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Air based self-assembly of silicon chips on foils

Air based self-assembly of silicon chips on foils. Name: B. van Leeuwen Coach: Dr.Ir. M. Tichem Professor: Prof.dr. U. Staufer Specialisation: Production Technology Concern: Holst Centre Coach: Prof. Andreas Dietzel, PhD Date: 08-07-2009. Contents. Introduction Holst centre

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Air based self-assembly of silicon chips on foils

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  1. Air based self-assembly of silicon chips on foils Name: B. van Leeuwen Coach: Dr.Ir. M. Tichem Professor: Prof.dr. U. Staufer Specialisation: Production Technology Concern: Holst Centre Coach: Prof. Andreas Dietzel, PhD Date: 08-07-2009

  2. Contents • Introduction • Holst centre • Micro assembly • Problem description • Simulation • Dynamic simulation using COMSOL • Dynamic simulation using Matlab • Practical test • Test setup • Test results • Applicability • Results

  3. Introduction Holst centre • Joint venture of TNO and IMEC-NL • Research in future products • System-in-foil: Low cost, flexible electronics which can be integration in disposable every day products Source: Holst Centre

  4. Introduction Problems appearing in micro assembly: Scaling effect  sticking effect Gripping and grasping difficult (delicate parts): Solution  Self-assembly Self-assembly: Processes in which a disordered system of pre-existing components forms an organized structure or pattern. (http://en.wikipedia.org/wiki/Self-assembly) Self-assembly can be based on different physical phenomena: For example: Mechanical, Fluidic or Gas based processes Micro assembly

  5. Problem description Context • Intelligent package, produced on roll-to-roll production • Placement of flexible chips on flexible foil • Chip placed on first foil, than laminated with second foil • First foil makes placement possible • Second foil takes care of electrodes and connections

  6. Problem description Context • Multi scale issue (large foil, small chips, accurate positioning) • Ultra low cost, high volume production process Solution: Coarse placement followed by self-assembly • Only air based assembly treated

  7. Problem description Context • Air flow based self-assembly • Holes in foil will allow air through foil by backside overpressure. • Velocity gradient above surface of foil. • Chip will float and drift to final target location. • Different designs possible • Main problem • Design a foil in a way that: the chip drift to the target location by airflow

  8. Simulation Dynamic simulation using COMSOL and Matlab • 2D FEM simulation, solving the Navier-stokes equations using COMSOL. • For different foil designs (velocity profiles) • Obtaining static data • 2D motion, solving the equations of motion using Matlab. • Data form COMSOL stored in lookup tables • Motion calculated using ODE solver • Motion displayed

  9. Simulation Dynamic simulation using COMSOL The inlet velocity is imposed at the lower boundary and is defined by the friction of the nozzles:

  10. Simulation Dynamic simulation using COMSOL Static simulation implemented for a certain chip position

  11. Simulation Dynamic simulation using Matlab • Storing the obtained data lookup tables, dependent on x, y and φ • Multiple lookup tables for: • Forces and moments • Different velocity profiles. • Not all angle, y-position combinations possible because of geometry

  12. Simulation Dynamic simulation using Matlab The equations of motion can now be formulated

  13. Simulation Dynamic simulation using Matlab Solving the equations of motion leads to the moving chip.

  14. Practical test Test setup Features of test setup • Overpressure in box by fan • Foil attached on top • Pressure measurement for feedback • Events observed by camera

  15. Practical test Test results

  16. Applicability Practical applicability • Integration possibilities • Chip supply • Chip alignment • Chip fixation

  17. Results • Working simulation software • Dynamic simulation using an array of static FEM calculations • Practical proof of concept • Design and build of test setup • Successful testing of foil design • Practical applicability • Possible integration with other production steps • Manny possibilities

  18. End of slide show, click to exit.

  19. Simulation (backup slide) Dynamic simulation using COMSOL Lookup tables for damping in y-direction: • New forces calculated with initial speed • New force subtracted from force without initial speed • Force linearization round zero becomes damping force

  20. Calculation (backup slide)

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