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Session 5: Projects. Introduction to VLSI Interconnect Design. Project Topics. Physical Limits of Technology Scaling :. SCALING AND EFFICIENCY. Project Topics. RLC extraction :. Reducing Capacitance. Inductance Modeling. Skin Effect / Anomalous Skin Effect. Project Topics.
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Session 5: Projects Introduction to VLSI Interconnect Design
Project Topics Physical Limits of Technology Scaling : SCALING AND EFFICIENCY
Project Topics RLC extraction : Reducing Capacitance Inductance Modeling Skin Effect / Anomalous Skin Effect
Project Topics Interconnect Delay : High Speed Global On-Chip Interconnects Near Speed-of-Light On-Chip Electrical Interconnects Compact Model for Delay Moment-Matching Technique
Project Topics Interconnect Noise : Moment-Matching Technique
Project Topics Repeater Insertion:
Project Topics Bit Rate Limitation : Data Integrity : maximum data transfer rate. Digital communication Throughput-Centric Wave-Pipelined Interconnect
Project Topics Process Variations :
Project Topics Power Dissipation :
Project Topics Clock Distribution :
Project Topics 3D Integration: Electrical modeling of Interconnects in 3-D ICs
Project Topics Speed/Power/Area Tradeoffs :
Project Topics Power Distribution / Electromigration : • Design / Analysis / Optimization of power distribution network Local power distribution network Global power distribution network
Project Topics Impact of Cu vs. Al Metallization on Performance :
Project Topics Thermal Modeling of Metallic Interconnects :
Project Topics CNTs as Interconnect: PERFORMANCE COMPARISON BETWEEN COPPER, CARBON NANOTUBE, AND OPTICS FOR OFF-CHIP AND ON-CHIP INTERCONNECTS
Project Topics Optical Interconnects :