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Phase 1 Design System Overview for Pixel Matrix Chip

Preliminary specifications for a low-mass, LVDS-driven chip with clock, JTAG, and power connections. Designed for high-speed digital output at 160 MHz with 640x640 pixel matrix.

josephlpatterson
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Phase 1 Design System Overview for Pixel Matrix Chip

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  1. Phase-1 Design

  2. System Overview • Clock, JTAG, sync marker and power supply connections • Digital output only • 4 data outputs per chip at 160 MHz • 40 LVDS pairs to drive 1 m cable connection • Low-mass system • 10 chips per ladder • Directly bonded on n-layers flex capton • LVDS drivers on chip Phase 1 Andrea.Brogna@IReS.in2p3.fr

  3. Preliminary specifications • Process 0.35 µm (AMS c35b4/opto) (3.3 V ± 0.3 V) • Matrix of 640 x 640 pixels with 30 µm pitch • Raw digital output without zero suppression • JTAG control for configuration and testing • Internal bias DACs • 2 levels of multiplexer: • Low speed (40 MHz for test) and High speed (160 MHz) • Bonding pad location at the bottom edge • Analog test pads (~ 100µm x 100µm) on the top edge • Area estimation 19.5 mm x 21.0 mm Phase 1 Andrea.Brogna@IReS.in2p3.fr

  4. Chip floor-plan • Ex. FRDO = 160 MHz • Discriminator frequency = 1 MHz • In pixel frequency = 16 MHz • Integration time = 640 µs 19500 µm 21000 µm Integration time = 160 / FRDO x 640 Phase 1 Andrea.Brogna@IReS.in2p3.fr

  5. Mimosa22 background Reuse the experience and building blocks of M22 • Best suitable pixel to be chosen from M22 test • Digital control logic • Pixel scan => resized to 640 rows • Pattern generator => OK • JTAG interface => markers for synchronizations • Output multiplexer with fast/slow outputs • not present in M22 -- NEW DESIGN • Improved Testability for digital and analog blocks • 2 registers for test patterns at the discriminator level • characterization of pixel matrix Phase 1 Andrea.Brogna@IReS.in2p3.fr

  6. Critical points and chip testability • High speed output @160 MHz • Synchronization among the chips in the ladder • Internal generation of markers + frame counter • How to recovery if chips are out of sync (adding more pins) • LVDS pads drive 1m of flex cable • Power consumption • Static: ~ 400 mW • Dynamic: ~60mW (serializ.); 110 mW (6 x LVDS TX); 8 mW (LVDS RX); • Testability based on M22: • Digital: + additional synchronization markers • Analog information from groups of 8 columns of pixels Phase 1 Andrea.Brogna@IReS.in2p3.fr

  7. Phase-1: I/O • ~ 50 signals (7 LVDS pads included) • Standard CMOS pads for low speed outputs • ~ 50 power supply lines • Two bonding per I/O to facilitate probe testing • Analog outputs (8 pads) on top edge for testing purpose • More detailed list later… Phase 1 Andrea.Brogna@IReS.in2p3.fr

  8. 8 8 8 Analog Test for Pixel Matrix In normal mode the shift register is disabled. The first 8 columns are read continuously. 8 Analog Outputs 8 Analog Multiplexer 180 (8640) 80 Shift Register (80 bits) In scan mode the shift register is enabled: groups of 8 columns are read after the read of 640 lines. Pixel array 640x640 640 Discriminators Phase 1 Andrea.Brogna@IReS.in2p3.fr

  9. Serializer • Mux 160:1 • 4 intermediate outputs at low-speed for test • Scrambled data at the fast output • Latency • 25.0 ns for low speed output • 6.25 ns for high speed output Phase 1 Andrea.Brogna@IReS.in2p3.fr

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