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Overview of MAPS detectors

Overview of MAPS detectors. Fergus Wilson Rutherford Appleton Laboratory (with lots of input and slides from Renato Turchetta and the RAL Sensor D esign G roup) Vertex 2015, Macha Lake, Czech Republic, 15-19 Sep 2014. Outline. Outline Introduction to Monolithic Active Pixel Sensors

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Overview of MAPS detectors

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  1. Overview of MAPS detectors Fergus Wilson Rutherford Appleton Laboratory (with lots of input and slides from Renato Turchetta and the RAL Sensor Design Group) Vertex 2015, Macha Lake, Czech Republic, 15-19 Sep 2014

  2. Outline • Outline • Introduction to Monolithic Active Pixel Sensors • Some non-HEP and commercial uses (and why they matter). • On-going and future HEP MAPS projects and detectors. • Overlapping presentations: • PXL at STAR: M. Szelenicak/M. Simko(poster) • ALICE ITS upgrade: F. Reidt • ATLAS pixels: J. Grosse-Knetter • HV-CMOS: D. Muenstermann • Workshop on CMOS Active Pixel Sensors for Particle Tracking (CPIX14), Bonn, 15-19 Sept • 3 days, 37 talks • I’ll do it all in 25 minutes… Fergus Wilson, RAL/STFC

  3. CMOS Monolithic Active Pixel Sensors • First invented in the 60’s but CCDs much better then. • Re-invented at the beginning of 90s: JPL, IMEC, • Standard CMOS technology. • All-in-one detector-connection-readout – Monolithic. • Small size / greater integration. • Low power consumption. • Low noise. • Radiation resistance. • System-level cost. • Increased functionality. • Increased speed. • Increased readout speed (parallel processing). • Region of interest readout. • Etc… Fergus Wilson, RAL/STFC

  4. Charged Particle Detection Deep p-well: enhances charge collection, allows enhanced pixel structures Thin epitaxial layer: shorter collection times, less multiple scattering, less chance of charge capture High-resistivity epitaxial layer: improved signal to noise. Guard rings: improve resistance to radiation damage. High-resistivity epitaxial layer + low voltage bias (HR-CMOS): charge collection by drift, faster, radiation hardness High voltage bias (HV-CMOS): charge collection by drift, faster, radiation hardness Fergus Wilson, RAL/STFC

  5. Active pixels and In-Pixel electronics Correlated Double Sampling (CDS), reduced noise Passive Active No need to stop at 4T… Move as much processing as you can on to the pixel Fergus Wilson, RAL/STFC

  6. Fabrication and Stitching. 56 mm 56 mm D B B D C A A C Reticle size is just over 2cm x 2cm  ‘stitching’ Reticle is subdivided in blocks C A A C D B B D Fergus Wilson, RAL/STFC

  7. Beyond Particle Physics • MAPS have penetrated other science areas more quickly than particle physics. • Commercially attractive (high yields, low cost). • Many overlaps with particle physics requirements: • Radiation tolerance - Cost • Small and large pixels - Reliability • High Speed • Quantum efficiency • High dynamic range • Low power • But particle physics detectors want them all ! Fergus Wilson, RAL/STFC

  8. Transmission Electron Microscopy (TEM) Slide taken from D. Contarato, LBNL, 2012 Fergus Wilson, RAL/STFC

  9. Detection of electrons inCMOS Single electron detection Good event Energy contained in one pixel Bad event Fergus Wilson, RAL/STFC

  10. 61x63 mm2 silicon area (4 dies per wafer) • 0.35mm CMOS • 16 million pixels, 4Kx4K array • 14 µm pixels • 32 analogue outputs, 10 Mpixs/sec • 40 fps • Pixel binning 1X, 2X and 4X • ROI readout • 83 e- rms noise • Full well 120ke- • Radiation hardness of >500 million of primary electrons/pixel (>20 Mrad) • 20% QE for visible light www.fei.com Novo virus Achilles: a 16Mpixel sensor for TEM Fergus Wilson, RAL/STFC

