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Navigating the Literature of Your Field. Janet Fransen Engineering Librarian fransen@umn.edu. With a little help from University Libraries. How do engineering researchers communicate their results?. Sources Cited. Other Sources. Dissertations. Masters Theses. N=47. N=10.
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Navigating the Literature of Your Field Janet Fransen Engineering Librarian fransen@umn.edu With a little help from University Libraries
Dissertations Masters Theses N=47 N=10
Places to Look • Library Catalog (MNCAT) • Licensed Databases (Compendex, Inspec) • Professional Society Databases (IEEE Xplore) • Publisher Web sites (Springer, Elsevier) • Public Databases (Google Scholar) • …and more
Licensed Databases for EE • Inspec • Compendex • Web of Science Search together as Engineering Village
Professional Societies • IEEE (IEEE Xplore) • IEEE and IET journals, transactions, magazines, conferences, standards • SPIE (SPIE Digital Library) • Technical papers from SPIE journals and conferences • Optics and Photonics
Professional Society Databases • Look and act just like other subject databases • Limited to content published by or made available to that society • Find them in the A-Z list or on a Subject page
What about Google Scholar? • Great breadth • Depth varies • Great for finding obscure things like technical reports of papers from proceedings that weren’t published • Great for finding related work by an author
F. Liu, R. R. Yu, A. M. Young, J. P. Doyle, X. Wang, L. Shi, K.-N. Chen, X. Li, D. A. Dipaola, D. Brown, C. T. Ryan, J. A.Hagan, K. H. Wong, M. Lu, X. Gu, N. R. Klymko, E. D. Perfecto, A. G. Merryman, K. A. Kelly, S. Purushothaman, S. J. Koester, R. Wisnieff, and W. Haensch, “A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding,” IEDM Tech. Digest, 599-602 (2008), Proceedings of the 2008 International Electron Devices Meeting, San Francisco, CA, Dec. 15-17, 2008.
F. Liu, R. R. Yu, A. M. Young, J. P. Doyle, X. Wang, L. Shi, K.-N. Chen, X. Li, D. A. Dipaola, D. Brown, C. T. Ryan, J. A.Hagan, K. H. Wong, M. Lu, X. Gu, N. R. Klymko, E. D. Perfecto, A. G. Merryman, K. A. Kelly, S. Purushothaman, S. J. Koester, R. Wisnieff, and W. Haensch, “A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding,” IEDM Tech. Digest, 599-602 (2008), Proceedings of the 2008 International Electron Devices Meeting, San Francisco, CA, Dec. 15-17, 2008.
Now that you’ve found it… How do you keep track of it?
Citation Managers • RefWorks • Free to U of M students, faculty, staff • Web-based • Create an account at our site • Zotero • Free to anyone • Firefox-based UI, local database that can sync to the Web • Download from Zotero.org
Citation Managers • Mendeley • Free • Great for managing and annotating PDFs • Most databases support export to several citation managers
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