Gene A Frantz Principal Fellow Texas Instruments

1. Personal and Portable: The technology that is making it happen Gene A Frantz Principal Fellow Texas Instruments

2. Decades of Digital Signal Processing Decade Characteristic $/MIPS ’60s ’70s ’80s ’90s Beyond University Curiosity Military Advantage Commercial Success Consumer Enabler $100 - $1,000 $10 - $100 $1- $10 10¢ - $1 1¢ - 10¢ Expected Part of Daily Life

3. Generations of DSP Processing Processors 1980 1990 Technology Product Technology What is DSP? How do I create a product? How do I solve problems?

4. Early DSP’ing Milestones • Before 1965: First tentative steps • 1965: Rediscovery of the FFT • 1965 to 1970: The potential becomes clear • 1970 to 1980: Tools are developed • 1980: VLSI makes it practical • Now: Incredible computational power opens up many new applications Courtesy of Ron Schafer

5. Some Early Contributors Bishnu Atal John Markel, Steen Gray John Makhoul Manfred Schroeder Courtesy of Ron Schafer

6. The TX-2 Computer, Circa 1967 Courtesy of Ron Schafer

7. Another Contributor Jack Kilby 1st Integrated Circuit

8. One View of DSP, Circa 1976 DSP “That discipline which has allowed us to replace a circuit previously composed of a capacitor and a resistor with two anti-aliasing filters, an A-to-D and a D-to-A converter, and a general purpose computer (or array processor) so long as the signal we are interested in does not vary too quickly.” Thomas P. Barnwell, III = Filter D/A Filter A/D IN OUT $50 $50 $500 $50 $50 Courtesy of Ron Schafer

9. Early DSP’or Milestones 1978: TI “Speak and Spell” DSP synthesizer 1979: Intel 2920 “Analog Signal Processor” 1979: American Microsystems International S28211 1980: NEC µPD7720 1980: AT&T Bell Labs DSP-1 (captive) 1982: TI TMS32010 Courtesy of Will Strauss

10. The Key Drivers “Smaller Features è Lower Cost/Functionè Larger Market” Plotted Annually History Forecast

11. Lithography AdvancementsFuel Growth 5922% increase in dpw Nano-meter 250nm 6" 19.2 1435 400nm 6" 80.7 310 350nm 6" 46.6 558 180nm 8" 10.7 2626 130nm 12" 6.7 12,186 90nm 12" 4.2 18,667 Die size (mm2) Dies per wafer

12. Shrinking Process: The Benefits Device Year Transistors Process 32010 1983 50,000 3.0um NMOS 32020 1984 100,000 2.4um NMOS 320C30 1988 500,000 1.0um CMOS 320C50 1990 1,200,000 0.8um 320C5510 2000 22,000,000 0.18um 320C556x 2002 180,000,000 0.13um

13. Wafer Fabs Wafer size: 300mm Final capacity: 35K+ wafers/ month Technology: 130nm copper 90nm copper # Tools on floor: 320 1st full flow silicon: 2-15-01 130nm qualification: 2Q02 90nm customerprototypes: 2H02 90nm qualification: 2H03 Fab Space Waffle table: 118K sq. ft. Total mfg: 150K sq. ft. Greater than 10K wafers per month

14. WirelessInfrastructure WirelessInfrastructure WirelessInfrastructure WirelessInfrastructure WirelessInfrastructure WiredInfrastructure WiredInfrastructure WiredInfrastructure WiredInfrastructure Wireless Client Wireless Client Wireless Client Performance Audio Wired Infrastructure Digital Still Camera Wireless Infrastructure 6 DSP CPU @ 300MHz 3MB integrated memory 180M transistors 6 DSP CPU @ 300MHz 3MB integrated memory 180M transistors 6 DSP CPU @ 300MHz 24Mbintegrated memory 180M transistors 6 DSP CPU @ 300MHz 3MB integrated memory 180M transistors 600 MHz Viterbi and Turbo hardware accelerators 600 MHz Viterbi and Turbo hardware accelerators 600 MHz Viterbi and Turbo hardware accelerators 600 MHz Viterbi and Turbo hardware accelerators 600 MHz Viterbi and Turbo hardware accelerators DSP+GPP Low power consumption Voice, data, video DSP+GPP Low power consumption Voice, data, video DSP+GPP Low power consumption Voice, data, video Wireless Client 225 MHz Floating point 6 DSP CPU @ 300MHz 3MB integrated memory 180M transistors DSP+GPP Imaging accelerators 600 MHz Viterbi and Turbo hardware accelerators DSP+GPP Low power consumption Voice, data, video TMS320C6416 TMS320C6416 TMS320C6416 TMS320C6416 TMS320C6416 TMS320C5561 TMS320C5561 TMS320C5561 TMS320C5561 OMAP5910 OMAP5910 OMAP5910 Digital Still Camera Digital Still Camera Performance Audio 225 MHz Floating point DSP+GPP Imaging accelerators DSP+GPP Imaging accelerators TMS320C5561 TMS320DA610 TMS320DM310 TMS320C6416 OMAP5910 TMS320DM310 TMS320DM310 TMS320DA610 130 nm Copper Technology Today

15. Over 400 million transistors on a single chip Functional integration to create entire system on one chip Delivery Initial test chips in 90 nm process – 1H02 First device – 2H02 Fully qualified production – 2H03 Result Cost-effective, system-on-a-chip Unprecedented performance levels Significant power savings 90 nm Transistor 37 nm 6" 12"

16. What will it cost? EUV 450 ? 157-nm 300-mm 193-nm 248-nm 200-mm i-line 150-mm 100-mm g-line 1x scan ?

17. The Future of Integration 2002 2012 1982 1992 0.02 1B 50,000 20M 0.001 $0.003 Technology (uM) Transistors MIPS RAM (bytes) Power (mW/MIPS) Price/MIPS 0.8 500K 40 2K 12.5 $0.38 3 50K 5 256 250 $30.00 0.1 180M 5,000 3M 0.1 $0.02 The Greatest DSP Products Haven’t Been Invented Yet DEVICE CAPABILITIES

18. Trends In Technology • Transistors moving from microns to nanometers • Gates per square millimeter going from tens of thousands to hundreds of thousands • Die sizes shrinking from tens of square millimetersto units of square millimeters • Wafer size moving to 300 millimeter • Dies per wafer increasing from thousands per wafer to tens of thousands per wafer • Tooling costs going from hundreds of thousands ofdollars to millions of dollars • Fab cycles increasing from weeks to months

19. The Age of Computing ???? PC Microprocessor Minicomputer TTL/Logic Mainframe Transistors TAM Internet DSP & Analog $500B $100B $10B $1B 1960s 1970s 1980s 1990s 2000s 2010s

20. The Perfect Roadmap One Device Even Fewer Devices Fewer Devices Lots of Devices Time

21. Quiz Who is the only DSP Guru with their picture on a Nation’s Currency?

22. Quiz Who is the only DSP Guru with their picture on a Nation’s Currency?