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Preamplifiers in 3D Technology EM manufacturing Part list and component Lot Acceptance Tests

Preamplifier Integration in 3D PLUS Technology. Preamplifiers in 3D Technology EM manufacturing Part list and component Lot Acceptance Tests FM manufacturing Schedule. Preamplifier Design & Characteristics. The Amplifier module. Electrical characteristics : 77 dB Gain

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Preamplifiers in 3D Technology EM manufacturing Part list and component Lot Acceptance Tests

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  1. Preamplifier Integration in 3D PLUS Technology • Preamplifiers in 3D Technology • EM manufacturing • Part list and component Lot Acceptance Tests • FM manufacturing • Schedule

  2. Preamplifier Design & Characteristics The Amplifier module • Electrical characteristics: • 77 dB Gain • Bandwidth 0.2mHz to 6 KHz • low noise • Feedback • Mechanical characteristics: • 2 amplification levels • 3 radiation shielding levels • PGA • Dimensions: 20 x 20 x 15 (mm) • Weight : 15 g Amplifier Module Layout

  3. Preamplifier Design & Characteristics The Regulator module • Electrical characteristics: • Input : +/- 10V • Output : + 7.6 V, -6.6V • Resistor network for Calibration • Mechanical characteristics: • 1 power supply regulator layer • 1 calibration layer • 2 radiation shielding layers • PGA • Dimensions: 20 x 20 x 14 (mm) • Weight : 12 g Regulator Module Layout

  4. Engineering Models EM flowchart • For the THEMIS mission, 3D PLUS had to manufacture : • 1 Regulator Engineering Model • 3 Amplifier Engineering Models • The EM manufacturing is finished, the 4 modules were delivered to CETP in March • Main steps of EM manufacturing are :

  5. Engineering Models Flex Assembly & Test Flex assembly Power supply level Test procedure : Ref. THEPA_QUAL_11 written by CETP Tests took place at 3D PLUS with CETP support * The Glob Top consists in covering wire bonding with resin to protect them. All tests are recorded in 3D PLUS data base (date, nb of parts, kind of test, operator, part FAIL or PASS…)

  6. Engineering Models Manufacturing & Test Module manufacturing according to PID Test procedure : Ref. THEPA_QUAL_13 written by CETP Tests took place at 3D PLUS with CETP support • Module screening : • Stabilization bake, 72 hrs at +125°C • 10 Thermal cycles –55°C / +125°C • Electrical test at 3 temperatures : - 40°C, Tamb, + 65°C • Final visual inspection with dimensional measurement The test board is placed in an oven for temperature tests

  7. Engineering Models Conclusion • The EM modules are compliant with specification (mechanically & electrically) • The EM manufacturing allowed us : • To validate the design • To validate the tools • To finalise the test procedures

  8. FM Part List 30 references 7 references 9 references Some components were procured by CETP and others by 3D PLUS according to 3D PLUS procedure ref: 3DPA0350.

  9. FM Part List 30 references The first lot, received in December was rejected at visual inspection 7 references Components used in EM modules will be also used in FM modules, at the exception of 3 references: LM108A, 1 resistor and 1 capacitor. 9 references

  10. Lot Acceptance Test • For all components the following tests are performed : • Visual Inspection • Solderability test, Lead Integrity and Lead Finish Adhesion • Lot Acceptance Test • Electrical test at Tamb • 1000hrs life test at 125°C (under polarization) • Electrical tests at –55°C, Tamb, +125°C • Drift calculation at Tamb • LAT are performed in partnership with LCIE, according to 3D PLUS Procedure 3DPA0350-4 • LAT report : 3300-1085-1 * Bare die are mounted in a TO39 package to facilitate tests ** 1 Fail after 240 hrs. The procedure 3DPA0350 (based on standard ESCC-Q-60-05) authorized 1FAIL for 20 parts

  11. FM manufacturing • For the THEMIS mission, 3D PLUS has to manufacture : • 7 Regulator Flight Models (5 FM, 1 spares, 1 LAT) • 19 Amplifier Flight Models (15 FM, 3 spares, 1 LAT)

  12. FM Schedule The key dates during FM manufacturing are : Flex Assembly & Tests Pre Cap Inspection Module Assembly & Tests Screening LAT module To : 04/05/04 Week 21 End of June 07/23/04 09/30/04 FM delivery to CETP EIDP

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