally Friendly Paper was actually used for electronics in 1950s!

  17. Innovation Strategy and Potential Impact

  18. A Focused Common Goal - Prototyping • Maintain a common goal via joint prototyping • Recursive innovation for every new generation of prototyping

  19. 3G 2G 2G 4G 4G 1G 1G 3G Center Continuity: A Recursive Process New Partners System & Users EU Year 2016 RFIG EU Vinnex iPack Center NIC Year 2006 New Partners Tech Suppliers

  20. Potential Impact • Renewal for traditional Swedish industry sectors • Strengthen SMEs’ competitiveness • Active spin-offs in this cross-disciplinary and innovative area • Industry: Know-how

  21. Budget and Industrial Partner Program

  22. Status and Budget • Approved by Vinnova in June 2006 • 10 Years Program (2006-2016) with renewable projects for every 2 years • Total Budget 210Mkr for 10 Years where Vinnova contributes 1/3 in Cash KTH contributes 1/3 in Cash + in kind Industry contributes 1/3 (>30% cash + other part in kind) • 2007-2008: start up phase (Vinnova contributes 2.5Mkr in 2007, 4.5Mkr in 2008 and thereafter, 7Mkr per year)

  23. Industrial Partner Program As a Funding Partners: • Can initiate projects every 2 years (contact center director) • Contribute 200-300kKr/y cash for hiring a Ph.D. or postdoc, KTH and Vinnova will contribute 200-300kkr/y each • Other types of contributions • Ownership of IPR based on funding structures and exclusive license of IPR from KTH holding • Early access to all researchers & research results in the center • Share iPack Lab facilities and design tools As an Associate Partners: • Contribute 50-100kkr/y to the center • Early access to researchers, research results, and know-how • High priority for IPR license • Attend workshops and courses for free • Access to iPack Lab facilities and design tools

  24. Further ContactDr. Li-Rong ZhengLeader of VINNEX iPack CenterKTH, School of ICTElectrum 229SE 164 40 Kista-StockholmSwedenE-Mail: lirong@imit.kth.sePhone: 08-790 4102Mobile: 070-783 1818

  25. Annex: Our Established Competence

  26. 2.9mm 2mm Wireless communication/RFID, sensors and signal processing on a Flexible Paper Board Competence in wireless design, heterogeneous integration, and printing etc Flexible Foils- LCP & Kapton, inkjet printing UWB RFID in LCP 5GHz Receiver Front-end in LCP Multi-band LNA in LCP Headed by Prof. Li-Rong Zheng, Media Electronics-KTH

  27. Microsystem Technology Transdermal patch Microneedle chip Transdermal Drug Delivery Transdermal patch Group Competences: • Integration of silicon microtechnology and low cost materials and fabrication • Microsensors (e.g. pressure, flow, etc) • Microactuators (e.g. valves, pumps, etc) • “Mixed technologies”: microsystems with IC, sensors, fluidics, etc. Group Application fields: • Medical technology • Biotechnology • Microfluidics • Microoptics • RF technology Some visions for iPack: • Small sized systems at low cost • “Lab-on-Paper/Foil” for low cost disposable diagnostics • Transdermal patches for drug delivery and health monitoring • Smart packages • “Paper-Actuators” for electrically controlled liquid pumping or paper bending (Expancel) • Wireless sensor tags An example… Headed by Prof. Göran Stemme, Mirosystem Technology -KTH

  28. ASIC ASIC Mem RF uP Mem Mem Mem Medical Sensor Platform • Access Point: • Data collection • Data pre-processing • Comunication to sensors • Comunication to hospital computer • Sensors: • elctrodes • Pressure • Humidity • Oxygen • Acceleration • chemical, .. • Communication medium and protocol • between sensors • to access point • wireless • wired • Optical, ... Headed by Prof. Axel Jantsch, Electronic System Design -KTH

More Related