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2. Introduction to Design Rules

This article provides an overview of design rules, including the importance of confidentiality, lambda-based design, basic design rules for N- and P-channel MOS, interconnect design rules, and supply design rules. It also discusses the advantages and disadvantages of lambda-based design and provides examples and demonstrations of various design rules.

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2. Introduction to Design Rules

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  1. 2. Introduction to Design Rules Etienne Sicard etienne.sicard@insa-tlse.fr http://intrage.insa-tlse.fr/~etienne

  2. Summary 1. Why confidentiality 2. Lambda based design 3. Basic design rules 4. Interconnect design rules 5. Supply design rules 6. Conclusion E. Sicard - Design rules

  3. 1. Why Confidentiality • Extremely strict in the past • Non-disclosure agreement • No copy • but • Most info is available on the web • SIA roadmap predict rules for the next 10 years • The document includes specific advances and weaknesses of the technology E. Sicard - Design rules

  4. 2. Lambda based design • Layout drawn on an integer grid • Grid unit fixed to  = half of technology forever Poly gate = 2  0.12µm,  = 0.06µm E. Sicard - Design rules

  5. 2. Lambda based design •  Good points • Enables technology changes • Enable design reuse • Reduce design cost •  Bad points • Not optimal design • Rarely used in industry E. Sicard - Design rules

  6. 3. Basic design rules 4 N-channel MOS 6 6 N+ 3 Metal 2 Not optimal but design reuse E. Sicard - Design rules

  7. 3. Basic design rules P-channel MOS P+ 6 2 0 N+ 3 nwell 2 No floating well E. Sicard - Design rules

  8. 3. Basic design rules Inverter with same nMOS and pMOS sizes pMOS carriers are twice slower than nMOS carriers Demo E. Sicard - Design rules

  9. 3. Basic design rules • Minimize spared diffusion • Use minimum poly width (2) • 1 contact = 1mA • Multiply contacts E. Sicard - Design rules

  10. 3. Basic design rules • Same N and P alters symmetry • L min • Wpmos=2 Wnmos E. Sicard - Design rules

  11. 2 metal 3 metal 3. Basic design rules • Supply in metal 3 • Use stacked vias • Routing strategy metal 2 vertical, metal 3 horizontal E. Sicard - Design rules

  12. 3. Basic design rules Design Rule Checker E. Sicard - Design rules

  13. 4. Interconnect design rules • Up to 6 metal layers • Metal 2,3,4 identical • Metal 5,6 thicker, larger to be used for supply and long routing E. Sicard - Design rules

  14. 4. Interconnect design rules Demo E. Sicard - Design rules

  15. 5. Supply design rules • Aluminum is sensitive to electro-migration • metal 2,3,4: 1.5mA/µm • metal 5,6: 3 mA/µm • contact, vias: 1mA • 1% fail in 20 years, 125°C E. Sicard - Design rules

  16. Conclusion • Confidentiality protects advances and weaknesses • Lambda-based design features easy reuse • Basic rules investigated • Interconnect design rules described • Power supply design rules introduced • Illustration made for 0.12µm E. Sicard - Design rules

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