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VINNOVA Excellence Center - Vinnex iPack Center - ( Ubiquitous Intelligence in Paper and Packaging ) 13 November 2006

VINNOVA Excellence Center - Vinnex iPack Center - ( Ubiquitous Intelligence in Paper and Packaging ) 13 November 2006. Background. The Vinnex iPack Center is proposed by KTH - the leader Research Institutes – STFI-Packforsk & YKI Industrial Partners: - System and bio-medical (10)

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VINNOVA Excellence Center - Vinnex iPack Center - ( Ubiquitous Intelligence in Paper and Packaging ) 13 November 2006

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  1. VINNOVA Excellence Center- Vinnex iPack Center -(Ubiquitous Intelligence in Paper and Packaging)13 November 2006

  2. Background The Vinnex iPack Center is proposed by • KTH - the leader • Research Institutes – STFI-Packforsk & YKI • Industrial Partners: - System and bio-medical (10) (Cypak, RFIG, SAAB, FrameAccess, Zarlink, Biosensor Applications, Ortivus, Radi, Akzo Nobel, LivingLab) - Electronics (7) (Note, XaarJet, Catena, Imsys, FirstPass, Shortlink, Kalix Electropolis) - Forest products (3) (Korsnäs, StoraEnso, Skogsindustrierna) • Future attract more industry, ……

  3. General Background • Ubiquitous Intelligence – The General Vision • Embedded smart systems in almost everything, virtually talk to each other • Interact with people adaptively, cleverly hidden, user (human) - centered • Ad hoc spontaneous networks, much larger than today’s internet • Make everyday life easier and simpler, e.g. an easy office, an intelligent home, … • The next driving force after internet revolution • Convergence of wireless, IT, nano, bio-, … • New applications, new business opportunities

  4. iPack Vision A national hub of multidisciplinary collaboration will • Focus on ubiquitous intelligencefor paper and packaging, making our everyday life easier and simpler (e.g. an easy office or an intelligent home) • Bring existing Swedish industry sectors together (Forest, biomedical, and ICT/electronics industries) • Create unique innovations through • Cross-functional research network • System integration of these new and existing components (e.g. combine paper with ICT) • Conduct world-class researchand create new business opportunities in these unique areas

  5. Industrial perspective of iPackSource: Stina Ehrensvärd, Cypak • Cross-disciplinary integration of IT, paper, and sensor technologies • New business opportunities via joint innovation • Interact with technology suppliers in multidisciplinary competence areas • Access to state-of-the-art technologies • State-of-the-art “know-how” • Meet different researchers, inspiration, creation and innovation

  6. Industrial perspective of iPackSource: Magnus Wikström, Billerud Necessary actions for the Paper industry • Further develop established business areas to remain competitive • We know how to do that! • Development new complementary business areas • by crosslinking our resources, knowledge and infrastructure with other technically advanced industrial sectors, e.g. microelectronics • Not obvious how we do this - need for more success stories as leading examples

  7. Potential Impact of iPack • Renewal for traditional Swedish industry sectors • Strengthen SMEs’ competitiveness • Active spin-offs in this cross-disciplinary and innovative area • Increase industry and societal awareness of new technology platforms

  8. Core Technologies Application Demonstration Production and Manufacturability iPack - Goals and focus • Core technologies, e.g. • Paper and surface • Sensor and microfluidics • Radio and antenna • Assembly and integration • Application & demonstration, e.g. • Intelligent packaging • Wireless sensor • Wearable sensor • iLogistics • Production and Manufacturability, e.g. • Supply chain demands • Industry standards

  9. Remaining challengesPaper and paperboard as a substrate for printed electronics • Surface roughness • Control of adhesion, wettability, absorbency • Control of resistivity and dielectric properties • Hygroinstability of cellulosic fibers

  10. iPack - Core technologies Media and electronicdesign Micro devices Fiber modification iPack System Integration Localisedprinting and coating Sensor techniques Packaging technology Electrochemistry Surface modification

  11. iPack - Core technologies - Surface design Fiber modification - Conductive paper Multilayer curtain coating Control of wettability Dry powder coating iPack SurfaceDesign Designed layering of polyelectrolytes Spot coating - localized treatment Microfluidic devices

  12. iPack - Application and demonstration Inkjet printable sensor for polymers, surfactants, proteins Transdermal patch design Inkjet printable wireless/RFID on foils, paper iPack System Integration Inkjet printed polymeric memory array Medical sensor platform Intelligent pharmaceutical package Miniaturized fuel cell

  13. Enabling features • 10-year program 2007-2016. Total budget 210 MSEK: Vinnova 1/3 in cash, KTH 1/3 (cash+in-kind), Industry 1/3 (cash+in-kind) • Physical hub at KTH, meeting place for researchers and industry partners • Media electronics • Electronic system design • Radio and mixed signal systems • Microsystems and sensor technology • Applied electrochemistry • Polymer and fiber technology • Paper coatings, printing and packaging technology • Industrial cross-functional network - SME/Large companies/different branches • 2007-2008: start up phase (Vinnova contributes 2.5 MSEK in 2007, 4.5 MSEK in 2008 and thereafter, 7 MSEK per year)

  14. Industrial Partner Program As a Funding Partner • Contribute 300 kSEK/year cash, KTH and Vinnova will contribute equal amount • Can initiate projects every 2 years • Contract renewal after 2 years • Ownership of IPR through exclusive licenses via KTH Holding • Early access to all researchers & research results in the center • Attend workshops and courses • Share iPack Lab facilities and design tools

  15. Tentative deliverables After two year start-up • Build-up of iPack infrastructure • Postdocs, PhD students • First results from projects, e.g. feasibility studies on • System Integration: Applications and Demonstrations • Surface Design: Coating, printing and surface modification • Detailed planning for consecutive years

  16. 3G 3G 2G 4G 1G 2G 4G 1G Center Continuity: A Recursive Process New Partners System & Users EU Year 2016 RFIG EU Vinnex iPack Center NIC Year 2006 New Partners Tech Suppliers

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