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Moldflow Plastics Insight 3D: Advanced Plastic Flow Simulation

Moldflow Plastics Insight 3D (MPI/3D) predicts plastic flow for thick parts without a midplane, simulates behavior in 3D, optimizes mold design, eliminates part warpage, and offers various add-on options. Its true-to-life simulation includes mesh optimization, thin sections focus, mesh refinement, and automatic TET mesh generation. The software benefits from fast model preparation and provides deeper insight into plastics behavior in 3D for applications like insert overmolding, 2-shot overmolding, microchip encapsulation, fiber orientation prediction, gas-assisted injection molding, and more.

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Moldflow Plastics Insight 3D: Advanced Plastic Flow Simulation

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  1. MoldflowPlastics Insight 3D

  2. MPI/3D

  3. What does MPI/3D do ? • Predicts plastic flow for thick parts & parts which have no midplane • Direct analysis of solid CAD models • Simulates plastics behavior in 3D • Optimize mold and cooling circuit design • Identify and eliminate part warpage • Add-on option to MPI/Flow, MPI/Cool, MPI/Warp, MPI/Gas, MPI/Fiber and MPI/Reactive Molding

  4. MPI/3D Features • True-to-life simulation of how plastic flows in 3D • Full Navier Stokes solver including • inertia effects • gravity effects • Detailed solution of conservation equations • Non-Newtonian, non-isothermalMaterial Model

  5. Automatic 3D TET Mesh Generator • Automatic anisotropic mesh refinement • Refines CAD mesh formats • SDRC Universal • Nastran Bulk Data File • Patran Neutral File • Ansys Prep 7 • Ability to convert a triangular surface mesh into 3D tetrahedral elements

  6. Old: 56,000 tetras New: 34,000 tetras Mesh Optimization • Mesh optimization focuses specifically on Thin sections • Uses surface mesh matching to create internal layers with fewer nodes • Refrains from splitting surface facets and thereby reduces dense patches of mesh • Mesh size should decrease significantly, resulting in faster analysis times

  7. MPI/3D Benefits • Fast model preparation • True 3D plastics flow, cool and warpage simulation • Insert Overmolding • 2-Shot Overmolding • Gas Assisted Injection Molding • Prediction of fiber orientation in 3D • Microchip Encapsulation • Deeper insight into plastics behavior

  8. 3D Flow

  9. 3D Cool

  10. 3D Warp

  11. 3D Fiber

  12. 3D Gas

  13. Cavity Insert MPI/3D Insert Overmolding • Import part inserts as solid model and mesh with 3D Tetrahedral elements • Specify temperature & material properties of the insert • Obtain temperature variation within the insert for the entire molding cycle • Mesh along interface of the part and insert does not need to match • Supported for both thermoplastic & thermoset applications

  14. MPI/3D Insert Overmolding 3D Flow Insert Temperature

  15. MPI/3D 2-Shot Overmolding

  16. MPI/3D Microchip Encapsulation • Microchip encapsulation can be simulated using 3D tetrahedral elemental models • Areas filled with epoxy can be meshed with 3D tetrahedral elements • Benefits include easier modeling and improved results accuracy

  17. MPI/3D Microchip Encapsulation Paddle Shift Pressure (MPa) Paddle Shift Displacement (mm)

  18. MPI/3D Microchip Encapsulation Wire Sweep - Comparison with Experiment

  19. MPI/3D Underfill Encapsulation • Both types of underfill encapsulation processes can be simulated • Injection encapsulation • Encapsulation is achieved by injecting solid molding compound at high pressures • Dispensing encapsulation • Encapsulation is achieved through capillary force (surface-tension) • Effects of solders on flow can be accounted for accurately

  20. MPI/3D Underfill Encapsulation Injection Encapsulation Dispensing Encapsulation

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