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Attention: Tan Teck Chun Tel: (65) 6770 5409 Fax: (65) 6774 5747 Email: teckchun@ime.a-star.edu.sg. Institute of Microelectronics 11, Science Park Road Science Park II Singapore 117685. 12th Electronics Packaging Research Consortium (EPRC 12) Membership Reply Slip. Provisional.
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Attention: Tan Teck Chun Tel: (65) 6770 5409 Fax: (65) 6774 5747 Email: teckchun@ime.a-star.edu.sg Institute of Microelectronics 11, Science Park Road Science Park II Singapore 117685 12th Electronics Packaging Research Consortium (EPRC 12) Membership Reply Slip Provisional • Please indicate your interest in our consortium by completing this reply slip and faxing it to us by 17 Sept 2012. • Upon receiving your reply slip and confirmation of no. of members for the projects, we will send you a draft legal agreement for review. All reviews to be completed by 14 Nov 2012(proposed). • Your participation in this consortium will only be confirmed upon the signing of the legal agreement. • It is scheduled to sign an agreement with the member companies on 21 Nov 2012 (proposed). • Information of these project are described in the proposals dated 15 Aug 2012 • Payment terms are shown below: • 50% upon signing; 50% (9 months into project) We agree to participate in the this consortium under the name of______________________ (Registered Company Name). Our level of participation is (please tick the relevant box) : - Core Member - Membership Fee (S$) Associate Member - Membership Fee (S$) Project Title Cu Pillar Interconnect and CPI on Advanced Cu Low K Chip $80,000/= $60,000/= Embedded Cooling Solution for 3D Stack Chip $60,000/= $80,000/= Development of Power Module for Device Temperature over 220°C $80,000/= $60,000/= $80,000/= $60,000/= Thin Wafer Handling for 3D Packaging $80,000/= 3D-Embedded WLP $60,000/= Our participation is conditioned on our review, acceptance, and signature of the member legal agreement. Our only obligation to this project, if any, will be the terms and conditions contained in the member agreement which we sign. Signed by for and on behalf of, Email : Company : Tel : Signature : Fax : Name : Title : Date : Address :