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Microelectronics & Device Fabrication. Vacuum Tube Devices. Thermionic valve. Two (di) Electrodes (ode). Vacuum Tube Devices.
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Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)
Vacuum Tube Devices ~1940, ENIAC was constructed at the Moore School of Electrical Engineering at the University of Pennsylvania. It consisted of 19,000 vacuum tubes, 1,500 relays, hundreds of thousands of resistors and capacitors; all told, including power supply and an air cooling system, it weighed over thirty tons and consumed 200 kilowatts of electrical power. Electronic numeric integrator and computer (ENIAC) (1946) $ 400.000
Solid State Devices • Transistors (BJT, FET, etc.) • Semiconductor materials can generate and sense light OPTOELECTRONIC DEVICES • They can also sense magnetism, temperature, pressure variety of SENSOR devices and TRANSDUCERS (energy converters) appeared on the market.
Although semiconductor diodes and transistors are still widely used as individual components, • 1959: Robert Noyce discovered that more than one transistor could be constructed on a single piece of semiconductor material. • Then other components (resistors, capacitors, etc.) were added with transistors and then interconnected to form a complete circuit on a single chip or piece of semiconductor material. Integrated Circuit (IC) or IC Chip
Smaller and thinner than a dime, this tiny silicon chip contains millions of transistors that work together
Steps • Growth of Semiconductor • Device Fabrication • Oxidation • Patterning (lithography, deposition, etching) • Packaging
Growth of Semiconductors • Growth from a melt (Czochralski Method) • Epitaxial Growth: Chemical Vapor-Deposition, Liquid-Phase Epitaxy, Molecular Beam Epitaxy
Growth From a Melt: Czochralski Method Cleaning, sectioning...
Device Fabrication Techniques • Oxidation Gas Diffusion of oxygen SiO2 Silicon
MicrofabricationEtching & Deposition See «How do they make Silicon Wafers and Computer Chips?» at youtube Detail of an etch step Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication
Patterns created with subsequent layers of photoresist, elemental gas deposition, and/or etching and metal deposition.Source: wikicommons Schematic structure of a CMOS chip, as built in the early 2000s.