Corporate Presentation HEAD Electronics BV

1. CorporatePresentationHEAD Electronics BV • Presentation of HEAD Electronics BV

2. History-Culture • • SupplierOverview • History Culture • Founded in 1987 by our director A. van Leeuwen • Company privately held • HEAD = Holland Electronics Advanced Development • Started as component shop + design engineer • Customer needs leads to grow in capabilities and in organisation • Nowadays Electronic Manufacturing Services Company as a One Stop Shop for Industrial Electronics • 45 employees, incl. partime • Informal, flat structured organization, documented processes and improvements

3. Memberships • • SupplierOverview• History Culture • FHI: Federatie Het InstrumentExhibition Electronics & Automation 2003 – 2012 • Nevat: Nederlandse Vereniging Algemene Toelevering Member andsecretary of the Technology-taskforce Managing the website forTechnology-taskforce

4. Product Offerings • SupplierOverview• Product Offerings

5. One Stop Shop • From idea to product • Product-redesign and - engineering • Purchasing of components • PCB work preparation and purchasing • Assembling of SMD and THT (trough hole) • Prototyping, pre-production, series production • Assemble in housing or system, cabling • In-house testing of product and CE-EMC • Deliveries on call (JIT) and as series • Logistics, warehouse, outscoursing • Service, upgrades and customer repairs • • SupplierOverview• Product Offerings

6. Locations, Geografic • • SupplierOverview• Locations, Geografic HEAD Electronics BV Ambachtsweg 172222 AH Katwijk zhTel. +31 (0)71 - 40 29 154Fax. +31 (0)71 - 40 30 091

7. Markets served • SupplierOverview• Markets Served - Products & Geographic

8. Customer Service Capabilities Chooseyourownmenu… • Project definition • Electronics development / Design • Project management / engineering support • Assembling of electronics • Mechatronics, wiring, coating etc. • Testing, test engineering • Logistics • After sales • Prototypes • • SupplierOverview • Customer Service Capabilities • Menu

9. Customer Service Capabilities • • SupplierOverview • Customer Service Capabilities • Menu explained • Project definition(product, specification, planning etc) • Electronics development / design (by customer and/or HEAD) • Project management / engineering support (workpreparation PCB & BOM, documenting, overall view, etc) • PCB assembly (SMD, THT, manual soldering, etc.) • Mechatronics(total assemblies, wiring, coating etc.) • Testengineering (AOI, EMC, X-rayetc) • Purchase & Logistics(forecast, purchasing, storage, consignment, etc.) • After sales (upgrades, changes, customer repairs, etc) • Prototyping & pre-production(hand + machine & machine)

10. Project Definition • • Manufacturing• Capabilities • Menu • Project Definition • Defining a project (enquiry, requirements, specs, etc) • Calculation(BOM, labour, machine costs, etc) • Specification(PCB, BOM, etc.) • Planning (lead times) • Purchasepreparation(BOM + planning in MRP) • Terms & conditions(general, planning, warranty, payments, etc) QUOTATION + ORDER + ORDER CONFORMATION

11. Project Definition - RFQ • Manufacturing• Capabilities • Menu • Project Definition • RFQ

12. Electronics Development • • Manufacturing• Capabilities • Menu • Development / Design Fromideatofunctioning product Balancingdevelopment vs. product costs • Specification • Hardware • Embedded software • Availability of components • Costpricecomponents • Productionfriendly • Programming & testing • CE, EMC pre-compliant • Workingprototype • TPD Technical Product Documentation

13. Project Management • • Manufacturing• Capabilities • Menu • Project Management • General Customer partnership • Operations management • Project management • Quality management • Work preparation PCB/BOM • Documentation in AEGIS • Logistics, purchase, storage • Outsourcing • Planning, controlling • Cost control, invoicing

14. WorkPreparation PCB • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation PCB Panellizing and specification before purchasing: • PCB data • Multilayer PCB • Panelizationwith CAM350 • Design/edit with Pulsonics • Own internet tool for PCB specification • Enquire PCB-quotations • Prepare purchase of PCB’s

15. WorkPreparation BOM • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation BOM

16. WorkPreparation Machines • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation Machines

17. WorkPreparationDocumentation • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparationDocumentation (MOS) Documentation in AEGIS MOS = Manufacturing Operations Software

18. Floor Documentation • • Manufacturing• Capabilities • Menu • Project Management • Floor Documentation Shop Floor paperless by AEGIS

