1 / 30

Q2 2005 Intel Supplier Review Meeting April 26-28, 2005 Ball Attach BP-3000-HD ASM

Q2 2005 Intel Supplier Review Meeting April 26-28, 2005 Ball Attach BP-3000-HD ASM. Safety. Not major safety issue in past months Safety incidents for 2004 – Key lock bypass A key lock is added to control the by-pass function for the door interlocks

jenna
Download Presentation

Q2 2005 Intel Supplier Review Meeting April 26-28, 2005 Ball Attach BP-3000-HD ASM

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Q2 2005 IntelSupplier Review MeetingApril 26-28, 2005Ball Attach BP-3000-HDASM

  2. Safety • Not major safety issue in past months • Safety incidents for 2004 – Key lock bypass • A key lock is added to control the by-pass function for the door interlocks • Door interlocks can only be by-passed when the lock is switched to by-pass mode and a assess level higher than operator is entered.

  3. Key BP control panel A tag labeled with“DANGER- SAFETY SHIELD INTERLOCK BYPASSED”is affixed to the key Key lock Safety Door Key-lock By-pass

  4. Equipment Overview – PerformanceMachine Uptime in Penang by Intel Getting Stable

  5. Equipment Overview – PerformanceMachine Uptime in Pudong by Intel

  6. Equipment Overview – PerformanceMachine MTBF in Penang by Intel

  7. Equipment Overview – PerformanceMachine MTBF in Pudong by Intel

  8. Equipment Overview – PerformanceReflow Yield in Pudong by Intel Overflow flux damage LM-guide Wiring Broken on Pin-head -motor

  9. Equipment Overview – PerformanceAvailability & Uptime in Costa Rica by Intel

  10. Equipment OverviewMajor Issues and Improvement Plans

  11. Major Issues and Improvement Plans(cont..)

  12. Stopper cannot function on damage tray Problem: High trays jammed and unit drop Root Cause: The tab on tray was damaged and thus stopper sensor cannot detect the tray Impact: MTBA, Up/ Down time.

  13. Containment: Check all the tray tabs by operator before putting tray into the machine. Solution:Extend the existing stopper to detect 2 tabs instead of 1 tab on the tray. Damaged tray with one tab can be stopped and screened / sent to reworked platform. Tested in PG and got positive results.

  14. New stopper Previous stopper Improvement • Modified the stopper to make the stopper can stop 2 tabs in stead of 1 tab.

  15. Wiring Broken / Damage on Heads Problem: X-motor & -motor cables connection on heads was damaged which introducing merge ball after reflow Root Cause: Some of the wiring not tight properly Impact: MTBA, MTBF, UP/Down time. Containment: Replace a new motor. Solution: Reallocated all the wiring mounting on pick/pin heads within 1-2 months Tested Result: Wiring can sustain higher tension & not easy to break, specially protect the connection at connectors

  16. Improvement New Wiring and mounting on Pick-head & Pin-head

  17. Flux overflow at FSU damage LM-guide Problem: FSU sweepers cannot prepare flux properly, flux overflow at FSU & damage the sweepers LM-guide below FSU Root Cause: The flux refill system didn’t work due to extra flux sticking on flux level sensors, operator add too much flux manually cause flux overflow. Impact: MTBA, MTBF, UP/Down time. Containment: Clean up the sensor & reset the flux refill system. Solution: Design new shields below the flux level sensor to prevent extra flux flowing into LM-guide Test result: New shield effectively separates overflow flux and prevent them damage LM-guide of sweeper

  18. Equipment Overview - CIP

  19. Equipment Overview - CIP

  20. 7 columns 3 rows Intel 3x7 tray for Lakeport 3x7 tray handling • Benefit • UPH Improvement, can use Intel original tray • Specification • 3x7 tray with 2mm KOZ (Intel original tray) • Two proposals were sent

  21. 3x7 Tray Handling Proposal • Benefit • UPH Improvement, can use Intel original tray • Proposal Date • 14th April 2005 • Handling Method • “Edge clamping approach” • Dual BP System • One BP will handle 2x7 • Another one will handle 1x7

  22. 3x7 Tray Handling Proposal • Intel concerned on the high risk level (~45% confident level) for handling 3x7 tray with Dual BP system • High risk items: • Recess opening clearance • Package alignment • Package champing force

  23. 3x7 Tray Handling Proposal

  24. Pin #1 Orientation Vision Detection • Benefit • Vision improvement to detect the wrong orientation on specific unit within a tray • Completion date • ww50 2004

  25. On the fly flux replacement module • Benefit • The modified flux refill module is mounted on the fixed cover outside the BP3000, thus when low flux level is detected. User can replace a new syringe of flux without affecting the operation of BP3000 • Completion date • Ww24 2004

  26. On the fly flux replacement module (cont..) • Syringe flux replacement without open safety screen

  27. Service Support Plan for Chengdu

  28. Training • Training Manual • Level 1, 2 & 3 training already reviewed by Intel • Approved & Passed the 20-254 & PBET standard • Training History • All Intel sites already finished L1 & L2 training for key persons. (included process engineers & MTEs) • Sites included: • Penang • Pudong • Cavite • Chandler • Costa Rica • Chengdu (MTEs training in Pudong)

  29. Training (cont..) • Level 3 Training already started on ww14 2005 • Team #1 already finished • Penang (1 Engineer + 1 PM + 2 MTEs) • Pudong (1 PM) • Chengdu (1 Engineer) • Cavite (2 Engineers + 1 PM)

  30. Training Plan • Good feedbacks from the previous training • Satisfied on the training materials. • Candidates want to have more hand-on practices. • Provide more Level 2 training in Chengdu site • Part of the Level 3 training will plan to conduct in Chengdu site to improve the skills of MTEs • Training will mainly focus on Trouble Shooting and Advanced Maintenance

More Related