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Mission Profile Aware IC Design - A Case Study -

Mission Profile Aware IC Design - A Case Study -. Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University of California , San Diego.

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Mission Profile Aware IC Design - A Case Study -

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  1. Mission Profile Aware IC Design- A Case Study - Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University ofCalifornia, San Diego This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C

  2. Overview • Introduction • Design Challenges • Mission Profile Aware Design • Case Study – Electromigration Aware IC Design • Summary and Conclusion Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  3. Introduction ECUs, mechatronics sensors MEMS sensors Tier 2 Tier 1 Semiconductors OEM OEM – Original Equipment Manufacturer 25-Mar-14

  4. Introduction Electronic Control Unit for ESP Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  5. Introduction Tier 2 + Tier 1 ECU for Driver Assistance Acceleration Sensor Module Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  6. Introduction Temperatures Responsibility Parameters Ambient Temperature (Car) OEM Environment Installation Location (Car) ECU Housing Tier 1, OEM System DesignPackaging Constraints ECU (internal) Tier 1 Component Pin Tiers 1 and 2 Foundry Functional Load Constraints Tier 2 Foundry Device Junction Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  7. Introduction • IC Technology Node Evolution Smart-Power HV-CMOS CMOS automotive CMOS leading edge (ITRS) Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  8. Design Challenges • Aggressive technology scaling • Time to market  co-design • System partitioning and integration • Robustness • Application requirements: • Origin and cause of requirements replicability, quality • Impact on application design and technologies • Application use  operating conditions, environmental load • Functional loads  thermal, current, voltage, ... • Reliability dominant failure mechanisms • Complex, heterogeneous and fragmented design flows Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  9. Design Challenges • Aggressive technology scaling • Time to market  co-design • System partitioning and integration • Robustness • Application requirements: • Origin and cause of requirements replicability, quality • Impact on application design and technologies • Application use  operating conditions, environmental load • Functional loads  thermal, current, voltage, ... • Reliability dominant failure mechanisms • Complex, heterogeneous and fragmented design flows Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  10. Overview • Introduction • Design Challenges • Mission Profile Aware Design • Case Study – Electromigration Aware IC Design • Summary and Conclusion Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  11. Mission Profile Aware Design Supply Chain OEM Tier 1 Tier 2 ... Tier n ... Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  12. Mission Profile Aware Design Design Chain OEM MP MP MP MP Tier 1 MP MP MP MP Tier 2 ... Tier n ... Requirements, Constraints, Functional Loads, Environmental Loads Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  13. Mission Profile Aware Design Design Chain OEM MP MP MP MP Tier 1 MP MP MP MP Tier 2 ... Tier n ... NEW: Achieved Robustness, Dominant Failure Mechanisms  RIF Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  14. Mission Profile Aware Design • Design Flow Overview 2 1 5 3 3 4 4 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  15. Mission Profile Aware Design • Consistent consideration of mission profiles (MP)in supply chain • Reduction of design uncertainty • More precise requirements and stress factors • Better understanding of system (failure mechanisms) • Formalized and improved communication • OEM Tier n and Tier n  OEM • Standardization of structure and content of MPs • Electronic format  MP documents • RMP Framework (Tool-independent platform for mission profile aware design) Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  16. Mission Profile Aware Design • Mission Profile Document • Document header • Operating states definition • Component definition • Property definition • Back-annotation data Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  17. Mission Profile Aware Design • Mission Profile Document • Document header • Author • Timestamp • Document history • Mounting location • Operating states definition • Component definition • Property definition • Back-annotation data Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  18. Mission Profile Aware Design • Mission Profile Document • Document header • Operating states definition • Generic data container for operating states • Manufacturing, assembly, storage, ... • Car: start, acceleration, breaking, stop&go, freeway cruising, ... • IC: power-up, idling, power-down, mode_1, mode_2, ... • Component definition • Property definition • Back-annotation data Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  19. Mission Profile Aware Design • Mission Profile Document • Document header • Operating states definition • Component definition • Type  e.g. ECU, passive component, IC, sensor, ... • Device I/O port definition (*) • Operating state dependent environmental and functional loads • Heat flow • Transient/effective voltages and currents • ... • Profiles • Property definition • Back-annotation data (*) A port is a generic object: thermal port or electrical port Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  20. Mission Profile Aware Design Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  21. Mission Profile Aware Design • Mission Profile Document • Document header • Operating states definition • Component definition • Type • Device I/O port definition • Profiles: • Temperature histogram, gradient and cycling • Humidity vs. temperature histogram • Vibration • ... • Property definition • Back-annotation data Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  22. Mission Profile Aware Design Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  23. Mission Profile Aware Design • Mission Profile Document • Document header • Operating states definition • Component definition • Property definition • Back-annotation data • Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms • Robustness: Enhanced Worst-Case Distance (WCD) Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  24. Mission Profile Aware Design Component Properties • ComponentParameter • ECU TEEM_Package, TVMLA, TEEM_internal, TComp.Package , ... • Board TBoard , ... • Package TComp.Package, TComp.Pins, Rth, ... • Chip TJunction, ... • Sensor • Discrete device, ... Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  25. Overview • Introduction • Mission Profile Aware Design • Case Study – Electromigration Aware IC Design • Summary and Conclusion Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  26. EM Aware Design – Case Study • Quality of Functional Load Data Classic Design Flow Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  27. EM Aware Design – Case Study Cell-Level Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  28. EM Aware Design – Case Study Block-Level Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  29. EM Aware Design – Case Study Electromigration (EM) • Quality of Functional Load Data I I = 1A DC EM EOS RPP Voids Voids Hillock Hillock AE/QMM Electrical Overstress (EOS) t Abnormal peak event AE/QMM I Imax = 1A + Duty cycle Repetitive Power Pulsing (RPP) EM EOS RPP t Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego AE/QMM

  30. EM Aware Design – Case Study Current (Density) Aware Routing to prevent EM and EOS Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  31. EM Aware Design – Case Study • Effective Design Parameters Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  32. EM Aware Design – Case Study • Electromigration Aware Design Flow 1 3 2 4 4,5 5 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  33. EM Aware Design – Case Study • Current Density Critical Nets – Automotive IC A Different Mission Profile Next technology node Base node Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  34. EM Aware Design – Case Study • Current Density Critical Nets – Automotive IC B Next technology node Different Mission Profile Base node Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  35. Overview • Introduction • Design Challenges • Mission Profile Aware Design • Case Study – Electromigration Aware IC Design • Summary and Conclusion Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  36. Summary and Conclusion • Consideration of robustness as design target is essential for automotive electronic designs • Consistent consideration of mission profiles within the design chain is required (bi-directional flow) • Current aware design is driven by mission profiles • Mission profile aware design: • Vendor- and EDA tool-independent  focus on design flow • Reduction of design uncertainty • Formalized and improved communication Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

  37. Thank You! Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University ofCalifornia, San Diego

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