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HBD upgrade status.

HBD upgrade status. Sasha Milov May 10, 2006. Progress:. Prototype In the IR, in a “dead turtle” position, signals from 2 pads can be seen on the scope.

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HBD upgrade status.

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  1. HBD upgrade status. Sasha Milov May 10, 2006 Sasha Milov DC meeting May 10, 2006

  2. Progress: • Prototype • In the IR, in a “dead turtle” position, signals from 2 pads can be seen on the scope. • Will be moved in the upright position when electronics will become part of PHENIX DAQ partition. Pessimistically may happen on May,31. optimistically: earlier  • Electronics • Chi is working on it, tests look good • Ed Desmond is working on the FPGA code • Electronics looks good on the bench, and first module goes into IR as I speak. • HBD • Very good progress on the pad foils manufacturing at CERN • First foil on its way to WIS, second will be there in a week. • WIS is ready to make a first shipment of GEMs (for six detector modules) SUNYSB is ready to get them. • Equipment is on its way, but not yet here. Sasha Milov DC meeting May 10, 2006

  3. Prototype Prototype is in the IR We see clear signals from 2 pads on the scope, in coincidence with the BBCLL1. Sasha Milov DC meeting May 10, 2006

  4. FEM status • We finish the test the interface with GTM. • We are able to take data through GTM  FEM  DCM (with the new daughter card). • John Haggerty is able to set the FEM running with standalone run control mode. • We did connect the FEM with the HBD preamp board to verify channel mapping between FEM and HBD preamp board • There are still some software/hardware issues need to be fixed at DCM end with the new daughter card. • Need to define GLINKlock and FPGAbooted status flag • Need to pick up event number, clock counter from the data packet • Resolve busy and stop run issues. • Need to get format_id and packet_id etc.. • We are working on that…. • Most of the problems are with the new DCM daughter card at this moment, we will install the HBD FEM system in the IR. Sasha Milov DC meeting May 10, 2006

  5. Pad foil PCB story What am I talking about? Sasha Milov DC meeting May 10, 2006

  6. Pad foil PCB • Special material: 50 micron polymide foil, double clad with 5 micron copper • Large dimensions: 1394 x 630 mm2 • 1150 plated-through holes • Production failed at each of the three production steps: drilling, plating, etching. • The fourth attempt reached the end of the production cycle but two major problems were found: • 172 holes were not properly plated • dimensions were off. This was traced down to a shrinkage of the material during plating and etching • In the fifth production, a scaling factor was introduced during drilling to account for the shrinkage and the plating process was improved. Result: distances were perfect, within tolerances and only 22 holes did not have contact. • The sixth production failed by accident: a tool fallen and damaged the piece • The seventh production was perfect. Sasha Milov DC meeting May 10, 2006

  7. HBD • Pad foils: • Serious problems with the pad foil production have been resolved • One before the last foil has got repairable number of failures • Last foil is flawless • Next foil to arrive from CERN within a week • GEMs • WIS is ready to deliver first bunch of GEMs for six detector modules: 6 meshes, 12 standard GEMs, 6 Au plated GEMs, framed and tested. • SUNYSB is ready to get them and store till production • Back plane electronics: Sasha Milov DC meeting May 10, 2006

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