19. Electronics AssemblingSurfaceMountedDevices • • Manufacturing• Capabilities • Menu • Electronics Assembling • SMD Fast, flexibleand accurate • Samsung CP 411-421 series SMD • Placing SMD-components to 0402 • Finepitch QFP 0,4 mm • Finepitch (µ)BGA • Preparedfor intelligent feeders • Up to 60k components / hour • SoltecMy Reflow 10 zone Reflow Oven • DEK Horizon 2 screenprinter

20. Electronics AssemblingSurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD Close up

21. Electronics AssemblingSurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD Barcode

22. Electronics AssemblingSurfaceMountedDevices C1608-560pF C1608560PF9907141301 C1608-560pF C1608560PF9907141301 • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD network DATABASE SERVER ETHERNET (TCP/IP) PART-STATION MACHINE FEEDER-STATION DeviceNet SM FEEDER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER Feeder ID Reading Feeder Event (insert, remove, …) DOCKING-CART

23. Electronics Assembling Conventional Components • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Component preparation as cut, bend etc. • Placing of all remaining components • Soldering of the leaded components • End-assembling, built in housings • Programming and loading of software • Routine testing • Packing, labeling

24. Electronics Assembling Conventional Components • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Close up

25. Electronics AssemblingWave Soldering • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Wave Soldering • Wave soldering N2 with the Soltec “Deltawave” (leaded) • In-line wave soldering N2 met EPM IBL (RoHS)

26. Electronics Assembling Selective Soldering • Selective soldering with the Soltec My Selective 6745 (RoHS) • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Selective Soldering

27. Electronics Assembling Mechatronics / Total Assembly • Cleaning of PCB’s • Coating of PCB’s • Potting of PCB’s • Cabling in house or outsourced • Total assemblies, housing, 19” racks etc. • Burn-in test • • Manufacturing • Capabilities • Menu • Electronics Assembling • Mechatronics

28. Electronics Assembling Cleaning & Coating • Manufacturing • Capabilities • Menu • Electronics Assembling • Mechatronics • Cleaning & Coating

29. Test, Test Engineering • • Manufacturing • Capabilities • Menu • Test, Test Engineering • PCB: Visual, probe tester, sleeves /microscope • SMD: AOI (Viscom), X-ray (Dage 2 M pixel) • CE- precompliant EMC • Product: Visual, Functional, In-circuit, self-test, climate-test • Realizationof project test tools withcustomers

30. Logistics - Storage • • Manufacturing • Capabilities • Menu • LogisticsStorage • Year order, rolling forecast, MRP • Purchasing and incoming goods • Identification / inspection (ATEX) / part storage • Packing following instructions, ESD measures • Storage half and end products, consignation

31. Logistics - Transportation • • Manufacturing • Capabilities • Menu • LogisticsTransportation • Just in time, track and trace • Destinations to customer and endcustomer • Transportation boxes with UPS in NL, UK (Europe) • Pallet Benelux with Wesseling Transport Sassenheim • Worldwide via expedition centres, airport etc.

32. After Sales Service • • Manufacturing • Capabilities • Menu • After Sales Service • After sales service, upgrades, customer repair • For hard- and software • During the lifecycle of your product • Redesign and use of other/newer parts • Spare parts, obsolete part replacements

33. Series / Proto Types • • Manufacturing • Capabilities • Menu • Series / Proto Types • Productionseries • Midserie 100 - 50k pcb’s • Pre-productionseries 10 - 100 pcb’s • Prototypes 1-10 pcb’s • Prototyping • Manual • Partly SMD-line • Paste stencil + reflowoven • Withcomponents from the series or specificsmall volume PO’sfromFarnell, Digikey etc.

34. Quality Management • • Manufacturing • Quality Management • ISO 9001: 2008 accredited management system Scope Head Electronics BV: “Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products”. • Quality manual: • MSH Head electronics • IPC 6XX / IPC 4101B: • Bare Printed Circuits Boards • Assembling of PCB’s • Cabling • Repair activities • EU-Regulations: • RoHS, REACH by Manufacturer (assembling) • (CE/ WEEE) by Producer (market)

35. Your contact persons • • HEAD • Contactpersons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BVAmbachtsweg 172222 AH Katwijk ZHtel.: +31 31-4029154fax.: +31 71-4030091e-mail: info@head.nl Internet: www.head.nl

36. Next steps ……. • HEAD • Next Steps …… MovingaHEADforyou!