1 / 7

Thin Wafer Processing and Dicing Equipment Market US$692.5 mn by 2024 - TMR

Thin Wafer Processing and Dicing Equipment Market is expected to rise at a CAGR of 6.80% during the period from 2016 to 2024<br>

harshadtmr
Download Presentation

Thin Wafer Processing and Dicing Equipment Market US$692.5 mn by 2024 - TMR

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Thin Wafer Processing and Dicing Equipment Market Thin Wafer Processing and Dicing Equipment Market (Application - Logic and Memory, Micro Electro Mechanical Systems (MEMS), Power Device, Radio Frequency Identification (RFID), and CMOS Image Sensor; Wafer Thickness - 750 micrometer, 120 micrometer, and 50 micrometer; Dicing Technology - Blade Dicing, Laser Dicing, and Plasma Dicing) - Global Industry Analysis, Trend, Size, Share and Forecast 2016 - 2024 ©2019 Transparency Market Research, All Rights Reserved

  2. Table of Content: Thin Wafer Processing and Dicing Equipment Market

  3. Thin Wafer Processing and Dicing Equipment Market • Application • Logic and Memory • MEMS (Micro Electro Mechanical Systems) • Power Device • RFID (Radio Frequency Identification) • CMOS Image Sensor • Dicing Technology • Blade Dicing • Laser Dicing • Plasma Dicing • Wafer Thickness • 750 μm • 120 μm • 50 μm

  4. Thin Wafer Processing and Dicing Equipment Market: Snapshot

  5. Report Highlights Global market for thin wafer processing and dicing equipment substantially. In 2015, the global market for thin wafer processing and dicing equipment garnered US$388.9 mn in revenues, which, with an expected CAGR of 6.80% between 2016 and 2024, is likely to increase to US$692.5 mn by the end of 2024 Major Key Player EV Group, Plasma-Therm LLC, Lam Research Corp, Advanced Dicing Technologies, and Tokyo Electron Ltd. Request Sample of Report ©2019 Transparency Market Research, All Rights Reserved

  6. About Us Transparency Market Research (TMR) is a market intelligence company, providing North America business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision-makers. We have an experienced team of Analysts, Researchers, and Consultants, who use proprietary data sources and various tools and techniques to gather and analyze information. Our business offerings represent the latest and the most reliable information indispensable for businesses to sustain a competitive edge. Each TMR Syndicated Research report covers a different sector—such as pharmaceuticals, chemical, energy, food & beverages, semiconductors, med-devices, consumer goods, and technology. These reports provide in-depth analysis and deep segmentation to possible micro levels. With a wider scope and stratified research methodology, our syndicated reports strive to serve clients and satisfy their overall research requirement.

  7. To know more about us, please visit our website: www.transparencymarketresearch.com For sales queries or new topics email us on: sales@transparencymarketresearch.com For other queries contact:Nachiket Ghumare (Senior Business Development Manager) 90 State Street, Albany NY – 12207, United States Tel: +1-518-618-1030 Email: nachiket@transparencymarketresearch.com T H A N K Y O U

More Related