  11. Wafer-scale sensor for X-ray medical imaging • Motivations • Extra-oral dental, mammography, chest imaging, security,… • Requirements • High yield (commodity item). • Radiation hard: • Very large sensors: • Wafer scale sensor. • One sensor per 8”/20cm wafer • 3-side buttable – 2 x N tilling • Lassena characteristics • 6.7 Mpixels; 30 fps; 50µm pixels; Low noise: 68 e- • Large area: 3-side buttable to cover any length with 28 cm width • Binning x2, x4; Region-of Interest readout • High dynamic range, multiple programmable integration times Fergus Wilson, RAL/STFC

  12. Photon Science - Percival Pixelated Energy Resolving CMOS Imager,Versatile and Large Fergus Wilson, RAL/STFC

  13. Percival soft x-ray imager • Design goals • Back-thinned • 4k x 4k pixels • 120 fps (digital CDS) • High dynamic range (4 gains per pixel) • 2*105 photons @ 250 eV • ~120dB or full well >10 Me- • 12+1bit ADC • 15 bits per pixel (2 gain bits + 13 bits) • Digital I/O (LVDS) • 60 Gbit/sec continuous data rate Multi-level row control Pixel array4kx4k @25µm pitch) SPI and bias generator 28,000 ADCs (7 ADCs per column) 210x160 25µm pixel prototype under front illumination at DESY Serialiser and LVDS I/O Fergus Wilson, RAL/STFC

  14. Time-Of-Flight Mass Spectroscopy • Separate chemical species by (mass/charge) ratio and identify where they are in the specimen • Requirements: • Timing information • Spatial Information Courtesy of A. Nomerotski et al., Oxford University Fergus Wilson, RAL/STFC

  15. PImMS family PImMS camera PImMS2: 324 x 324 pixels PImMS1: 72 x 72 pixels • 70 um x 70 um pixels • 25 ns time resolution (12.5ns has been demonstrated). • Continuous 40 Mfps for 100µs. • 4 events can be stored in each pixel. • 12-bit time-code resolution. • Each pixel can be trimmed. • Analogue readout of intensity information. • Equivalent pixel rate for a standard full frame camera 2 x 1012 pixels/sec Looks a bit like Linear Collider specs… )/ Fergus Wilson, RAL/STFC

  16. Ultra-high speed uCMOS - Kirana Looks a bit like Linear Collider specs… High resolution: 924 x 768 30µm pixels Die size 32.5 x 25.5 mm. In-pixel storage and Correlated Double Sampling (CDS). Burst mode: 180 frames at 5 MHz. Continuous mode: 1180 fps. Noise: <10e-; full well: 11,700 e- Commercialised (Specialised Imaging) Fergus Wilson, RAL/STFC

  17. Performance summary Fergus Wilson, RAL/STFC

  18. MAPS HEP progression Linear Collider (20??) STAR PXL (now) mu3e (2015) ALICE ITS (2018) ATLAS Tracker Phase II? (2023) 0.16 m2 1.9 m2 10 m 2 ~100? m2 Vertexer ? Tracker ? Digital Calorimetry ? Where is MAPS being proposed? Fergus Wilson, RAL/STFC

  19. STAR PXL at RHIC • Design: LBNL, UT at Austin; PICSEL group, IPHC, Strasbourg • See M Szelezniaktalk and M Simko poster. PRELIMINARY PRELIMINARY Fergus Wilson, RAL/STFC

  20. μ3e at PSI • µ→eee lepton flavour violation • 109muon decays/s. Low Pt tracks, resolution dominated by multiple scattering. • 4 layers 80x80m2 pixel size, 275 MP • Thin <50µm.180nm HV-CMOS. • Fast charge collection by drift. • Power consumption 7.5 µW/pixel 3mm • MuPixdesign: Heidelberg, PSI, Zürich, Genf Fergus Wilson, RAL/STFC

  21. μ3e at PSI: recent DESY test-beam results • Recent DESY test beam results (MuPix4): • Timing resolution 18ns • Track residuals: 28µm • Hit efficiency > 99% Fergus Wilson, RAL/STFC

