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Empowering Custom IC Design by cleaning up the mess underneath

Empowering Custom IC Design by cleaning up the mess underneath. Nick English November, 2003. The 30,000 Foot View: A Jungle. IP. B. A. C. B’. Design Community. B. A’. A. A. C’. C. Foundry. Everyone is struggling to find their way. A. B. C. EDA. The 30,000 Foot View: Future.

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Empowering Custom IC Design by cleaning up the mess underneath

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  1. Empowering Custom IC Design by cleaning up the mess underneath Nick English November, 2003

  2. The 30,000 Foot View: A Jungle IP B A C B’ Design Community B A’ A A C’ C Foundry Everyone is struggling to find their way A B C EDA

  3. The 30,000 Foot View: Future IP B A C B’ Design Community B A’ A A C’ C Foundry A design kit standard to serve the custom design community A B C EDA

  4. Components Transistor Diode Res Cap Ind But… Standards? GDSII? HSPICE? Artist? Calibre? Virtuoso? Cadence PDK? Silicon World: 5 Basic Components • Lack of standards at elemental level • Creates huge inefficiencies • Inhibits progress in the custom design world “We’re proposing a stronger foundation”

  5. OK Objective Put a Strong Foundation to the IC Design Process Reduce Redundant Work by Multiple Companies and the Inefficiencies and Nuisances Work in Areas of Minimal Competition Between Vendors Continue Standardization Efforts That are helping the industry

  6. Things to work on • Design function, nomenclature and categories • Design kit elements and formats • Tool & technology fit • Design type and applications • Management of all this stuff • Ownership • Qualification • Revision Control • Distribution

  7. Who Cares? • Designer community • Library & IP developers • Internal DA groups • EDA tool providers • Foundries

  8. 1st Silicon ADA AMIS Artisan AWR Barcelona Cadence Chartered Cira Nova Conexant HPL IC Methods Mentor Motorola National NEC Philips Qualcomm Sagantec Silterra Silvaco Skyworks Sony Synopsys Texas Instruments TSMC Virage Logic OK Participating Companies

  9. OpenKit Technology Reference • 180 - 130nm BiCMOS process technology with copper interconnect • Broad range of supported devices to use in setting standards for all design styles • Initial focus on custom digital design using CMOS devices • Rapidly cover analog and RF by setting standards for the broader set of devices • The roadmap is intended to track the ITRS roadmap with 3 design class & device category releases per technology node.

  10. Version 90nm CMOS See V1.0 V2.0 Add BJT (signal), inductor, Varactor, RF BiCMOS design V1.2 Add poly capacitors, precision devices, DMOS, drain-ext CMOS, BJT(power), Analog design V1.1 180-130nm CMOS, NMOS, PMOS, poly resistor, diodes, MOS and metal capacitors, metal resistors, diodes, Custom digital design V1.0 V1.0 Management, Distribution, Organization, Documentation Standards June ‘04 Dec ‘04 June ‘05 Dec ‘05 OpenKit Roadmap thru ‘05

  11. Time To Take Action • Time to find a better way • Time to stop subscribing to the old beliefs • Time to establish a foundation that everyone can build on • Time to empower the Custom IC designer OK !

  12. Q&A and Invitation Empowering Custom IC Design by cleaning up the mess underneath Nick English nenglish@cox.net 760-522-5966 760-543-5881 fax For more information:

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