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Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003

Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003. The PADOVA Gluing Team: Daniela Fabris 2 Marcello Lunardon 1,2 Francesca Soramel 3, 4 1 Dept. of Physics of the University of Padova 2 INFN Sezione di Padova

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Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003

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  1. Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10.03.2003 The PADOVA Gluing Team: Daniela Fabris2 Marcello Lunardon1,2 Francesca Soramel3,4 1 Dept. of Physics of the University of Padova 2 INFN Sezione di Padova 3 Dept. of Physics of the University of Udine 4 INFN Sezione di Trieste-Gruppo collegato di Udine for the ALICE collaboration

  2. INDEX • Assembling the SPD • Test protocol for glue selection • First results • What next

  3. TheGluing Tasks for the SPD TASK 1: ASSEMBLING THE HALF STAVE ( BARI ) HALF STAVE TASK 2: ASSEMBLING THE HALF STAVES ON THE CARBON FIBER SECTOR SUPPORT ( PADOVA ) CFSS

  4. Assembling the Silicon Pixel Detectors (I) TOP VIEW BOTTOM VIEW BACK SIDE OF THE CHIP GROUNDING FOIL WITH WINDOWED KAPTON LAYER

  5. Assembling the Silicon Pixel Detectors (II) Carbon Fiber Sector Support Cooling Duct

  6. Assembling the Silicon Pixel Detectors (II) THERMAL ADHESIVE PADS

  7. Assembling the Silicon Pixel Detectors (II) Half Stave UV GLUE

  8. Assembling the Silicon Pixel Detectors (II) Carbon Fiber Clips UV GLUE

  9. Assembling the Silicon Pixel Detectors (III) • Main problems to be studied: • thermal contact • mechanical stability with UV glue The two problems are independent in the new mounting scheme

  10. TEST PROTOCOL (I) Thermal compound tests • TC.a) preliminary adhesion tests • how glues look like • TC.b) thermal conductivity measurements • measurements for about 0.1 mm adhesive thickness used in working conditions •  first reduction of candidates • TC.c) glue spreading tests • spreading the thermal adhesive on windowed kapton-glass samples fixed above the cooling duct with UV glue and with pressure control • glue spreading procedures • TC.d) thermal contact reliability tests w.r.t. thermal cycles • test of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedures •  best candidate(s) selection and definition of the gluing procedure

  11. TEST PROTOCOL (II) • TC.e) test of compatibility with Bari glue (ECCOBOND 45) • verify thecompatibility between the thermal compound and the adhesive used to glue the grounding foil on the bottom side of the half stave • TC.f) irradiation tests with best candidate(s) • thermal contact reliability test of best candidate(s) after irradiation •  final selection of thermal compound Mechanical assembly with UV glue • UV.a) UV gluebasic tests • - test the gluing strength with kapton-glass samples to be glued on CFSS • - tests of ungluing - tests of clip mounting  UV glue quantity and curing time • UV.b) irradiation tests • - test the UV glue before and after irradiation

  12. LIST OF THERMAL COMPOUNDS

  13. FIRST TEST RESULTS • TC.a) Preliminary adhesion tests • test of adhesion for thermoplastic adhesive •  easy to handle, but very difficult to get a good contact in working conditions (low pressure, air ). Problems to reach the polymerization temperature  rejected • TC.b) Thermal conductivity measurements • Measurement of thermal conductivity of a 0.1 mm thick adhesive layer for glues and greases •  see next slides • UV.a) UV glue basic tests • first trial of assebly and unassembly with UV glue •  see next slides

  14. THERMAL CONDUCTIVITY TESTS (I) Let be: DISC 1 at T1 DISC 2 at T2 R dissipating a power W x the thickness of the glue A the area of the glue W = k A (T1 -T2) / x k = x W / (T1 - T2)A •T from R(PT100) and tables (0.387 W / K) • Corrections for power dispersion and thermal resistance between PT100 sensors applied

  15. THERMAL CONDUCTIVITY TESTS (II) expectedDT/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm2 thermal contact window

  16. FIRST UV GLUE TESTS (I) The tooling for UV gluing tests in Padova is almost ready...

  17. FIRST UV GLUE TESTS (II) ... meanwhile, some hand-made trial:

  18. WHAT NEXT • TC.b) thermal conductivity measurements: • completed • TC.c) glue spreading tests: • mechanics for tests just completed; starting soon • UV.a) UV glue tests: • first assembly and unassembly trials with clips done; mechanics for tests just completed; starting soon more quantitative tests • TC.d) thermal contact reliability tests w.r.t. thermal cycle: • mechanical setup and heaters defined, to be realized • TC.e) test of compatibility with Bari glue: • setup to be defined • TC.f/UV.b) irradiation tests with best candidate(s): • setup for both thermal adhesive and UV glue: to be defined

  19. THE END

  20. INVENTARIO More electronics and mechanics for tests

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