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MGPA Status Layout finished, checked, & transmitted to CERN die size: 4mm x 4mm

MGPA Status Layout finished, checked, & transmitted to CERN die size: 4mm x 4mm Target package: 100 pin QFP - 14mm x 14mm - 0.5mm pin pitch - 1.8 mm package height above board surface. Action list following design review (Jan 13 th ) (priority order)

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MGPA Status Layout finished, checked, & transmitted to CERN die size: 4mm x 4mm

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  1. MGPA Status Layout finished, checked, & transmitted to CERN die size: 4mm x 4mm Target package: 100 pin QFP - 14mm x 14mm - 0.5mm pin pitch - 1.8 mm package height above board surface MGPA Status

  2. Action list following design review (Jan 13th) (priority order) • Investigate and improve Power Supply Rejection: • - see note http://www.hep.ph.ic.ac.uk/~dmray/pdffiles/MGPA_PSR.pdf • Quantify timewalk of pulse peak dependence on process spread • - pk-pk variation ~ 3ns, more detailed note in preparation • MGPA O/P: ADC I/P simulation • - some work begun but more needed • Further study of transmission line effects between APD/VPT and MGPA • - observed ringing at charge amp O/P depends on characteristics of unterminated transmission line • (length, impedance, APD/VPT capacitance), not on MGPA • - detailed dimensions of flexible APD/MGPA interconnect would be useful • Gate test pulse control input with bit from I2C general purpose register -> done • Provide details of pulse shape on falling edge of saturated channels • - any problem here fixed by hysteresis introduced in range change following ADC • Preliminary testing plans (at Imperial) • Electrical performance: MGPA in isolation • - look at details of linearity, pulse shape matching, noise • - quantify consistency with simulated performance • Test setup needs development • (14 bit, 100 MHz VME ADC will be available) MGPA Status

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