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CPU Power

CPU Power. Neil Goldsman and Akin Akturk. Task I: Coupled Modeling of Time-Dependent Full-Chip IC and Quantum Non-Isothermal Device Operation. Pentium III. Pentium III Temperature. Motivation : As devices get smaller on-chip thermal effects become increasingly important.

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CPU Power

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  1. CPU Power Neil Goldsman and Akin Akturk

  2. Task I: Coupled Modeling of Time-Dependent Full-Chip IC and Quantum Non-Isothermal Device Operation Pentium III Pentium III Temperature

  3. Motivation: • As devices get smaller on-chip thermal effects become increasingly important. • Predictions indicate that chip temperatures will increase exponentially beyond acceptable values. • Thus modeling of full-chip heating is essential for the design of fail-safe architectures in both 2D and 3D. • Objective : • Develop heating models for 2D and 3D IC’s. • Predict circuit and chip performance variations due to chip heating. • Test the model and develop temperature sensors by fabricating specially • designed chips.

  4. Functional Blocks in Pentium III % Area % Power 0 Bus Interface Unit 4.25 6.2 1 Clock 1.00 5.2 2 L1 Data Cache 12.5 9.8 3 Memory Order Buffer 3.25 4.7 4 Execute 9.45 13 5 L2 Data Cache 29.75 8.5 6 Register Alias Table 3.25 4.7 7 Issue 9.45 14.1 8 Fetch 12.5 16.8 9 Decode 14.6 17.2 Source: www.intel.com

  5. Thermal Network Containing Millions of Nodes KCL-type lumped thermal network Pentium has 40 million nodes MOSFET devices and their thermal connections

  6. Schrödinger Eqn. Poisson Eqn. Electron Current Continuity Eqn. Hole Current Continuity Eqn. Heat flow Eqn. Device Equations

  7. Integrated Circuit Heat Flow Equation

  8. Flowchart Coupled Flowchart

  9. Device Simulations MOSFET IV Curves for T=300K and 400K; VGS=0.4, 0.7, 1.0V Temperature profile in the channel of a MOSFET; Far left and right corners are source and drain sides, respectively. Far side is parallel to gate terminal.

  10. Chip Simulations & Cooling with Thermal Contacts Maximum chip temperature for different device counts with constant power density. Temperature profile for a 0.5cm IC with uniform device activity throughout the chip: Temperature Isotherms range from 300K at the chip edges to 360K inside chip. Maximum chip temperature as a function of uniformly distributed thermal contacts. Thermal contacts cool chip

  11. Calculated Temperature Profile for Pentium III • Calculated Pentium III Temperature Profile with non-uniform device activity throughout the chip but with uniform device activity within each functional block: • Temperature Isotherms range from 300K at the chip edges to 340K inside the clock. • Clock and L2 Cache are the hottest and coolest regions, respectively.

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