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Mars Atmosphere and Volatile EvolutioN (MAVEN) Mission. Particles and Fields Package Critical Design Review May 23 -25, 2011 Christopher Smith, Thermal Engineer. Current Work Flow. UCB builds individual instrument thermal models (DONE) SWIA, STATIC, SEP, LPW, PFDPU, and SWEA
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Mars Atmosphere and Volatile EvolutioN (MAVEN) Mission Particles and Fields Package Critical Design Review May 23 -25, 2011 Christopher Smith, Thermal Engineer
Current Work Flow UCB builds individual instrument thermal models (DONE) SWIA, STATIC, SEP, LPW, PFDPU, and SWEA LM provides sink temperatures for UCB boundary node spacecraft UCB modifies instruments to meet requirements in all provided environments (DONE) UCB submits these models to spacecraft provider (LM) who incorporates them into the spacecraft thermal model. (DONE) LM returns spacecraft thermal model with integrated instrument models (DONE) LM had some issues, so far it looks like they are all modeling problems with the reduced instrument models (IN PROGRESS) UCB uses spacecraft model to address any issues and returns updates to LM (IN PROGRESS) LM responsible for producing official predicts for mission
Current Status Instrument Thermal Predicts (Complete) Spacecraft model running at UCB with full instrument models integrated Instrument updates on to be delivered to LM by 06/06/11 Deep Dip and Thruster heating analysis (Complete) Spacecraft case sets include proper deep dip environments Deep dips bound thruster environments 650 W/m2 vs. 300 W/m2 LPW boom thermal treatment changed (Complete) Black Nickel originally specified but it alters the mechanical behavior of the boom DAG 213 susceptible to AO degradation Single coat satisfies nominal mission life Thicker coat in evaluation for increased margin PFDPU detailed board analysis not complete (In Progress) Analysis using distributed board properties complete Initial modeling and lessons learned from RBSP indicate detailed board analysis should be performed on 4 highest dissipation boards Detailed Preamp to Whip thermal model needed (In Progress)
Environmental Loads Values above from LM Case Sets Thruster flux combination of ACS and TCM firings
Optical Properties All Materials approved by GSFC and JPL on previous missions Added testing for AO exposure Clear Alodine done by one plater with specified soak time. Extensive sampling with THEMIS. Occasional sampling with other missions. Wide BOL/EOL variance assumed in design
SWIA Thermal Model Germanium Black Kapton Blanket Black Nickel + Grid (Not Shown) Blanket, 1.5 Sides Black Nickel Power Dissipation: 1.85 W +/- 10% Mass: 2.5 kg Conduction to SC Isolated 4 #8 Titanium with .25" G10 Isolator = .013 W/C each
STATIC Thermal Model Germanium Black Kapton Blanket Black Nickel + Grid (Not Shown) Blanket, 1 Side Black Nickel Power Dissipation: 3.96 W +/- 10% Mass: 2.9 kg Conduction to APP Isolated 4 #8 Titanium with .25" G10 Isolator = .013 W/C each
SWEA Thermal Model Blanket Black Nickel 50 % Blanket 50% Black Nickel Power Disipation: .89 W +/- 10% Mass: 1.8 kg SC Balance Mass: ~ 17 kg Conduction to SC Isolated 4 #8 Titanium with .25" G10 Isolator = .013 W/C each Blanketed Balance Mass
SEP Thermal Model Blanket White Paint, Z-93-C55 Power Disipation: 0.16 W +/- 10% Mass: .63 kg White Paint, Z-93-C55 Conduction to SC Isolated 4 #8 Titanium with .25" ULTEM 1000 Isolator = .011 W/C each
PFDPU Thermal Model Black Nickel Boards to Frame Conduction: Epoxied to frame at lip = .386 W/C 8 #4 Screws (screw path only)=.1 W/C total Frame Conduction to Adapter Plate: 22 #6 screws 0.42 = 9.24 W/C Adapter Plate Conduction to SC: 6 #10 bolts 1.32 each = 7.92 W/C Simple Distributed Board Models Power Disipation: 12.1 W +/- 10% Mass: 5.9 kg
LPW Thermal Model Whip PreAmp Power: 0.10 W +/- 10% Stowed Stacer and DAD Mass: 2.6kg Base Mech to Bracket Conductance: 6 #8 Ti with .25" G10 Isolator = .013 W/C each
LPW Thermal Model Clear Alodine (Inside Spacecraft Body Blanket) Titanium Nitride DAG 213 Black Nickel
Spacecraft Thermal Model Full Spacecraft Model • Boundary Node Spacecraft • All Surface Temps from LM Output • MLI Unbound
LM Science Case Definitions Science Cases Deep Dip Cases
Lockheed Thermal Memos #1 • SEP modeling issue found, LM Notified and producing new predicts
PFDPU Analysis Create detailed thermal model of high dissipation boards Include actual ground plane layout Include all components dissipating more than .1 W Current simple distributed property model is a good start Thermal / Ground planes need to grow as much as possible and overlap as much as possible. Thermal planes need to be brought to the edge of the board Maintain electrical isolation while improving thermal connections much as possible
LPW Stacer LPW Stacer needs to be black to help reject deep dip heat load Black Nickel was identified as a candidate and sent out for AO testing and it did well However when it was applied to a stacer it modified its mechanical behavior DAG 213 was identified as an alternative We have lots of experience with it and has been used on stacers before DAG 213 is susceptible to AO Testing shows it meets requirements for nominal mission life Investigating a thicker coat to add margin Plan to run a half-DAG Stacer model as well Current Deep Dip Stacer Max Temp = 55 C
LPW Whip LPW Whip is coated in titanium nitride, a=.46, e=.13 EOL Modeling error had this surface high emissivity until recently Thin wall titanium tube that is well isolated from preamp Whip doesn’t mind these temperatures but a detailed thermal model of the whip to preamp connection is required to be sure the preamp board is unaffected Whip End Titanium Whip Nut Bronze Hypertronics Socket Isolators PEEK PreAmp Board Whip .016” Titanium Wall Tube
LPW Launch Case (System Model) System Model is worst case for preamp temperature It has a simple high (100 W/mC) contact conductance between the whip tube and preamp body Preamp cap not modeled
LPW Launch Case (Detailed Model) Simple spreadsheet model of isolation shows a highly isolated path Detailed Model (SolidWorks) contains more detail also shows High isolation
Backup Slides Back Up Slides
Requirements Documents Performance Requirements Document MAVEN-program-plan-appendix-v28_L1Req.doc (Level 1) MAVEN-PM-RQMT-0005, Mission Requirements (Level 2) MAVEN-PFIS-RQMT-0016, PFP Requirements (Level 3) MAVEN-PF-STATIC-001A-Requirements_&_Specifications.xls (Level 4) Mission Assurance Requirements MAVEN-PM-RQMT-0006, Mission Assurance Requirements MAVEN_PF_QA_002, PFP Mission Assurance Implementation Plan Mission Operations MAVEN-MOPS-RQMT-0027, Mission Operations Requirements Environmental Requirements Document MAVEN-SYS-RQMT-0010 Spacecraft to PFP ICD MAVEN-SC-ICD-0007