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THE POSSIBLE OF IMPOSSIBLE. // Motherboard Partners. CHIPSET PARTNERS. // company overview. Established in 1994 . Over 70 R&D engineers plus120+ staffs. 20,000 Sq-Ft. head office located in Shenzhen. Branch Offices:.
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// Motherboard Partners CHIPSET PARTNERS
// company overview • Established in 1994. • Over 70 R&D engineers plus120+ staffs. • 20,000 Sq-Ft. head office located in Shenzhen. Branch Offices: • 4 branch offices in major cities of China: Wuhan, Beijing, Shenzhen and Hefei. • European branch offices: Spain, Germany, UK, and Austria; warehouse in Netherland. • Channel partners: Australia, South Korea, Philippines, Malaysia, Indonesia, India, Vietnam and Thailand.
// company overview Worldwide Distribution: United Kingdom Germany Austria Spain Italy Beijing South Korea Hefei Shenzhen Hong Kong India Thailand Vietnam Malaysia Indonesia Australia J&W Technology Limited.
//organizationalchart CEO Sales (Key Account) R & D Centre Overseas Sales Local Customer Technical Director Testing & Evaluation Project Manager Technical Support Design Dept After Sales Service Software Dept QC Dept CAD Dept PMC & Production Engineer Dept Human Recourse Signal Testing Financial Dept
// Logistic Control • Certified and Select Suppliers to ensure the quality and consistency materials for production. • Frequent communication and evaluation with clients and suppliers to ensure our best services to our partners. • Applied “King Dee K3 System” on material inspection and distribution. • Keep close relationship with suppliers. • Flexible and effective production planning to meet the prompt delivery and market changes.
// Production Facilities Shenzhen Yong Fu Factory Address: BaoAn district, Fu Yong, Fu Tong industrial area. Employees:4,000+ Space:29,436Square meters Products: Desktop Computersand Laptop boards. Production lines:SMT 51, DIP 21
// Production Facilities • 20 fully automatic high-speed SMT lines. • Monthly output 500K + + in 2 facilities. • 1500+ workers, working round the clock. • RoHS production facilities.
// Production Facilities >> DIP TYPE >> Support Complicated PCB Assembly in DIP type. 0603chip, WCSP(ball size0.26 mm) 0.4㎜ PIN Spacing QFP, BGA, CSP
//QC inspectionFacilities >> AOI (Reflow) >> AOI (Solder pasteinspection facility /3D) >> X-Ray
// reliability testing >> Burnt in test >> Fall test >> RoHSXRF Equipment >> Vibration Test
THE POSSIBLE OF IMPOSSIBLE For more information please visit our website at: www.jwele.com