1 / 25

F1 Contribution to TESLA Vertex Detector

F1 Contribution to TESLA Vertex Detector. Tobias Haas 13 Febuary 2001. Overview. Quick Summary of Previous Presentation Summary of Visits to Strasbourg and RAL Proposal F1/Uni HH Contributions. Vertex Detector Base Design. 5 Layers 20 x 20 m 2 pixel CCD Sensor thickness < 60 m

herman
Download Presentation

F1 Contribution to TESLA Vertex Detector

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. F1 Contribution to TESLA Vertex Detector Tobias Haas 13 Febuary 2001

  2. Overview • Quick Summary of Previous Presentation • Summary of Visits to Strasbourg and RAL • Proposal F1/Uni HH Contributions

  3. Vertex Detector Base Design • 5 Layers • 20 x 20 m2 pixel CCD • Sensor thickness < 60 m • 799 Mpixels • Readout time 50 s

  4. Sensor Technology Choices • MAPS (monolithic active pixel sensor)  Visit of Strasbourg Group 3/4 December • Alternative to CCDs • CCD Very low power consumption  Visit of RAL Group 29/30 January • SLOW • HAPS (hybrid active pixel sensor) • Insufficient granularity? • High power comsumption? • Too much material? • DepFets (MPI Munich)

  5. MAPS Effort

  6. MAPS … • Hi Resolution/Lo mass competitive with CCDs • Standard CMOS VLSI technology • Same substrate for detector and electronics • Radiation hardness (no bulk charge transfer)

  7. MAPS R&D • Sensor Development • Mimosa IV Chip: 4 x 64x64 • Mimosa V coming • Backthinning • Mechanical Support as with CCDs • Radiation Hardness

  8. Mimosa V

  9. Visit to Strasbourg 3/4 Dec • T. Carli, U. Kötz, W. Zeuner, T. Haas • Excellent overview of the current state of the project • Saw Mimosa IV working in the lab • Saw Chip design capabilities of LEPSI • Very impressed by the effectiveness of this small group • Our Collaboration would be very welcome.

  10. CCD Effort

  11. CCDs … • … can be fairly large (100 x 25 mm2) • … requires column-parallel readout • … minimal amount of material per pixel • … charge transport over ~ cm (charge loss!)

  12. CCD R&D • Readout speed • Clocking: 5 MHz (SLD)  50 MHz • Column-parallel readout • Thinning (Goal: 0.06% Xo /layer) • Mechanical • Substrate-free mounting? • Readout Chip • Bump-Bonding R/O chip to CCD

  13. CCD Recent Developments • CCD Prototype (CCD 78) runs at 50 MHz (fully serial output) • Important results on support and packaging: • Thinned Si plates show transversal warping • Substrate may be unavoidable

  14. Visit to RAL 29/30 Jan • E. Fretwurst, U. Kötz, G. Kramberger, B. Löhr, W. Zeuner, T. Haas • Excellent overview of the current state of the project • Saw CCD 78 working in the lab at 50 MHz (20 x 20 mm2 • The active group is much smaller than the list of names on the LCFI publications. • Very impressed by the effectiveness of this small group, particularly the younger people (Stefanov, Johnson) • Our Collaboration would be very welcome.

  15. Conclusions from our Visits • Both CCDs and MAPSs appear to be on the right track for a TESLA VXD. • Both groups have signalled that they would very much welcome our collaboration. • There are a number of interesting topics where we could collaborate that • fit our interests, • are suitable for our capabilities.

  16. Topics for Collaboration • Sensor Cooling (Engineering) • Simulations • Measurements • Radiation Hardness • Simulations • Test beam measurements • General Detector Design and Optimization • Simulations • Physics Studies • These topics are common to both technologies… …but the details are different!

  17. Which Technology? • Both technology will probably be ready in time! • Do we need to decide?  YES! • CCDs • Extremely elegant and potentially highest performance • Large homogeneous detectors • A working detector has been built with this technology (SLD VXD3) • Highly specialized technology that may depend on one company (Marconi) • MAPS • Performance matches CCDs • Commodity technology • Newcomer in this game!

  18. What Arguments? Technological/Scientific Will the technology do the physics? Will it be ready in time? Will the technology be available at sufferable cost? Group/DESY Where can we have the highest impact? Sociological Who do we expect to collaborate with most effectively?

  19. Proposal • 3 Teams (1 senior person + younger people to be recruited): • Set up a test stand for F1 & HH (Uli Kötz + X) • Start thinking about cooling (Bernd Löhr + Engineers + X) • Get involved in the MC and TESLA physics effort (T. Haas + X) • For the moment join the MAPS group.

  20. CCD R&D: Support With Be Substrate 30 m Si + Be 0.12% Xo (Be: 0.09%) Substrate-free 0.04% Xo?

  21. MAPS

  22. Support-free Suspension

More Related