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Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM

Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM Europe 3, Swan & Dolphin Resort, Walt Disney World.

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Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM

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  1. Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM Europe 3, Swan & Dolphin Resort, Walt Disney World Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Dong W. Kim, Bing Dang, Kwang-Lung Lin, M. J. Yim, Daniel Lu, Jim Morris, Bill Chen, Ning-Cheng Lee, Chin C. Lee (Chair), C. P. Wong, Yu-Hua Chen. Agenda Introduction: each member introduced him/herself. Report on Webniar in Oct. 2013 Daniel Lu Report on Newsletters M J Yim Report of ECTC M&P Subcommittee Diptarka Majumdar IEEE CPMT Advanced Packaging Materials (APM) Symp., 2015: It was planed to be held in Shenzhen in Oct-Nov. 2015. At present, steering committee includes Tim Chen and Daniel Lu. Anything else: ITRS Assembly and Materials workgroups to organize a workshop as a part of APM 2015.

  2. CPMT-M&P News Letter Status MJ Yim CPMT-M&P TC Web Administrator

  3. Uploaded Newsletter and Contributors • 2014 • May 2014 News Letter- NEW! • CPMT MP TC Newsletter May 2014 DW KIM – Final (DW Kim @ Qualcomm) • 2013 • December 2013 News Letter • Silver flip-chip technology poster(CC Lee @UC Irvine) • November 2013 News Letter • 2013_Saint-Venant_CPMT_Materials_TC_120613(E. Suhr @Portland State Univ.) • October 2013 News Letter • IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013(MJ Yim @Intel) • August 2013 News Letter • CMPT MP TC Newsletter Aug 2013 (Paik)(KW Paik@KAIST) Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing.

  4. 2014 ECTC: M&P Subcommittee • Chair Diptarka Majumdar • Co-chair (outgoing) Stephanie Potisek • Incoming co-chair Bing Dang • Number of abstract submissions received Primary 89 • Secondary 77 • Number of abstracts accepted for presentation Oral 35 • Poster 17 • Sessions Chair Date Time • Adhesives, Underfills, TIMs Robert Kao May 28 8:00 AM • Don Frye • Novel Materials & Processes Ivan Shubin May 28 1:30 PM • Bing Dang • 3D Materials & Processing Myung Jin Yim May 29 1:30 PM • Daniel Lu • Solders & Bonding Mikel Miller May 30 8:00 AM • Grace Yi Li • Substrates Dong Wook Kim May 30 1:30 PM • Yu-Hua Chen

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