  22. ALICE Inner Tracker System Upgrade • Many competing/collaborating architectures: • MISTRAL/ASTRAL (IPHC), Cherwell (RAL), • ALPIDE (CCNU/CERN/INFN/Yonsei) Also being considered for forward tracker • See Felix Reidt talk Fergus Wilson, RAL/STFC

  23. ATLAS Phase II Tracker A hybrid MAPS ? • See Daniel Muenstermann talk • Challenges • 200 bunches in pile-up, increased particle densities. (1-2 GHz/cm2) • Increased radiation damage (2 x 1016neq/cm2) • Increased power requirements. • Reduced material required. • Pixel+microstrip still the baseline but have ~2-3 years to show that CMOS could be viable technology. • Strips -> elongated pixels. • MAPS with HV-CMOS or HR-CMOS for radiation hardness and speed. • MAPS not the only candidate: thin planar silicon, diamond, 3-D detectors… Fergus Wilson, RAL/STFC

  24. Vertexing and Tracking for Linear Collider • Example of MAPS performance • Cherwell sensor. • 99.7% hit efficiency. • 3.7μm hit resolution. • Power pulsing. See S.RedfordCLIC, A.Besson ILC • Pixels are a baseline technology for CLIC/LC vertexing; could become baseline technology for tracking. • CLIC detector development has been progressing; LC development has been on hold for ~6 years. • But CLIC and ILC have very different bunch structures. • ILC: 5Hz, 2625 bunches in 1ms followed by 199ms gap. • CLIC: 50Hz, 312 bunches, 0.5ns between bunches, 20ms gap. • MAPS (Mimosa, Chronopixels, LBL, INFN ...), clixpix, CCD, ISIS, DEPFET, SoI, 3D,… Fergus Wilson, RAL/STFC

  25. Digital Calorimetry for Linear Collider • TPAC sensor: • 168 x 168 pixels • 50x50μm • Digital readout • Sample every 400ns An alternative to silicon wafers or scintillators. Results from TPAC chip in CERN test beam. Shows correct behaviour as function of energy. Demonstrates DECAL/MAPS concept validity T.Price, Birmingham, 2013 Fergus Wilson, RAL/STFC

  26. Conclusions. • MAPS are already commercially available. • MAPS have already penetrated non-HEP areas • Medical, photon science, space, X-rays, neutron, lasers,… • In HEP • Capabilities proven at STAR. • Soon to be used in μ3e vertex detector. • Expect to see used in a tracker in ALICE ITS, Forward Tracker. • Already seeing radiation hardness and speeds (not to mention power consumption, material thickness, cost, …) that are suitable for LHC phase II upgrades • MAPS an excellent candidate for LC/ILC vertex detectors and trackers. Fergus Wilson, RAL/STFC

  27. Backup Fergus Wilson, RAL/STFC

  28. Kirana pixel. 1 • Photodiode • Memory bank • A vertical entry (VEN) bank with 10 cells • Ten rows of lateral (LAT) banks, each with 16 cells • A vertical exit (VEX) bank with 10 cells • Total of 180 memory cells Fergus Wilson, RAL/STFC

  29. Kirana pixel. 2 • Highly scalable architecture: • Number of memory cells • Number of pixels Fergus Wilson, RAL/STFC

  30. Burst mode • Vertical transfers x10 @ full speed Fergus Wilson, RAL/STFC

  31. Burst mode • Charge moved into lateral memory bank Fergus Wilson, RAL/STFC

  32. Burst mode • Ten more vertical transfers Fergus Wilson, RAL/STFC

  33. Burst mode • Lateral transfer x1 @ full speed / 10 Fergus Wilson, RAL/STFC

  34. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  35. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  36. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  37. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  38. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  39. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  40. Burst mode • … and so on, seamless Fergus Wilson, RAL/STFC

  41. Burst mode Fergus Wilson, RAL/STFC

  42. Burst mode • Charge in the vertical exit registers is dumped in the reset node … • … until receipt of the trigger. The status of the memory bank is then frozen and the sensor read out. Fergus Wilson, RAL/STFC

  43. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  44. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  45. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  46. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  47. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  48. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  49. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

  50. Continuous mode • Memory bank acting simply like a delay line Fergus Wilson, RAL/STFC

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