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Why we clean; What we clean.

Learn why cleaning is crucial for electronic assembly performance, cosmetics, and contractual reliability. Discover the standards, process, and equipment needed to achieve optimal results.

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Why we clean; What we clean.

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  1. Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

  2. Why clean? Performance Cosmetics Contractual Reliability It Pays to CLEAN

  3. IPC/EIA J-STD 001/DRequires Clean BoardsClass B & C Electronics • 8.3.1 No Particulate matter (all classes) • No lint, solder splash, dross, wire clippings • No loose or dislogable solder balls • 8.3.2 Unless otherwise specified (all classes), assemblies shall be cleaned and be: • Free from flux residue (1X) • < 1.56 micrograms/cm2 NaCl equivalent ionizables • Appendix B standardizes a testing protocol to be used when implementing new flux materials or validating a cleaning process change • SIR, ROSE, Ion Chromatography

  4. Confusion leads to poor choices • Saving a dollar by not cleaning may cost $100’s of repairs or worst, lost customers • Exponential rule of repair • Repair @ board level = $1 • Repair @ assembly level = $10 • Repair @ customer level = $100

  5. Soils to Clean Dust & Dirt Solder balls Oils Solder Paste Plating salts Adhesives Finger prints Fluxes

  6. Critical Questions to answer in Selecting a Winning Cleaning Process • What are we cleaning? • What standard(s) apply? • What solvent are we using? • What equipment is selected? • How are we going to qualify • and control the process?

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