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Moldflow Plastics Insight

Moldflow Plastics Insight. 3D. MPI/3D. What does MPI/3D do ?. Predicts plastic flow for thick parts & parts which have no midplane Direct analysis of solid CAD models Simulates plastics behavior in 3D Optimize mold and cooling circuit design Identify and eliminate part warpage

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Moldflow Plastics Insight

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  1. MoldflowPlastics Insight 3D

  2. MPI/3D

  3. What does MPI/3D do ? • Predicts plastic flow for thick parts & parts which have no midplane • Direct analysis of solid CAD models • Simulates plastics behavior in 3D • Optimize mold and cooling circuit design • Identify and eliminate part warpage • Add-on option to MPI/Flow, MPI/Cool, MPI/Warp, MPI/Gas, MPI/Fiber and MPI/Reactive Molding

  4. MPI/3D Features • True-to-life simulation of how plastic flows in 3D • Full Navier Stokes solver including • inertia effects • gravity effects • Detailed solution of conservation equations • Non-Newtonian, non-isothermalMaterial Model

  5. Automatic 3D TET Mesh Generator • Automatic anisotropic mesh refinement • Refines CAD mesh formats • SDRC Universal • Nastran Bulk Data File • Patran Neutral File • Ansys Prep 7 • Ability to convert a triangular surface mesh into 3D tetrahedral elements

  6. Old: 56,000 tetras New: 34,000 tetras Mesh Optimization • Mesh optimization focuses specifically on Thin sections • Uses surface mesh matching to create internal layers with fewer nodes • Refrains from splitting surface facets and thereby reduces dense patches of mesh • Mesh size should decrease significantly, resulting in faster analysis times

  7. MPI/3D Benefits • Fast model preparation • True 3D plastics flow, cool and warpage simulation • Insert Overmolding • 2-Shot Overmolding • Gas Assisted Injection Molding • Prediction of fiber orientation in 3D • Microchip Encapsulation • Deeper insight into plastics behavior

  8. 3D Flow

  9. 3D Cool

  10. 3D Warp

  11. 3D Fiber

  12. 3D Gas

  13. Cavity Insert MPI/3D Insert Overmolding • Import part inserts as solid model and mesh with 3D Tetrahedral elements • Specify temperature & material properties of the insert • Obtain temperature variation within the insert for the entire molding cycle • Mesh along interface of the part and insert does not need to match • Supported for both thermoplastic & thermoset applications

  14. MPI/3D Insert Overmolding 3D Flow Insert Temperature

  15. MPI/3D 2-Shot Overmolding

  16. MPI/3D Microchip Encapsulation • Microchip encapsulation can be simulated using 3D tetrahedral elemental models • Areas filled with epoxy can be meshed with 3D tetrahedral elements • Benefits include easier modeling and improved results accuracy

  17. MPI/3D Microchip Encapsulation Paddle Shift Pressure (MPa) Paddle Shift Displacement (mm)

  18. MPI/3D Microchip Encapsulation Wire Sweep - Comparison with Experiment

  19. MPI/3D Underfill Encapsulation • Both types of underfill encapsulation processes can be simulated • Injection encapsulation • Encapsulation is achieved by injecting solid molding compound at high pressures • Dispensing encapsulation • Encapsulation is achieved through capillary force (surface-tension) • Effects of solders on flow can be accounted for accurately

  20. MPI/3D Underfill Encapsulation Injection Encapsulation Dispensing Encapsulation

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